Heating or cooling apparatus-integrated heat sink for a computing device

Patent metadata

Field	Value
Publication number	US-11925003-B2
Application number	US-202217576700-A
Country	US
Kind code	B2
Filing date	Jan 14, 2022
Priority date	Jan 14, 2022
Publication date	Mar 5, 2024
Grant date	Mar 5, 2024

Abstract

A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

First claim

What is claimed is:

1. A computing device, comprising:
a heat dissipation component (HDC);
a heating or cooling apparatus, wherein the HCA comprises a heating or cooling component (HCC), wherein the HCC is affixed to a first surface of the HDC;
a resistive heater and a cooler,
wherein the resistive heater is affixed to a second surface of the HDC, wherein the resistive heater is made of silicon rubber or polyimide film,
wherein the cooler is affixed to a third surface of the HDC, wherein the cooler is made of the silicon rubber or the polyimide film; and

a printed circuit board (PCB), wherein the PCB comprises a PCB component, wherein the HDC is affixed to the PCB component and configured to heat or cool the PCB component,
wherein, when a first current temperature of the PCB component is below a first threshold, the HCC and the resistive heater are powered to heat the HDC and the PCB component, wherein the HCC is powered along a first direction to heat the HDC and the PCB component,
wherein, when a second current temperature of the PCB component is above a second threshold, the HCC and the cooler are powered to cool the HDC and the PCB component, wherein the HCC is powered along a second direction to cool the HDC and the PCB component, wherein the second direction is opposite to the first direction.

2. The computing device of claim 1 , wherein the HDC comprises a heat sink, wherein the HCC is affixed to a fin of the heat sink.

3. The computing device of claim 1 , wherein the HDC comprises a base, wherein the HCC is affixed to the base of the HDC.

4. The computing device of claim 1 , wherein the HDC, when heated by the HCC, transfers thermal energy to the PCB component.

5. The computing device of claim 1 , wherein the HDC, when cooled by the HCC, transfers thermal energy away from the PCB component.

6. The computing device of claim 1 , wherein the HDC comprises a pipe, wherein the pipe transfers thermal energy to a base of a heat sink.

7. The computing device of claim 1 , wherein the HCC operatively connected to a power connector, wherein the HCC receives power via the power connector.

8. The computing device of claim 7 , wherein the power connector is a blind-mate power connector.

9. The computing device of claim 1 , further comprising:
a temperature sensor, located within the computing device, operatively connected to a heating or cooling control component and configured to detect a temperature within the computing device,
wherein the heating or cooling control component is configured to initiate the activation of the HCC based on the temperature within the computing device.

10. The computing device of claim 1 , wherein the HCC is a thermoelectric cooler.

11. An information handling system, comprising:
a cabinet housing a plurality of computing devices;
the plurality of computing devices, wherein each of the computing devices comprises:
a heat dissipation component (HDC);
a heating or cooling apparatus (HCA), wherein the HCA comprises a heating or cooling component (HCC), wherein the HCC is affixed to a first surface of the HDC;

a resistive heater and a cooler,
wherein the resistive heater is affixed to a second surface of the HDC, wherein the resistive heater is made of silicon rubber or polyimide film,
wherein the cooler is affixed to a third surface of the HDC, wherein the cooler is made of the silicon rubber or the polyimide film; and

a printed circuit board (PCB), wherein the PCB comprises a PCB component, wherein the HDC is affixed to the PCB component and configured to heat or cool the PCB component,
wherein, when a first current temperature of the PCB component is below a first threshold, the HCC and the resistive heater are powered to heat the HDC and the PCB component, wherein the HCC is powered along a first direction to heat the HDC and the PCB component,
wherein, when a second current temperature of the PCB component is above a second threshold, the HCC and the cooler are powered to cool the HDC and the PCB component, wherein the HCC is powered along a second direction to cool the HDC and the PCB component, wherein the second direction is opposite to the first direction.

12. The information handling system of claim 11 , wherein the HDC comprises a heat sink, wherein the HCC is affixed to a fin of the heat sink.

13. The information handling system of claim 11 , wherein the HDC comprises a base, wherein the HCC is affixed to the base of the HDC.

14. The information handling system of claim 11 , wherein the HDC, when heated by the HCC, transfers thermal energy to the PCB component.

15. The information handling system of claim 11 , wherein the HDC, when cooled by the HCC, transfers thermal energy away from the PCB component.

16. The information handling system of claim 11 , wherein the HDC comprises a pipe, wherein the pipe transfers thermal energy to a base of a heat sink.

17. The information handling system of claim 11 , wherein the HCC operatively connected to a power connector, wherein the HCC receives power via the power connector.

18. The information handling system of claim 17 , wherein the power connector is a blind-mate power connector.

Assignees

• Dell Products Lp

Inventors

• Tunks Eric Michael
• Vivio Joseph Andrew
• Duncan Tyler Baxter

Classifications

• H10W40/28

  comprising Peltier coolers · CPC title

• H05K7/20509 Primary

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• G06F1/206

  comprising thermal management · CPC title

• H01L23/38

  Electricity · mapped topic

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title