Crimp terminal-equipped flexible printed circuit board and method for manufacturing same

US11942708B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11942708-B2
Application numberUS-202117454948-A
CountryUS
Kind codeB2
Filing dateNov 15, 2021
Priority dateMar 10, 2021
Publication dateMar 26, 2024
Grant dateMar 26, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A crimp terminal-equipped flexible printed circuit board comprising: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; crimp terminals including multiple crimp pieces crimped to penetrate the first flexible printed circuit board in a thickness direction of the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate, wherein the multiple crimp pieces penetrate the insulating reinforcing film in the thickness direction. 2. The crimp terminal-equipped flexible printed circuit board according to claim 1 , wherein the base film of the first flexible printed circuit board is a single-sided copper-clad laminate made of polyimide, polyethylene naphthalate, or polyethylene terephthalate. 3. The crimp terminal-equipped flexible printed circuit board according to claim 1 , wherein the first flexible printed circuit board has a cover film bonded to the base film to sandwich the circuit, in a partial area of the first flexible printed circuit board, part of the circuit is exposed without the cover film being provided, and in the partial area, at least some of the multiple crimp pieces bite into the part of the circuit without penetrating the cover film. 4. The crimp terminal-equipped flexible printed circuit board according to claim 2 , wherein the first flexible printed circuit board has a cover film bonded to the base film to sandwich the circuit, in a partial area of the first flexible printed circuit board, part of the circuit is exposed without the cover film being provided, and in the partial area, at least some of the multiple crimp pieces bite into the part of the circuit without penetrating the cover film. 5. A method for manufacturing a crimp terminal-equipped flexible printed circuit board, comprising: bonding an insulating reinforcing film to a predetermined area of a base film included in a first flexible printed circuit board; and swaging multiple crimp pieces included in crimp terminals to an area where the insulating reinforcing film is provided, thereby attaching the crimp terminals to the first flexible printed circuit board, wherein the multiple crimp pieces penetrate the first flexible printed circuit board and the insulating reinforcing film in a thickness direction of the first flexible printed circuit board.

Assignees

Inventors

Classifications

  • H01R12/69Primary

    deformable terminals, e.g. crimping terminals · CPC title

  • Crimping apparatus or processes (H01R43/042 takes precedence) · CPC title

  • characterised by the use of flexible or folded printed circuits · CPC title

  • Individual female type metallic connector elements · CPC title

  • Adjacent components · CPC title

Patent family

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Frequently asked questions

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What does patent US11942708B2 cover?
A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partial…
Who is the assignee on this patent?
Nippon Mektron Kk
What technology area does this patent fall under?
Primary CPC classification H01R12/69. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 26 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).