Ceramic circuit board and semiconductor device using the same
US-10674603-B2 · Jun 2, 2020 · US
Substrate and method for producing the substrate
US11958271B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11958271-B2 |
| Application number | US-201917312701-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 5, 2019 |
| Priority date | Dec 10, 2018 |
| Publication date | Apr 16, 2024 |
| Grant date | Apr 16, 2024 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.
First claim
Opening claim text (preview).
The invention claimed is: 1. A substrate comprising: a ceramic main body having first volume regions and second volume regions, each of the first volume regions and the second volume regions containing a ceramic material, wherein the first volume regions contain less sintering aid than the second volume regions, wherein the ceramic main body has contact areas configured for mounting components on the substrate, and/or integrated redistribution traces, and/or vias, and wherein the integrated redistribution traces comprises tungsten. 2. The substrate according to claim 1 , wherein the first volume regions and the second volume regions form a layered structure. 3. The substrate according to claim 2 , wherein an uppermost layer and a lowermost layer comprise the first volume regions. 4. The substrate according to claim 1 , wherein the ceramic main body has a thickness that lies in a range of 300 μm to 400 μm and has a transverse rupture strength of at least 450 MPa. 5. A substrate comprising: a ceramic main body having first volume regions and second volume regions, each of the first volume regions and the second volume regions containing a ceramic material, wherein the first volume regions contain less sintering aid than the second volume regions, wherein the ceramic main body has contact areas configured for mounting components on the substrate, integrated redistribution traces, and vias, and wherein the integrated redistribution traces comprises tungsten. 6. The substrate according to claim 5 , wherein the first volume regions and the second volume regions form a layered structure. 7. The substrate according to claim 6 , wherein an uppermost layer and a lowermost layer comprise the first volume regions. 8. The substrate according to claim 5 , wherein the ceramic main body has a thickness that lies in a range of 300 μm to 400 μm and has a transverse rupture strength of at least 450 MPa.
Assignees
Inventors
Classifications
- B32B18/00Primary
Layered products essentially comprising ceramics, e.g. refractory products · CPC title
directly with other burned ceramic articles · CPC title
Alumina or aluminates · CPC title
Boron nitride · CPC title
Silicon carbide · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11958271B2 cover?
- In an embodiment a method for producing a substrate includes forming a green sheet stack including first green sheets and second green sheets, wherein each of the first green sheets and the second green sheets contains a ceramic material as a main component, and wherein the second green sheets further contain a sintering aid in addition to the ceramic material.
- Who is the assignee on this patent?
- Tdk Electronics Ag
- What technology area does this patent fall under?
- Primary CPC classification B32B18/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).