Micro Heat Transfer Arrays, Micro Cold Plates, and Thermal Management Systems for Cooling Semiconductor Devices, and Methods for Using and Making Such Arrays, Plates, and Systems
US-2017092565-A1 · Mar 30, 2017 · US
3D printed cold plates and methods for cooling power devices embedded in 3D printed circuit boards
US11920877B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11920877-B2 |
| Application number | US-202117529423-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 18, 2021 |
| Priority date | Nov 18, 2021 |
| Publication date | Mar 5, 2024 |
| Grant date | Mar 5, 2024 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A system and method of forming integrated power electronic packages includes 3D-printing a cold plate having a hollow interior recess and a plurality of fins. The method includes printing, using a 3D printer, an electrical insulation layer and a conductor substrate onto a top surface of the cold plate, such that the electrical insulation layer and conductor substrate are embedded within the top surface of the cold plate. The method further includes embedding power devices in the conductor substrate, printing, using a 3D printer, a circuit board on and around the power devices, and mounting electronic components on the circuit board.
First claim
Opening claim text (preview).
What is claimed is: 1. A device comprising: a 3D printed cold plate having a hollow interior recess; a plurality of fins positioned within the hollow interior recess of the cold plate; and an inlet port and an outlet port fluidly coupled to the hollow interior recess of the cold plate; and a conductor substrate and an electrical insulation layer embedded into a top surface of the cold plate; wherein the device is a single monolithic structure. 2. The device of claim 1 , further comprising a power device embedded into the conductor substrate. 3. The device of claim 2 , further comprising a circuit board 3D printed on and around the power device, wherein the circuit board includes one or more insulating portions and one or more conductive portions. 4. The device of claim 3 , further comprising one or more electrical components mounted to the 3D printed circuit board. 5. The device of claim 1 , further comprising a flow channel within the hollow interior recess of the 3D printed cold plate. 6. The device of claim 5 , wherein the flow channel is a porous serpentine wall.
Assignees
Inventors
Classifications
by flowing liquids, e.g. forced water cooling · CPC title
the projecting parts being wire-shaped or pin-shaped · CPC title
- F28F3/12Primary
Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title
Products made by additive manufacturing · CPC title
Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title
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Frequently asked questions
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- What does patent US11920877B2 cover?
- A system and method of forming integrated power electronic packages includes 3D-printing a cold plate having a hollow interior recess and a plurality of fins. The method includes printing, using a 3D printer, an electrical insulation layer and a conductor substrate onto a top surface of the cold plate, such that the electrical insulation layer and conductor substrate are embedded within the top…
- Who is the assignee on this patent?
- Toyota Eng & Mfg North America
- What technology area does this patent fall under?
- Primary CPC classification F28F3/12. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Mar 05 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).