Micro-chamber for inspecting sample material
US-9741529-B2 · Aug 22, 2017 · US
US11944965B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11944965-B2 |
| Application number | US-202016880247-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 21, 2020 |
| Priority date | Jun 28, 2019 |
| Publication date | Apr 2, 2024 |
| Grant date | Apr 2, 2024 |
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A microfluidic device, a diagnostic device including the microfluidic device and a method for making the microfluidic device are provided. The microfluidic device includes: (i) a transparent substrate comprising a cavity, the cavity opening up to a top of the transparent substrate; (ii) a transparent layer covering the cavity, and (iii) a semiconductor substrate over the transparent layer and the transparent substrate, wherein the semiconductor substrate comprises a through hole overlaying the cavity and exposing the transparent layer.
Opening claim text (preview).
The invention claimed is: 1. A method for making a microfluidic device, the method comprising: (a) providing a transparent substrate comprising a cavity, the cavity opening up to a top of the transparent substrate; (b) providing a semiconductor substrate; (c) forming, over the transparent substrate, a transparent layer covering the cavity; (d) after step (c), bonding the transparent substrate to the semiconductor substrate by anodic bonding in such a way that the transparent layer is present between the semiconductor substrate and the transparent substrate; and (e) etching a through hole through the semiconductor substrate to expose the transparent layer covering the cavity. 2. The method according to claim 1 , wherein step c comprises patterning the transparent layer. 3. The method according to claim 1 , wherein step (c) comprises transferring the transparent layer from an auxiliary substrate to the transparent substrate. 4. The method according to claim 1 , wherein the semiconductor substrate comprises a microfluidic channel and wherein step d comprises bonding the semiconductor substrate to the transparent layer in such a way that the microfluidic channel is fluidically coupled to the cavity. 5. The method according to claim 1 , wherein the semiconductor substrate comprises silicon. 6. The method according to claim 1 , wherein the transparent substrate comprises glass. 7. The method according to claim 1 , wherein the transparent layer comprises a polymer, a silicon nitride or a silicon oxide. 8. The method according to claim 1 , wherein the microfluidic device comprises a microfluidic channel fluidically coupled to the cavity. 9. The method according to claim 8 , wherein the microfluidic channel is a capillary microfluidic channel.
characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces · CPC title
characterised by the manufacture of the container or its components · CPC title
by heating, with or without pressure · CPC title
Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems · CPC title
Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept · CPC title
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