Semiconductor package and method of manufacturing semiconductor package
US-2020035644-A1 · Jan 30, 2020 · US
US11925010B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11925010-B2 |
| Application number | US-201916957069-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 28, 2019 |
| Priority date | Aug 28, 2019 |
| Publication date | Mar 5, 2024 |
| Grant date | Mar 5, 2024 |
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Official abstract text for this publication.
A display panel, a display module and a manufacture method thereof, and a communication device are provided. The display panel includes a display substrate and a multiplexing circuit arranged on a first surface of the display substrate. The display panel further includes a wave-absorbing material layer arranged on a second surface of the display substrate. The wave-absorbing material layer is configured to absorb electromagnetic wave interference signals. The second surface is a surface opposite to the first surface.
Opening claim text (preview).
The invention claimed is: 1. A display panel, comprising a display substrate and pixel units, wherein a multiplexing circuit and the pixel units are arranged on a first surface of the display substrate, the display panel further comprises a wave-absorbing material layer arranged on a second surface of the display substrate, the wave-absorbing material layer is configured to absorb electromagnetic wave interference signals; the second surface is a surface opposite to the first surface; the multiplexing circuit comprises N input pins and M output pins, N is different from M, and N and M both are positive integers; and the input pins are connected to a driver integrated circuit and the output pins are connected to the pixel units; wherein the first surface comprises a display region and a peripheral region at a periphery of the display region; the second surface comprises a first region and a second region; an orthographic projection of the display region onto the second surface overlaps the first region, and an orthographic projection of the peripheral region onto the second surface overlaps the second region; the multiplexing circuit is arranged in the peripheral region; the display panel further comprises a first back film layer arranged in the first region of the second surface; and the wave-absorbing material layer is arranged on a side of the first back film layer that is far away from the display panel; or, the first surface comprises a display region and a peripheral region at a periphery of the display region; the second surface comprises a first region and a second region, an orthographic projection of the display region onto the second surface overlaps the first region, an orthographic projection of the peripheral region onto the second surface overlaps the second region; and the wave-absorbing material layer is arranged in the first region and the multiplexing circuit is arranged in the peripheral region; wherein the display panel further comprises a first heat-dissipation film layer, wherein the first heat-dissipation film layer and the wave-absorbing material layer are arranged at a same level, and an orthographic projection of the first heat-dissipation film layer onto the second surface and an orthographic projection of the wave-absorbing material layer onto the second surface are both in the first region; and wherein the display panel further comprises a second heat-dissipation film layer, wherein the second heat-dissipation film layer is arranged on a side of the first heat-dissipation film layer that is far away from the first back film layer; an orthographic projection of the second heat-dissipation film layer onto the second surface at least covers the orthographic projection of the first heat-dissipation film layer onto the second surface and the orthographic projection of the wave-absorbing material layer onto the second surface. 2. The display panel according to claim 1 , wherein a thickness of the first heat-dissipation film layer is substantially equal to a thickness of the wave-absorbing material layer, the thickness of the first heat-dissipation film layer is substantially equal to a thickness of the first back film layer, the thickness of the first heat-dissipation film layer is greater than a thickness of the second heat-dissipation film layer, and the thickness of the second heat-dissipation film layer is greater than a thickness of the display substrate; and/or, a thickness of the first back film layer is greater than or equal to 0.05 mm and less than or equal to 0.1 mm, a thickness of the wave-absorbing material layer is greater than or equal to 0.03 mm and less than or equal to 0.15 mm, a thickness of the first heat-dissipation film layer is greater than or equal to 0.08 mm and less than or equal to 0.15 mm, a thickness of the second heat-dissipation film layer is greater than or equal to 0.03 mm and less than or equal to 0.05 mm, and a thickness of the display substrate is greater than or equal to 0.02 mm and less than or equal to 0.05 mm. 3. The display panel according to claim 1 , further comprising a first heat-dissipation film layer and a second heat-dissipation film layer, wherein the first heat-dissipation film layer is arranged between the first back film layer and the wave-absorbing material layer; the second heat-dissipation film layer and the wave-absorbing material layer are arranged at a same level, and an orthographic projection of the first heat-dissipation film layer onto the second surface at least covers an orthographic projection of the second heat-dissipation film layer onto the second surface and an orthographic projection of the wave-absorbing material layer onto the second surface. 4. The display panel according to claim 3 , wherein a thickness of the wave-absorbing material layer is substantially equal to a thickness of the second heat-dissipation film layer, a thickness of the first heat-dissipation film layer is substantially equal to a thickness of the first back film layer, the thickness of the first heat-dissipation film layer is greater than the thickness of the second heat-dissipation film layer, and the thickness of the second heat-dissipation film layer is greater than a thickness of the display substrate; and/or, a thickness of the wave-absorbing material layer is greater than or equal to 0.03 mm and less than or equal to 0.15 mm, a thickness of the second heat-dissipation film layer is greater than or equal to 0.03 mm and less than or equal to 0.05 mm, a thickness of the first heat-dissipation film layer is greater than or equal to 0.08 mm and less than or equal to 0.15 mm, a thickness of the first back film layer is greater than or equal to 0.05 mm and less than or equal to 0.1 mm, and a thickness of the display substrate is greater than or equal to 0.02 mm and less than or equal to 0.05 mm. 5. The display panel according to claim 1 , wherein the wave-absorbing material layer comprises one or more of a ferrite layer, a magnetic ferrous nanomaterial layer, a carbon fiber layer, a carbon nanotube layer, or a silicon carbide layer. 6. The display panel according to claim 1 , wherein, in case that the first surface comprises a display region and a peripheral region at a periphery of the display region; the second surface comprises a first region and a second region, an orthographic projection of the display region onto the second surface overlaps the first region, an orthographic projection of the peripheral region onto the second surface overlaps the second region; and the wave-absorbing material layer is arranged in the first region and the multiplexing circuit is arranged in the peripheral region, the display panel further comprises a first back film layer, wherein the first back film layer is arranged on a part of the second surface, the first back film layer and the wave-absorbing material layer are arranged at a same level, and the first back film layer is arranged in the first region. 7. The display panel according to claim 6 , wherein the first back film layer and the wave-absorbing material layer contact each other laterally. 8. The display panel according to claim 6 , further comprising a heat dissipation layer, wherein the heat dissipation layer is arranged on a side of the first back film layer that is far away from the display substrate. 9. The display panel according to claim 8 , wherein a thickness of the heat dissipation layer is greater than a thickness of the first back film layer, a thickness of the wave-absorbing material layer is substantially equal to the thickness of the first back film layer, and the thickness of the first back film layer is greater than a thickness of the display substrate. 10. The display panel according to cl
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Interconnections, e.g. scanning lines · CPC title
Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence) · CPC title
with built-in antennas · CPC title
Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure (absorbing means H01Q17/00) · CPC title
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