Manufacturing method of light-emitting device

Patent metadata

Field	Value
Publication number	US-RE49645-E
Application number	US-202117145852-A
Country	US
Kind code	E1
Filing date	Jan 11, 2021
Priority date	Apr 28, 2016
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.

First claim

What is claimed is:

1. A method of manufacturing a light-emitting device, the method comprising:
providing a base body including a base section and a wall section extending upward from the base section;
providing an optical member comprising a plurality of lens sections arranged in a matrix pattern, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view;
fixing a plurality of semiconductor laser elements on an upper surface of the base section; and
fixing an optical member above an upper surface of the wall section, such that the optical member is located above the base body, wherein the step of fixing the optical member comprises:
interposing an adhesive between the upper surface of the wall section and a lower surface of the non-lens section of the optical member either before or after adjusting an inclination, a height, and a planar position of the optical member, and
subsequently, curing the adhesive such that a height of the adhesive compensates for dimensional variances of the optical member;

wherein, in the step of fixing the optical member, the planar position of the optical member is adjusted by performing steps comprising:
for each of the plurality of lens sections, determining a deviation angle formed between an optical axis of light emitting from the lens section and a reference axis,
determining an average value of the determined deviation angles, and
adjusting the planar position of the optical member such that the average value of the determined deviation angles is close to 0.

2. The method according to claim 1 , wherein:
the wall section surrounds a first region of the upper surface of the base section,
in the step of fixing the plurality of semiconductor laser elements, the plurality of semiconductor laser elements are fixed on the upper surface of the base section inside the wall section,
the method further comprises, between the step of fixing the semiconductor laser elements and the step of fixing the optical member, fixing a lid body on an upper surface of the wall section, the lid body including one or more light-transmissive sections, the one or more light-transmissive sections being configured to transmit light emitted from at least one of the semiconductor laser elements.

3. The method according to claim 1 , wherein the plurality of lens sections of the optical member are two-dimensionally arranged in the top view.

4. The method according to claim 3 , wherein the adhesive is a photocurable adhesive.

5. The method according to claim 4 , wherein, in the step of fixing the optical member, the adhesive is interposed between the base body and the non-lens section after adjusting the inclination, the height, and the planar position of the optical member.

6. The method according to claim 5 , wherein:
the non-lens section of the optical member includes a plurality of injection holes for injecting the adhesive, and
in the step of fixing the optical member, the adhesive is interposed between the base body and the non-lens section by injecting the adhesive through the injection holes.

7. The method according to claim 4 , wherein:
the non-lens section of the optical member includes a through-hole,
the adhesive is an adhesive containing organic matter, and
in the step of fixing the optical member, the adhesive is interposed between the base body and a region of the non-lens section that is farther away from the plurality of lens sections than the through-hole in the top view.

8. The method according to claim 7 , wherein, in the step of fixing the optical member, the adhesive is interposed between the base body and the non-lens section in a region spanning an entire outer peripheral portion of the optical member in the top view.

9. The method according to claim 4 , wherein:
the adhesive is an adhesive containing organic matter, and
in the step of fixing the optical member, the adhesive is interposed between the base body and the non-lens section in a region excluding a part of an outer peripheral portion of the optical member in the top view.

10. The method according to claim 9 , wherein:
the lid body includes a recess that is recessed toward the base section inside the wall section, and
in the step of fixing the optical member, the optical member is fixed to the base body via the lid body such that a part of an outer peripheral portion of the optical member is positioned inside the recess in the top view.

11. The method according to claim 10 , further comprising fixing a plurality of light-reflecting members on the upper surface of the base section.

12. The method according to claim 11 , wherein each of the light-reflecting members is configured to reflect light emitted from a respective one of the semiconductor laser elements toward a respective one of the plurality of lens sections.

13. The method according to claim 12 , wherein, in the step of fixing the lid body, the lid body is fixed on the base body by welding.

14. The method according to claim 4 , further comprising fixing a plurality of light-reflecting members on the upper surface of the base section, each of the light-reflecting members being configured to reflect light emitted from a respective one of the semiconductor laser elements toward a respective one of the plurality of lens sections.

15. A method of manufacturing a light-emitting device, the method comprising:
providing a light source unit including:
a base body having a base section and a wall section surrounding a first region of an upper surface of the base section and extending upward from the upper surface of the base section,
a plurality of semiconductor laser elements fixed on the upper surface of the base section inside the wall section, and
a lid body that includes one or more light-transmissive sections, the one or more light-transmissive sections being configured to transmit light emitted from at least one of the semiconductor laser elements, the lid body being fixed on an upper surface of the wall section;
providing an optical member comprising a plurality of lens sections arranged in a matrix pattern, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view; and
fixing an optical member above the upper surface of the wall section, such that the optical member is located above the base body, wherein the step of fixing the optical member comprises:
interposing an adhesive between the upper surface of the wall section and a lower surface of the non-lens section of the optical member either before or after adjusting an inclination, a height, and a planar position of the optical member, and
subsequently, curing the adhesive such that a height of the adhesive compensates for dimensional variances of the optical member;
wherein, in the step of fixing the optical member, the planar position of the optical member is adjusted by performing steps comprising:
for each of the plurality of lens sections, determining a deviation angle formed between an optical axis of light emitting from the lens section and a reference axis,
determining an average value of the determined deviation angles, and
adjusting the planar position of the optical member such that the average value of the determined deviation angles is close to 0.

16. The method according to claim 15 , wherein the adhesive is a photocurable adhesive.

17. The method according to claim 16 , wherein the plurality of lens sections of the optical member are two-dimensionally arranged in the top view.

18. The method according to claim 17 , further compri

Assignees

• Nichia Corp

Inventors

• Miura Soichiro
• Kiyota Seiji
• Okahisa Eiichiro

Classifications

• H01S5/02326 Primary

  Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses · CPC title

• H01S5/02253

  using lenses · CPC title

• H01S5/4031 Primary

  Edge-emitting structures · CPC title

• H01S5/0071

  for beam steering, e.g. using a mirror outside the cavity to change the beam direction · CPC title

• H01S5/02216

  Butterfly-type, i.e. with electrode pins extending horizontally from the housings · CPC title