Electroplating of niobium titanium

Patent metadata

Field	Value
Publication number	US-11938554-B2
Application number	US-202117342805-A
Country	US
Kind code	B2
Filing date	Jun 9, 2021
Priority date	Oct 25, 2018
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

A structure, such as a cable assembly, is provided that has a Nb/Ti substrate and a metal layer electroplated on a portion of the Nb/Ti substrate, wherein the metal layer has a metal capable of being soldered to, such as copper, and a metal coaxial connector soldered to the metal layer.

First claim

What is claimed is:

1. A structure, comprising:
a niobium titanium substrate;
a metal layer plated on a portion of the niobium titanium substrate;
a coaxial connector attached to the metal layer;
a qubit attached to the coaxial connector; and
an amplifier attached to another portion of the niobium titanium substrate.

2. The structure of claim 1 , wherein the metal layer comprises an electroplated metal layer plated on the portion of the niobium titanium substrate using electroplating.

3. The structure of claim 1 , wherein the metal layer comprises a first layer of nickel adhered directly to a surface of the portion of the niobium titanium substrate, and second layer of copper adhered to the first layer of nickel.

4. The structure of claim 1 , further comprising:
a metal contact surface soldered to the metal layer.

5. The structure of claim 4 , wherein the coaxial connector is attached to the metal contact surface of the metal layer.

6. The structure of claim 5 , wherein the coaxial connector comprises a microwave coaxial connector.

7. The structure of claim 5 , wherein the coaxial connector comprises a sub-miniature version A (SMA) type connector.

8. The structure of claim 1 , wherein the niobium titanium substrate comprises a niobium titanium wire.

9. A cable assembly, comprising:
a niobium titanium wire;
a metal layer plated on a first portion of the niobium titanium wire;
a metal coaxial connector soldered to the metal layer, wherein the metal coaxial connector comprises a microwave connector;
a qubit attached to the metal coaxial connector; and
an amplifier attached to a second portion of the niobium titanium wire.

10. The cable assembly of claim 9 , wherein the metal layer comprises an electroplated metal layer plated on the first portion of the niobium titanium wire using electroplating.

11. The cable assembly of claim 9 , wherein the metal coaxial connector comprises a microwave connector.

12. The cable assembly of claim 9 , wherein the first portion of the niobium titanium wire comprises an end portion of the niobium titanium wire.

13. The cable assembly of claim 9 , wherein the metal coaxial connector comprises a sub-miniature version A (SMA) type connector.

14. A method, comprising:
preparing a surface of a niobium titanium substrate, resulting in a prepared surface, wherein the preparing comprises:
polishing the surface of the niobium titanium substrate using a mechanical polishing wheel, and
sanding the surface of the niobium titanium substrate; and

electroplating a metal film onto the prepared surface.

15. The method of claim 14 , wherein the preparing further comprises, after the sanding, dipping the surface of the niobium titanium substrate in a hydrochloric acid solution.

16. The method of claim 14 , further comprising:
soldering a metal surface to the metal film.

17. The method of claim 16 , wherein the metal surface comprises a coaxial connector.

18. The method of claim 17 , wherein the coaxial connector comprises a microwave coaxial connector.

19. The method of claim 17 , wherein the coaxial connector comprises a sub-miniature version A (SMA) type connector.

20. The method of claim 16 , wherein the niobium titanium substrate comprises a niobium titanium wire.

Assignees

• IBM

Inventors

• Degraw Danielle
• Fung Yat-Kiu-Kent
• Rozen James Robert

Classifications

• B23K1/0016 Primary

  Soldering of electronic components · CPC title

• B23K1/0008

  specially adapted for particular articles or work · CPC title

• C25D3/12

  of nickel or cobalt · CPC title

• C25D3/38

  of copper · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title