Photoresist composition, coated substrate including the photoresist composition, and method of forming electronic device

US11960206B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11960206-B2
Application numberUS-202218075594-A
CountryUS
Kind codeB2
Filing dateDec 6, 2022
Priority dateDec 31, 2015
Publication dateApr 16, 2024
Grant dateApr 16, 2024

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Abstract

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A photoresist composition, including an acid-sensitive polymer and photoacid generator compound having Formula (I): wherein, EWG, Y, R, and M + are the same as described in the specification.

First claim

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The invention claimed is: 1. A photoresist composition, comprising: an acid-sensitive polymer, a solvent, and a photoacid generator compound having Formula (II): wherein: X 1 , X 2 , X 3 and X −4 are each independently an electron-withdrawing group; Y is a single bond or linking group; R is hydrogen; and M + is an organic cation, provided that the anion of the photoacid generator compound does not simultaneously include three electron-withdrawing —S(═O) 2 -perfluoroalkyl groups. 2. The photoresist composition of claim 1 , wherein M + is an organic cation having Formula (V): wherein, each R 2 is independently a C 1-20 alkyl group, a C 1-20 fluoroalkyl group, a C 3-20 cycloalkyl group, a C 3-20 fluorocycloalkyl group, a C 2-20 alkenyl group, a C 2-20 fluoroalkenyl group, a C 6-20 aryl group, a C 6-20 fluoroaryl group, a C 1-20 heteroaryl group, a C 7-20 aralkyl group, a C 7-20 fluoroaralkyl group, a C 2-20 heteroaralkyl group, or a C 2-20 fluoroheteroaralkyl group, each of which is substituted or unsubstituted, wherein each R 2 is either separate or connected to the other group R 2 via a single bond or a linking group, and Ar is a substituted or unsubstituted C 6-30 aromatic organic group. 3. The photoresist composition of claim 1 , wherein M + is an organic cation having Formula (VI): wherein X is I or S; each R 3 is independently a halogen, a C 1-10 alkyl group, a C 1-10 fluoroalkyl group, a C 1-10 alkoxy group, a C 1-10 fluoroalkoxy group, a C 3-10 cycloalkyl group, a C 3-10 fluorocycloalkyl group, a C 3-10 cycloalkoxy group, a C 3-10 fluorocycloalkoxy group, or a C 6-10 alkoxycarbonylalkyleneoxy group; each n is an integer of 0, 1, 2, 3, 4, and 5; and m is an integer of 2 or 3, provided that when X is I, m is 2, and where X is S, m is 3. 4. The photoresist composition of claim 1 , wherein M + is an organic cation having Formulae (VII) or (VIII): wherein R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are each independently a halogen, —CN, —OH, a C 1-10 alkyl group, a C 1-10 fluoroalkyl group, a C 1-10 alkoxy group, a C 1-10 fluoroalkoxy group, a C 3-10 cycloalkyl group, a C 3-10 fluorocycloalkyl group, a C 3-10 cycloalkoxy group, or a C 3-10 fluorocycloalkoxy group, each of which except a halogen, —CN, and —OH is substituted or unsubstituted; J is a single bond or a connecting group selected from S, O, and C═O, p is each independently an integer of 0, 1, 2, 3, or 4; r is an integer of 0, 1, 2, 3, 4, and 5, and s and t are each independently an integer of 0, 1, 2, 3, and 4. 5. A coated substrate, comprising: (a) a substrate having one or more layers to be patterned on a surface thereof, and (b) a layer of the photoresist composition of claim 1 over the one or more layers to be patterned. 6. A method of forming an electronic device, comprising: (a) applying a layer of the photoresist composition of claim 1 on a substrate; (b) patternwise exposing the photoresist composition layer to activating radiation; and (c) developing the exposed photoresist composition layer to provide a resist relief image. 