Apparatus and techniques for angled etching using multielectrode extraction source

Patent metadata

Field	Value
Publication number	US-11967489-B2
Application number	US-202117514657-A
Country	US
Kind code	B2
Filing date	Oct 29, 2021
Priority date	Dec 7, 2018
Publication date	Apr 23, 2024
Grant date	Apr 23, 2024

Abstract

A plasma source may include a plasma chamber, where the plasma chamber has a first side, defining a first plane and an extraction assembly, disposed adjacent to the side of the plasma chamber, where the extraction assembly includes at least two electrodes. A first electrode may be disposed immediately adjacent the side of the plasma chamber, wherein a second electrode defines a vertical displacement from the first electrode along a first direction, perpendicular to the first plane, wherein the first electrode comprises a first aperture, and the second electrode comprises a second aperture. The first aperture may define a lateral displacement from the second aperture along a second direction, parallel to the first plane, wherein the vertical displacement and the lateral displacement define a non-zero angle of inclination with respect to a perpendicular to the first plane.

First claim

What is claimed is:

1. A method of patterning a substrate, comprising:
providing the substrate, wherein a main surface of the substrate defines a substrate plane, wherein the substrate comprises a grating layer and a base layer, subjacent the grating layer;
generating a plasma in a plasma chamber, adjacent to the substrate; and
applying an extraction voltage to an extraction assembly, adjacent the plasma chamber, the extraction assembly comprising at least two electrodes, wherein a first electrode is disposed immediately adjacent a side of the plasma chamber, the side of the plasma chamber defining a first plane, wherein a second electrode defines a vertical displacement from the first electrode along a first direction, perpendicular to the first plane, wherein the at least two electrodes define an angled extraction tunnel, disposed at a non-zero angle of inclination with respect to a perpendicular to the substrate plane,
wherein an angled ion beam is extracted from the extraction assembly, the angled ion beam defining a non-zero angle of incidence with respect to the substrate plane,
wherein the angled ion beam etches the grating layer to form an angled grating; and
wherein each of the first electrode and the second electrode have a staggered shape, and each electrode comprising an upper portion, an angled portion, and a lower portion, the upper portion and the lower portion being parallel to the first plane, wherein the angled portion is located between the upper portion and the lower portion with respect to the second direction, and wherein the lower portion and the angled portion are integral and continuous with one another.

2. The method of claim 1 , wherein the non-zero angle of incidence is between 5 degrees and 85 degrees.

3. The method of claim 1 , wherein the plasma generates a plurality of radicals, and wherein the plurality of radicals are directed through the angled extraction tunnel as a radical beam having a beam trajectory matching the non-zero angle of incidence of the angled ion beam.

4. The method of claim 3 , further comprising providing a grating mask on the grating layer, wherein the angled ion beam and the radical beam comprise an angled reactive ion etching (RIE) beam, wherein the angled RIE beam etches the grating layer to form a plurality of grating structures, the plurality of grating structures defining a first angled sidewall and a second angled sidewall, the second angled sidewall being parallel to the first angled sidewall.

5. The method of claim 1 , wherein the extraction assembly comprises a first electrode and a second electrode, wherein the first electrode comprises a first aperture, and the second electrode comprises a second aperture, wherein the first aperture defines a lateral displacement from the second aperture along a scan direction, parallel to the substrate plane, and wherein the first aperture and the second aperture are elongated in a width direction, perpendicular to the scan direction.

6. The method of claim 5 , further comprising scanning the substrate along the scan direction while the angled ion beam etches the grating layer.

7. The method of claim 6 , further comprising adjusting the extraction assembly to change the non-zero angle of incidence during the scanning.

8. The method of claim 7 , wherein the adjusting the extraction assembly comprises shifting the first aperture with respect to the second aperture along the scan direction.

9. The method of claim 7 , wherein the adjusting the extraction assembly comprises changing a voltage applied to at least one electrode of the extraction assembly.

10. The method of claim 7 , further comprising providing a grating mask on the grating layer, wherein the angled ion beam etches the grating layer to form a plurality of grating structures, and wherein the adjusting the extraction assembly comprises adjusting an angle of inclination of the plurality of grating structures such that the angle of the inclination of the plurality of grating structures varies.

Assignees

• Applied Materials Inc

Inventors

• Kurunczi Peter F
• Evans Morgan
• Olson Joseph C

Classifications

• H10P72/0421

  for drying etching · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H01J37/32009

  Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources (plasma generation in general H05H1/24) · CPC title

• H01J37/32541

  Shape · CPC title

• H01J37/32568 Primary

  Relative arrangement or disposition of electrodes; moving means · CPC title