Electronic apparatus and heat dissipation and emi shielding structure thereof

Patent metadata

Field	Value
Publication number	US-2017367175-A1
Application number	US-201715461939-A
Country	US
Kind code	A1
Filing date	Mar 17, 2017
Priority date	Jun 15, 2016
Publication date	Dec 21, 2017
Grant date	—

Abstract

An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element.

First claim

What is claimed is:

1 . A heat dissipation and EMI shielding structure for at least one chip disposed on a substrate and comprising:
a shielding frame having at least one opening to expose the chip; and a heat dissipation element disposed on the shielding frame to cover the opening, wherein the shielding frame is in conjunction with the heat dissipation element to protect the chip from electromagnetic interference, and the heat dissipation element dissipates heat generated from the chip.

2 . The heat dissipation and EMI shielding structure according to claim 1 , wherein the heat dissipation element includes a heat dissipation layer and an adhesive layer, the heat dissipation layer is fixed on the shielding frame and the chip through the adhesive layer, and heat generated from the chip is conducted to the heat dissipation layer through the adhesive layer.

3 . The heat dissipation and EMI shielding structure according to claim 2 , wherein the heat dissipation layer is a conductive heat dissipation layer so as to protect the chip from the electromagnetic interference in conjunction with the shielding frame.

4 . The heat dissipation and EMI shielding structure according to claim 3 , wherein the conductive heat dissipation layer is made of copper, aluminum, or graphene.

5 . The heat dissipation and EMI shielding structure according to claim 2 , wherein the heat dissipation layer is an electrical insulating heat dissipation layer, the adhesive layer is a curable conductive adhesive layer so as to protect the chip from electromagnetic interference in conjunction with the shielding frame.

6 . The heat dissipation and EMI shielding structure according to claim 1 , wherein the heat dissipation element includes a heat sink and a cured thermally conductive adhesive, and the heat sink is attached to the shielding frame through the cured thermally conductive adhesive so as to protect the chip from electromagnetic interference in conjunction with the shielding frame.

7 . The heat dissipation and EMI shielding structure according to claim 1 , wherein the shielding frame comprises a top plate and an enclosing sidewall extending downward from an outer periphery of a surface of the top plate toward the substrate.

8 . The heat dissipation and EMI shielding structure according to claim 7 , wherein the shielding frame is disposed on the substrate with the enclosing sidewall in contact with the substrate, and a height of a top surface of the top plate relative to a substrate surface is larger, equal to, or less than that of an upper surface of the chip relative to the substrate surface.

9 . The heat dissipation and EMI shielding structure according to claim 8 , wherein the heat dissipation element is attached to the top surface of the top plate and the upper surface of the chip.

10 . An electronic apparatus comprising:
a substrate; at least one chip disposed on the substrate; and a heat dissipation and EMI shielding structure disposed on the substrate, wherein the heat dissipation and EMI shielding structure comprises:
a shielding frame having at least one opening to expose the chip; and
a heat dissipation element disposed on the shielding frame to cover the opening, wherein the shielding frame is in conjunction with the heat dissipation element to protect the chip from electromagnetic interference, and the heat dissipation element dissipates heat generated from the chip.

11 . The electronic apparatus according to claim 10 , wherein the heat dissipation element includes a heat dissipation layer and an adhesive layer, the heat dissipation layer is fixed on the shielding frame and the chip through the adhesive layer, and heat generated from the chip is conducted to the heat dissipation layer through the adhesive layer.

12 . The electronic apparatus according to claim 11 , wherein the heat dissipation layer is a conductive heat dissipation layer so as to protect the chip from the electromagnetic interference in conjunction with the shielding frame.

13 . The electronic apparatus according to claim 12 , wherein the conductive heat dissipation layer is made of copper, aluminum, or graphene.

14 . The electronic apparatus according to claim 11 , wherein the heat dissipation layer is an electrical insulating heat dissipation layer, the adhesive layer is a curable conductive adhesive layer so as to protect the chip from electromagnetic interference in conjunction with the shielding frame.

15 . The electronic apparatus according to claim 10 , wherein the heat dissipation element includes a heat sink and a cured thermally conductive adhesive, and the heat sink is attached to the shielding frame through the cured thermally conductive adhesive so as to protect the chip from electromagnetic interference in conjunction with the shielding frame.

16 . The electronic apparatus according to claim 10 , wherein the shielding frame comprises a top plate and an enclosing sidewall extending downward from an outer periphery of a surface of the top plate toward the substrate.

17 . The electronic apparatus according to claim 16 , wherein the shielding frame is disposed on the substrate with the enclosing sidewall in contact with the substrate, and a height of a top surface of the top plate relative to the substrate surface is larger, equal to, or less than that of an upper surface of the chip relative to the substrate surface.

18 . The electronic apparatus according to claim 16 , wherein the heat dissipation element is attached to the top surface of the top plate and the upper surface of the chip.

Assignees

• Realtek Semiconductor Corp

Inventors

• Lai Chao-Min

Classifications

• H05K9/0032

  having multiple parts, e.g. frames mating with lids · CPC title

• H05K7/20445

  the coupling element being an additional piece, e.g. thermal standoff · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K9/0088

  comprising a plurality of shielding layers; combining different shielding material structure · CPC title

• H05K1/02

  Details · CPC title