Highly modularized cooling system design

US11920867B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11920867-B2
Application numberUS-202017003488-A
CountryUS
Kind codeB2
Filing dateAug 26, 2020
Priority dateAug 26, 2020
Publication dateMar 5, 2024
Grant dateMar 5, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A modular cooling system for data center. An airflow section forms a duct for air flow and a plurality of core units are serially attached to each other and to the airflow section. A blower unit is attached to each of the core units. A plurality of motorized dampers are provided: between each of the core units and the airflow unit, in between each two core units, and between each core unit and its corresponding blower unit. A plurality of fluid ports are attached to each of the core units. At least one of the core units is loaded with one or more equipment selected from: air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, a cooling tower or other types of cooling equipment. A combination operation of the components on the compartment and the cooling units enables fast deployment and operation.

First claim

Opening claim text (preview).

What is claimed is: 1. A modular cooling system for data center, comprising: an airflow section forming a duct for air flow; a plurality of core units serially attached to each other to form a linear assembly and the linear assembly attached to the airflow section; a plurality of blower units, each blower unit attached to one of the core units; a plurality of motorized dampers, the plurality of motorized dampers including at least one motorized damper provided between each core unit and the airflow section and at least one motorized damper provided between each pair of serially attached core units; a plurality of fluid ports attached to each of the core units; and wherein at least one of the core units is loaded with one or more equipment. 2. The modular cooling system of claim 1 , wherein the equipment is selected from: an air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, water spray system and a cooling tower. 3. The modular cooling system of claim 1 , wherein one of the core units is loaded with an air filter and a humidifier/dehumidifier unit. 4. The modular cooling system of claim 1 , wherein one of the core units is loaded with a water reservoir and a pump, a second core unit is loaded with an air-to-air heat exchanger and a condenser with a water spray arrangement, and a third core unit is loaded with an evaporator thereby forming an indirect evaporative cooling system. 5. The modular cooling system of claim 4 , wherein the water spray arrangement is connected to the pump through the fluid ports. 6. The modular cooling system of claim 1 , wherein one of the core units is loaded with a water reservoir and a pump, a second core unit is loaded with an air-to-air heat exchanger with a water spray arrangement, and a third core unit is loaded with an evaporator and a condenser, thereby forming an indirect evaporative cooling system. 7. The modular cooling system of claim 1 , wherein a first core unit is loaded with a cooling tower, a second core unit is loaded with a chiller, and a third core unit is loaded with a CRAC unit, thereby forming a CRAC system with a chilled water loop. 8. The modular cooling system of claim 1 , wherein a first core unit is loaded with a cooling tower and a second core unit is loaded with a chiller connected to a cooling water loop. 9. The modular cooling system of claim 7 , wherein the chiller is connected to the cooling tower through the fluid ports. 10. The modular cooling system of claim 1 , wherein at least one core unit is loaded with a dry air cooler and having an ambient air inlet flowing ambient air through the dry air cooler, thereby providing cooling water. 11. A method for assembling a cooling system for data center, comprising: attaching a plurality of core units to an airflow section, the airflow section forming a duct for air flow, wherein the plurality of core units are serially attached to each other to form a linear assembly; attaching a plurality of blower units, wherein one blower unit is attached to each of the core units; attaching a plurality of fluid ports to each of the core units; attaching a plurality of motorized dampers, wherein at least one motorized damper is attached between each core unit and the airflow section and at least one motorized damper is attached between each pair of serially attached core units; and loading at least one of the core units with equipment. 12. The method of claim 11 , wherein the equipment is selected from: an air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, water spray system and a cooling tower. 13. The method of claim 11 , comprising loading one of the core units with an air filter and a humidifier/dehumidifier unit, thereby forming an ambient air cooling system. 14. The method of claim 11 , comprising: loading one of the core units with a water reservoir and a pump, loading a second core unit with an air-to-air heat exchanger and a condenser with a water spray arrangement, and loading a third core unit with an evaporator, thereby forming an indirect evaporative cooling system. 15. The method of claim 14 , further comprising connecting the water spray arrangement to the pump through the fluid ports. 16. The method of claim 11 , comprising loading one of the core units with a water reservoir and a pump, loading a second core unit with an air-to-air heat exchanger with a water spray arrangement, and loading a third core unit with an evaporator and a condenser, thereby forming an indirect evaporative cooling system. 17. The method of claim 11 , comprising loading a first core unit with a cooling tower, loading a second core unit with a chiller, and loading a third core unit with a CRAC unit, thereby forming a CRAC system with a chilled water loop. 18. The method of claim 11 , comprising loading a first core unit with a cooling tower and a second core unit with a chiller connected to a cooling water loop. 19. The method of claim 17 , comprising connecting the chiller to the cooling tower through the fluid ports. 20. The method of claim 11 , further comprising: configuring operation modes, wherein each operation mode includes indication comprising cooling equipment operation, blower operation, and louver operation; selecting an operation mode according to cooling requirements and prevailing conditions; activating cooling equipment, blowers and louvers according to the selected operation mode; and, monitoring cooling requirements and prevailing conditions to determine whether to change the selected operation mode and, if a change in the selected operation mode is determined, activating cooling equipment, blowers and louvers according to a newly selected operation mode.

Assignees

Inventors

Classifications

  • F28B7/00Primary

    Combinations of two or more condensers, e.g. provision of reserve condenser · CPC title

  • using air or other gas as the cooling medium · CPC title

  • for feeding gas or vapour · CPC title

  • specially adapted for cooling towers · CPC title

  • Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

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What does patent US11920867B2 cover?
A modular cooling system for data center. An airflow section forms a duct for air flow and a plurality of core units are serially attached to each other and to the airflow section. A blower unit is attached to each of the core units. A plurality of motorized dampers are provided: between each of the core units and the airflow unit, in between each two core units, and between each core unit and …
Who is the assignee on this patent?
Baidu Usa Llc
What technology area does this patent fall under?
Primary CPC classification F28B7/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Mar 05 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).