Corona prevention in high power circulators

Patent metadata

Field	Value
Publication number	US-11961635-B2
Application number	US-202318124421-A
Country	US
Kind code	B2
Filing date	Mar 21, 2023
Priority date	Dec 21, 2018
Publication date	Apr 16, 2024
Grant date	Apr 16, 2024

Abstract

A circuit assembly includes a sealable enclosure and at least one electronic circuit element contained within the sealable enclosure. The at least one electronic circuit element includes a control circuit, a garnet, and a first polymer material applied on a surface of the control circuit and on a surface of the garnet. A second polymer material fills a remaining space defined within the enclosure, the second polymer material applied on an exposed surface of the first material.

First claim

The invention claimed is:

1. A circuit assembly comprising:
a sealable enclosure;
at least one electronic circuit element contained within the sealable enclosure, the at least one electronic circuit element including a control circuit, a garnet, and a first polymer material applied on a surface of the control circuit and on a surface of the garnet; and
a second polymer material filling a remaining space defined within the enclosure, the second polymer material applied on an exposed surface of the first material.

2. The circuit assembly of claim 1 , wherein the at least one electronic circuit element comprises a circulator.

3. The circuit assembly of claim 1 , wherein the first polymer material comprises a parylene coating.

4. The circuit assembly of claim 3 , wherein the parylene coating has a dielectric strength of approximately 7,000 volts per mil (V/mil).

5. The circuit assembly of claim 3 , wherein the second polymer material comprises a solid dielectric.

6. The circuit assembly of claim 5 , wherein the second polymer material comprises a silicone rubber compound.

7. The circuit assembly of claim 5 , wherein the solid dielectric has a dielectric strength of approximately 500 volts per mil (V/mil).

8. The circuit assembly of claim 1 , wherein the second polymer material has a dielectric strength that is lower than a dielectric strength of the first polymer material.

9. A circuit assembly comprising:
a sealable enclosure;
at least one electronic circuit element, the at least one electronic circuit element including a garnet, a control circuit, and a first polymer material applied on a surface of the control circuit and on a surface of the garnet, wherein coated at least one electronic circuit element is contained within the sealable enclosure;
a second polymer material applied on an exposed surface of the first polymer material; and
a third polymer material added to the sealable enclosure, wherein the third polymer material is applied on an exposed surface of the second polymer material and fills any void space within the sealable enclosure.

10. The circuit assembly of claim 9 , wherein the at least one electronic circuit element comprises a circulator.

11. The circuit assembly of claim 9 , wherein the first polymer material comprises a parylene coating.

12. The circuit assembly of claim 11 , wherein the parylene coating has a thickness of about 0.1 mils to about 3 mils.

13. The circuit assembly of claim 9 , wherein the second polymer materials comprises a parylene coating.

14. The circuit assembly of claim 13 , wherein the parylene coating has a thickness of about 2.0 mils.

15. The circuit assembly of claim 9 , wherein the third polymer material comprises a solid dielectric.

16. The circuit assembly of claim 15 , wherein the second polymer material comprises a silicone rubber compound.

17. The circuit assembly of claim 9 , wherein a dielectric strength of the third polymer material is less than a dielectric strength of the first polymer material.

18. The circuit assembly of claim 9 , wherein a thickness of the control circuit is less than a thickness of the garnet.

19. The circuit assembly of claim 9 , wherein the control circuit has rounded edges.

20. The circuit assembly of claim 9 , wherein the first polymer material and the second polymer material are a same material.

Assignees

• Lockheed Corp

Inventors

• Robinson Kevin L
• Boswell Kenneth R

Classifications

• H01B17/42 Primary

  Means for obtaining improved distribution of voltage (capacitor-type lead-through insulators H01B17/28); Protection against arc discharges · CPC title

• H01P1/38

  Circulators · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K5/065

  sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding · CPC title

• H05K1/0256 Primary

  Electrical insulation details, e.g. around high voltage areas · CPC title