High frequency and high power thin-film component

Patent metadata

Field	Value
Publication number	US-11967609-B2
Application number	US-201916431847-A
Country	US
Kind code	B2
Filing date	Jun 5, 2019
Priority date	Jun 6, 2018
Publication date	Apr 23, 2024
Grant date	Apr 23, 2024

Abstract

A surface mount component is disclosed including an electrically insulating beam that is thermally conductive. The electrically insulating beam has a first end and a second end that is opposite the first end. The surface mount component includes a thin-film component formed on the electrically insulating beam adjacent the first end of the electrically insulating beam. A heat sink terminal is formed on the electrically insulating beam adjacent a second end of the electrically insulating beam. In some embodiments, the thin-film component has an area power capacity of greater than about 0.17 W/mm2 at about 28 GHz.

First claim

What is claimed is:

1. A surface mount component comprising:
an electrically insulating beam that is thermally conductive, the electrically insulating beam having a first end and a second end that is opposite the first end, the electrically insulating beam further having a pair of side surfaces extending between the first end and the second end; and
a thin-film component formed on the electrically insulating beam, the thin-film component comprising a resistive layer and a frequency compensating conductive layer formed over the resistive layer, the thin-film component further comprising a first terminal and a second terminal formed adjacent the first end of the electrically insulating beam, the resistive layer connected between the first terminal and the second terminal,
wherein the thin-film component has an area power capacity of greater than 2 W/mm 2 at about 28 GHz,
wherein the first terminal and the second terminal are offset from each of the first end and the pair of side surfaces of the electrically insulating beam,
wherein the first terminal and the second terminal share a centerline extending parallel to the first end of the electrically insulating beam, the centerline offset from the first end of the electrically insulating beam by a thin-film terminal offset distance,
wherein the surface mount component has an overall length from the first end to the second end of the electrically insulating beam, and
wherein a ratio of the overall length to the thin-film terminal offset distance is about 2 or greater.

2. The surface mount component of claim 1 , wherein the area power capacity of the thin-film component is greater than about 5 W/mm 2 at about 28 GHz and is less than about 10 W/mm 2 at about 28 GHz.

3. The surface mount component of claim 1 , wherein the thin-film component has a transmission coefficient that varies less than about 20% across frequencies ranging from about 20 GHz to about 40 GHz.

4. The surface mount component of claim 1 , wherein the thin-film component has a resistance that varies less than about 10% across frequencies ranging from about 20 GHz to about 40 GHz.

5. The surface mount component of claim 1 , wherein the electrically insulating beam comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.

6. The surface mount component of claim 1 , wherein the electrically insulating beam comprises at least one of aluminum nitride or beryllium oxide.

7. The surface mount component of claim 1 , wherein an overall length of the surface mount component is greater than about 0.1 mm and less than about 5 mm.

8. The surface mount component of claim 1 , Wherein an overall width of the surface mount component is greater than about 0.05 mm and less than about 2.5 mm.

9. The surface mount component of claim 1 , wherein an overall thickness of the surface mount component is greater than about 0.05 mm less than about 2.5 mm.

Assignees

• Avx Corp
• Kyocera Avx Components Corp

Inventors

• Nelson Cory
• Korony Gheorghe

Classifications

• H10W44/401

  Resistive arrangements (H10W44/20, H10W42/80 take precedence) · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• H10D1/47 Primary

  Resistors having no potential barriers · CPC title