7. A photoresist composition, comprising: an acid-sensitive polymer, a solvent, and a photoacid generator compound having Formula (III): wherein: X 5 and X 6 are each independently an electron withdrawing group selected from C(CN) 2 , C(NO 2 ) 2 , C(COR 27 ) 2 , C(CO 2 R 28 ) 2 , C(SO 2 R 29 ) 2 , and C(R f ) 2 , wherein R 27 , R 28 , and R 29 are each independently a C 1-30 aliphatic organic group, a C 6-30 aromatic organic group, or a C 1-30 heteroaromatic organic group, and wherein R f is a C 1-30 fluoroalkyl group; Z 1 and Z 2 are each independently hydrogen, a straight chain C 1-50 alkyl group, a branched C 3-50 alkyl group, a monocyclic or polycyclic C 3-50 cycloalkyl group, a monocyclic or polycyclic C 3-50 heterocycloalkyl group; a monocyclic or polycyclic C 6-50 aryl group, a monocyclic or polycyclic C 3-20 heteroaryl group, or a combination thereof; Y is a single bond or a linking group; R is hydrogen; and M + is an organic cation; provided that the anion of the photoacid generator compound does not simultaneously include three electron-withdrawing —S(═O) 2 -perfluoroalkyl groups. 8. The photoacid generator compound of claim 7 , wherein in Formula (III): X 5 and X 6 are each C(CN) 2 ; and Y is a single bond. 9. The photoresist composition of claim 7 , wherein M + is an organic cation having Formula (V): wherein, each R 2 is independently a C 1-20 alkyl group, a C 1-20 fluoroalkyl group, a C 3-20 cycloalkyl group, a C 3-20 fluorocycloalkyl group, a C 2-20 alkenyl group, a C 2-20 fluoroalkenyl group, a C 6-20 aryl group, a C 6-20 fluoroaryl group, a C 1-20 heteroaryl group, a C 7-20 aralkyl group, a C 7-20 fluoroaralkyl group, a C 2-20 heteroaralkyl group, or a C 2-20 fluoroheteroaralkyl group, each of which is substituted or unsubstituted, wherein each R 2 is either separate or connected to the other group R 2 via a single bond or a linking group, and Ar is a substituted or unsubstituted C 6-30 aromatic organic group. 10. The photoresist composition of claim 7 , wherein M + is an organic cation having Formula (VI): wherein X is I or S; each R 3 is independently a halogen, a C 1-10 alkyl group, a C 1-10 fluoroalkyl group, a C 1-10 alkoxy group, a C 1-10 fluoroalkoxy group, a C 3-10 cycloalkyl group, a C 3-10 fluorocycloalkyl group, a C 3-10 cycloalkoxy group, a C 3-10 fluorocycloalkoxy group, or a C 6-10 alkoxycarbonylalkyleneoxy group; each n is an integer of 0, 1, 2, 3, 4, and 5; and m is an integer of 2 or 3, provided that when X is I, m is 2, and where X is S, m is 3. 11. The photoresist composition of claim 7 , wherein M + is an organic cation having Formulae (VII) or (VIII): wherein R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are each independently a halogen, —CN, —OH, a C 1-10 alkyl group, a C 1-10 fluoroalkyl group, a C 1-10 alkoxy group, a C 1-10 fluoroalkoxy group, a C 3-10 cycloalkyl group, a C 3-10 fluorocycloalkyl group, a C 3-10 cycloalkoxy group, or a C 3-10 fluorocycloalkoxy group, each of which except a halogen, —CN, and —OH is substituted or unsubstituted; J is a single bond or a connecting group selected from S, O, and C═O, p is each independently an integer of 0, 1, 2, 3, or 4; r is an integer of 0, 1, 2, 3, 4, and 5, and s and t are each independently an integer of 0, 1, 2, 3, and 4.

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What does patent US11960206B2 cover?
A photoresist composition, including an acid-sensitive polymer and photoacid generator compound having Formula (I): wherein, EWG, Y, R, and M + are the same as described in the specification.
Who is the assignee on this patent?
Rohm & Haas Elect Mat, Rohm And Hass Electronic Mat Llc
What technology area does this patent fall under?
Primary CPC classification G03F7/0045. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).