Core-shell nanoparticle having a nitrogen-vacancy nanodiamond core surrounded by an upconversion nanoparticle shell for enhanced quantum sensing and laser cooling
US-2026048154-A1 · Feb 19, 2026 · US
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Dede Ercan patents
Dede Ercan is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dede Ercan |
| Total patents | 35 |
| First publication | May 24, 2018 |
| Latest publication | Feb 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
In-mold coil repeater assembly for mobile device case
US-2026018925-A1 · Jan 15, 2026 · US
Fuel cell bipolar plate design for reduced corrosion potential
US-12482834-B2 · Nov 25, 2025 · US
3D printed cold plates and methods for cooling power devices embedded in 3D printed circuit boards
US-12385700-B2 · Aug 12, 2025 · US
Closed-loop real time SSVEP-based heads-up display to control in vehicle features using deep learning
US-12358370-B2 · Jul 15, 2025 · US
Systems and methods for cooling an electric charging cable
US-2025087386-A1 · Mar 13, 2025 · US
Airfoil fins for the passive cooling of electronic devices
US-2025088066-A1 · Mar 13, 2025 · US
Fluidic oscillators for the passive cooling of electronic devices
US-2025089203-A1 · Mar 13, 2025 · US
Autonomous vehicle feedback system and method of operating an autonomous vehicle
US-2024326825-A1 · Oct 3, 2024 · US
Systems and methods for additive manufacturing of wick structure for vapor chamber
US-12064708-B2 · Aug 20, 2024 · US
Recent patents
Latest publications not already listed above.
3d printed cold plates and methods for cooling power devices embedded in 3d printed circuit boards
US-2024230248-A1 · Jul 11, 2024 · US
Closed-loop real time ssvep-based heads-up display to control in vehicle features using deep learning
US-2024198798-A1 · Jun 20, 2024 · US
Channel width control for multi-zone microreactor flow fields
US-2024119185-A1 · Apr 11, 2024 · US
3D printed cold plates and methods for cooling power devices embedded in 3D printed circuit boards
US-11920877-B2 · Mar 5, 2024 · US
Power device assemblies having embedded PCBS and enhanced cooling and methods of fabricating the same
US-11910521-B2 · Feb 20, 2024 · US
Fuel cell bipolar plate design for reduced corrosion potential
US-2024039016-A1 · Feb 1, 2024 · US
Power electronics assemblies and methods of fabricating the same
US-11856689-B2 · Dec 26, 2023 · US
Power device assemblies having embedded pcbs and enhanced cooling and methods of fabricating the same
US-2023300972-A1 · Sep 21, 2023 · US
Power electronics assemblies and methods of fabricating the same
US-2023284377-A1 · Sep 7, 2023 · US
Hardmask to substrate pattern transfer method for Microfabrication of micro to mesoscale, high aspect ratio, multi-level, 3D Structures
US-2023197448-A1 · Jun 22, 2023 · US
3d printed cold plates and methods for cooling power devices embedded in 3d printed circuit boards
US-2023152047-A1 · May 18, 2023 · US
Systems including a power device-embedded PCB directly joined with a cooling assembly and method of forming the same
US-11582866-B1 · Feb 14, 2023 · US
Systems including a power device-embedded pcb directly joined with a cooling assembly and method of forming the same
US-2023022829-A1 · Jan 26, 2023 · US
Functionally graded thermal vias for inductor winding heat flow control
US-11545297-B2 · Jan 3, 2023 · US
Volumetric accessing of a volumetric display
US-11153556-B1 · Oct 19, 2021 · US
Volumetric accessing of a volumetric display
US-2021306620-A1 · Sep 30, 2021 · US
Systems and methods for additive manufacturing of wick structure for vapor chamber
US-2021161029-A1 · May 27, 2021 · US
Functionally graded thermal vias for inductor winding heat flow control
US-2020388432-A1 · Dec 10, 2020 · US
Electronic assemblies having a cooling chip layer with impingement channels and through substrate vias
US-10566265-B2 · Feb 18, 2020 · US
Systems and methods for additive manufacturing of wick structure for vapor chamber
US-2019082560-A1 · Mar 14, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Toyota Eng & Mfg North America | 34 |
| Toyota Motor Co Ltd | 5 |
| Univ Of Connecticut Health Center | 2 |
| Univ Of Colorado Boulder | 2 |
| Univ Leland Stanford Junior | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K7/20927 | 12 |
| H10W40/47 | 8 |
| H10W40/228 | 8 |
| H05K7/20254 | 8 |
| B33Y80/00 | 7 |