System and method of cleaning and inspecting semiconductor die carrier

Patent metadata

Field	Value
Publication number	US-11945004-B2
Application number	US-202117454514-A
Country	US
Kind code	B2
Filing date	Nov 11, 2021
Priority date	Aug 18, 2021
Publication date	Apr 2, 2024
Grant date	Apr 2, 2024

Abstract

A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.

First claim

What is claimed:

1. A method of cleaning a semiconductor manufacturing equipment, comprising:
providing a carrier;
passing a first rotating brush over a first surface of the carrier;
passing a second rotating brush over a second surface of the carrier opposite the first surface of the carrier;
disposing a first separator in an exhaust path of the first rotating brush to draw away debris dislodged from the first surface of the carrier by the first rotating brush; and
providing a first vacuum suction through the first separator to remove debris dislodged from the first surface of the carrier by the first rotating brush.

2. The method of claim 1 , further including providing a second separator to draw away debris dislodged from the second surface of the carrier by the second rotating brush.

3. The method of claim 2 , further including providing a second vacuum suction through the second separator to remove debris dislodged from the second surface of the carrier by the second rotating brush.

4. The method of claim 1 , further including providing a conveyor to transport the carrier.

5. The method of claim 1 , wherein the first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier.

6. The method of claim 1 , further including injecting air pressure across the first rotating brush and second rotating brush.

7. A method of cleaning a semiconductor manufacturing equipment, comprising:
providing a first brush adapted to pass over a first surface of a tray;
providing a second brush adapted to pass over a second surface of the tray opposite the first surface of the tray;
providing a first separator to draw away debris dislodged from the first surface of the tray by the first brush; and
providing a first vacuum suction through the first separator to remove debris dislodged from the first surface of the tray by the first brush.

8. The method of claim 7 , further including disposing the first separator in an exhaust path of the first brush to draw away debris dislodged from the first surface of the tray by the first brush.

9. The method of claim 7 , further including:
providing a second separator to draw away debris dislodged from the second surface of the tray by the second brush; and
providing a second vacuum suction through the second separator to remove debris dislodged from the second surface of the tray by the second brush.

10. The method of claim 7 , further including providing a conveyor to transport the tray.

11. The method of claim 7 , wherein the first brush and second brush move in tandem across the first surface and second surface of the tray.

12. The method of claim 7 , wherein the first brush and second brush rotate while passing over the first surface and second surface of the tray.

13. The method of claim 7 , further including injecting air pressure across the first brush and second brush.

14. A semiconductor manufacturing equipment cleaning system, comprising:
a first brush adapted to pass over a first surface of a carrier; and
a second brush adapted to pass over a second surface of the carrier opposite the first surface of the carrier;
a first separator to draw away debris dislodged from the first surface of the carrier by the first brush; and
a first vacuum suction through the first separator to remove debris dislodged from the first surface of the tray by the first brush.

15. The semiconductor manufacturing equipment cleaning system of claim 14 , wherein the first separator is disposed in an exhaust path of the first brush to draw away debris dislodged from the first surface of the carrier by the first brush.

16. The semiconductor manufacturing equipment cleaning system of claim 14 , further including a second separator disposed in an exhaust path of the second brush to draw away debris dislodged from the second surface of the carrier by the second brush.

17. The semiconductor manufacturing equipment cleaning system of claim 16 , further including a second vacuum suction through the second separator to remove debris dislodged from the second surface of the carrier by the second brush.

18. The semiconductor manufacturing equipment cleaning system of claim 14 , wherein the first brush and second brush move in tandem across the first surface and second surface of the carrier.

19. The semiconductor manufacturing equipment cleaning system of claim 14 , wherein the first brush and second brush rotate while passing over the first surface and second surface of the carrier.

20. The semiconductor manufacturing equipment cleaning system of claim 14 , further including an injector to introduce air pressure across the first brush and second brush.

Assignees

• Utac Headquarters Pte Ltd

Inventors

• Tan Hua Hong
• Lam Wing Keung
• Cai Zong Xiang
• Xian Wei Ming
• Wu yao hong
• Hu Tao

Classifications

• H10P72/3314

  Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers · CPC title

• H10P72/3202

  Mechanical details, e.g. rollers or belts · CPC title

• H10P72/16

  Trays for chips · CPC title

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0412

  using mainly scrubbing means, e.g. brushes · CPC title