Electronic device

Patent metadata

Field	Value
Publication number	US-11961676-B2
Application number	US-202217847717-A
Country	US
Kind code	B2
Filing date	Jun 23, 2022
Priority date	Jul 9, 2021
Publication date	Apr 16, 2024
Grant date	Apr 16, 2024

Abstract

An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.

First claim

What is claimed is:

1. An electronic device comprising:
a chip component;
an accommodation recess accommodating the chip component; and
a case including a protrusion partitioning the accommodation recess into a first accommodation space and a second accommodation space along a first axis direction; wherein
the protrusion includes a first protrusion and a second protrusion disposed away from the first protrusion along a second axis direction orthogonal to the first axis direction; and
the first protrusion and the second protrusion are disposed with a communication space provided between the first protrusion and the second protrusion, so that the first accommodation space and the second accommodation space communicate.

2. The electronic device according to claim 1 , wherein
the accommodation recess is filled with a resin, and the communication space is filled with the resin.

3. The electronic device according to claim 1 , wherein
a length of the communication space along the second axis direction is equivalent to or greater than a thickness of the protrusion along the first axis direction.

4. The electronic device according to claim 1 , wherein
the first protrusion and the second protrusion are separated from each other along the second axis direction and stand on a bottom surface of the accommodation recess.

5. The electronic device according to claim 2 , wherein
the first protrusion and the second protrusion are separated from each other along the second axis direction and stand on a bottom surface of the accommodation recess.

6. The electronic device according to claim 1 , wherein
at least one of the first protrusion or the second protrusion is connected to an inner wall surface of the accommodation recess,
a communication groove is formed where the at least one of the first protrusion or the second protrusion is connected to the inner wall surface of the accommodation recess, and
the communication groove is recessed toward a bottom surface of the accommodation recess and enables the first accommodation space and the second accommodation space to communicate.

7. The electronic device according to claim 1 , wherein
a bottom surface groove is formed on a bottom surface of the accommodation recess, and
the bottom surface groove extends between the first protrusion and the second protrusion toward an outer edge of the bottom surface of the accommodation recess.

8. The electronic device according to claim 2 , wherein
a bottom surface groove is formed on a bottom surface of the accommodation recess, and
the bottom surface groove extends between the first protrusion and the second protrusion toward an outer edge of the bottom surface of the accommodation recess.

9. The electronic device according to claim 7 , wherein
the bottom surface groove includes
a first bottom surface groove extending along the first axis direction between the first protrusion and the second protrusion and
a second bottom surface groove extending along the second axis direction so that the second bottom surface groove is connected to the first bottom surface groove.

10. The electronic device according to claim 1 , wherein
a pair of joint protrusions protruding outwards from a side surface of the case and a joint recess recessed inwards from another side surface of the case are formed on the side surfaces of the case.

Assignees

• Tdk Corp

Inventors

• Masuda Akihiro
• Ito Shinya
• Ando Norihisa
• YAZAWA Kosuke
• Satou Yoshiki
• Kobayashi Katsumi

Classifications

• H01G4/224 Primary

  Housing; Encapsulation · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G2/106

  Fixing the capacitor in a housing · CPC title

• H01G2/02

  Mountings · CPC title