Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-11955352-B2
Application number	US-202117141670-A
Country	US
Kind code	B2
Filing date	Jan 5, 2021
Priority date	Jan 7, 2020
Publication date	Apr 9, 2024
Grant date	Apr 9, 2024

Abstract

A substrate processing apparatus includes: a temperature raising part for raising a temperature of a first sulfuric acid; a mixing part for mixing the first sulfuric acid where the temperature is raised by the temperature raising part with a moisture-containing liquid to generate a mixed solution; and a discharging part for discharging the mixed solution onto a substrate inside a substrate processing part. The mixing part includes: a joining portion where a sulfuric acid supply line through which the first sulfuric acid where the temperature is raised by the temperature raising part flows and a liquid supply line through which the first sulfuric acid where the temperature is raised by the temperature raising part and the moisture-containing liquid flows are joined; and a reaction suppression mechanism for suppressing a reaction between the first sulfuric acid and the moisture-containing liquid in the joining portion.

First claim

What is claimed is:

1. A substrate processing apparatus, comprising:
a heater configured to raise a temperature of a sulfuric acid supplied from a sulfuric acid source;
a sulfuric acid supply line configured to supply the sulfuric acid, whose temperature has been raised by the heater, to a mixing part;
a liquid supply line configured to supply a moisture-containing liquid from a moisture-containing liquid source to the mixing part;
the mixing part configured to mix the sulfuric acid from the sulfuric acid supply line with the moisture-containing liquid from the liquid supply line to generate a mixed solution; and
a nozzle configured to discharge the mixed solution onto a substrate inside a substrate processing part,
wherein the mixing part includes:
a joining portion where the sulfuric acid supply line and the liquid supply line are joined; and
a reaction suppression mechanism including a U-shaped pipe buffer portion, which is provided in the liquid supply line, and configured to suppress a reaction between the sulfuric acid, whose temperature has been raised by the heater, and the moisture-containing liquid in the joining portion, and

wherein the U-shaped pipe buffer portion has an uppermost portion provided at a position higher than the joining portion.

2. The substrate processing apparatus of claim 1 , wherein the uppermost portion of the U-shaped pipe buffer portion is provided at the position higher than the joining portion by a diameter or more of the liquid supply line in the joining portion.

3. The substrate processing apparatus of claim 1 , wherein the U-shaped pipe buffer portion is spaced apart from a mixed-solution supply line, which supplies the mixed solution from the joining portion to the nozzle, by a diameter or more of the mixed-solution supply line in the joining portion.

4. The substrate processing apparatus of claim 1 , wherein the moisture-containing liquid is a pure water.

5. The substrate processing apparatus of claim 1 , wherein the moisture-containing liquid includes a hydrogen peroxide solution.

6. The substrate processing apparatus of claim 1 , wherein the moisture-containing liquid includes a functional water.

Assignees

• Tokyo Electron Ltd

Inventors

• Sakurai Hiroki
• Goto Daisuke
• Nakazawa Takashi
• Takamatsu Yusuke
• Hashimoto Yusuke

Classifications

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0424 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title