System and method for the repair of serially connected display elements

Patent metadata

Field	Value
Publication number	US-11916163-B2
Application number	US-202117464892-A
Country	US
Kind code	B2
Filing date	Sep 2, 2021
Priority date	Oct 31, 2014
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

A system and method are provided for repairing an emissive element display. If a defective emissive element is detected in a subpixel, a subpixel repair interface isolates the defective emissive element. The repair interface may be a parallel repair interface with n number of selectively fusible electrically conductive repair nodes, connected in parallel to a control line of the matrix. Alternatively, the repair interface may be a series repair interface with m number of repair nodes, selectively connectable to bypass adjacent (defective) series-connected emissive elements. If the subpixel emissive elements are connected in parallel, and a defective low impedance emissive element is detected, a parallel repair interface fuses open a connection between the defective emissive element and a matrix control line. If the subpixels include series-connected emissive elements, and a high impedance emissive element is detected, a series repair interface forms a connection bypassing the defective emissive element.

First claim

We claim:

1. A display with emissive element repair interfaces, the display comprising:
a substrate with a top surface;
a matrix of electrically conductive control lines;
an array of emissive element pixels, each pixel comprising a plurality of subpixels;
each subpixel configured to accept a plurality of serially connected emissive elements, and selectively engageable in response to signals on the control lines; and,
each subpixel comprising a plurality of repair nodes, each repair node selectively connectable to bypass a corresponding emissive element.

2. The display of claim 1 wherein each repair node comprises a first pad interface connected to a first contact of a corresponding emissive element, a second pad interface connected to a second contact of the corresponding emissive element, and wherein the first and second pad interfaces are configured to be selectively connectable with a conductive link.

3. The display of claim 2 further comprising:
a dielectric layer overlying the substrate top surface; and,
wells in the dielectric layer, each well formed to accept an emissive element.

4. The display of claim 3 further comprising:
access openings in the dielectric layer exposing each repair node.

5. The display of claim 2 wherein each subpixel comprises a first emissive element with a first contact connected to a first control line, and an nth emissive element with a second contact connected to a second control line.

6. The display of claim 2 wherein the emissive elements and repair node pad interfaces are formed on the substrate top surface.

7. The display of claim 6 further comprising:
a dielectric layer overlying the substrate top surface; and,
wells in the dielectric layer, each well formed to accept an emissive element.

8. The display of claim 2 further comprising:
a dielectric layer overlying the substrate top surface;
wells in the dielectric layer, each well formed to accept an emissive element; and,
wherein the repair node pad interfaces are formed on the dielectric layer top surface.

9. The display of claim 2 wherein a first subpixel includes a high impedance defective first emissive element, where a high impedance defective emissive element is selected from the group consisting of an emissive element creating an electrical open circuit or a missing emissive element; and,
wherein a first repair node pad interfaces associated with the defective first emissive element are electrically connected to bypass the defective first emissive element.

10. The display of claim 2 wherein each subpixel is configured to accept n number of serially connected emissive elements and n number of repair nodes; and, wherein the first contact of the first emissive element is selectively
connectable to each contact of every emissive element in the subpixel through the repair nodes.

11. The display of claim 1 further comprising:
emissive elements populating the subpixels.

12. The display of claim 11 wherein the emissive elements are selected from the group consisting of surface mount emissive elements and vertical emissive elements.

13. A method for repairing an emissive element display, the method comprising:
providing a substrate with a matrix of emissive element control lines;
forming an array of subpixels, with contacts for serially connected emissive elements and repair nodes, electrically connected to the matrix of control lines;
populating the subpixels with emissive elements;
detecting a high impedance defective emissive element in a first subpixel; and
enabling a first subpixel repair node to bypass the defective emissive element.

14. The method of claim 13 wherein forming the array of emissive element subpixels with repair nodes includes forming each repair node with a first pad interface connected to a first contact of a corresponding emissive element, a second pad interface connected to a second contact of the corresponding emissive element; and,
wherein enabling the first repair node includes electrically connecting the first and second pad interfaces of the first repair node with a conductive link.

15. The method of claim 14 further comprising:
prior to populating the subpixels with emissive elements, forming a dielectric layer overlying a top surface of the substrate; and,
forming wells in the dielectric layer, each well configured to accept an emissive element.

16. The method of claim 15 further comprising:
forming access openings in the dielectric layer exposing each repair node.

17. The method of claim 15 wherein forming the array of subpixels includes forming the emissive elements and repair node pad interfaces on the substrate top surface.

18. The method of claim 15 wherein forming the array of subpixels includes forming the repair node pad interfaces on the dielectric top surface.

19. The method of claim 14 wherein forming the array of subpixels includes forming the emissive elements and repair node pad interfaces on the substrate top surface.

20. A display backlight with emissive element repair interfaces, the backlight comprising:
a substrate with a top surface;
a matrix of electrically conductive control lines;
an array of emissive element pixels, each pixel comprising a plurality of subpixels;
each subpixel configured to accept a plurality of serially connected emissive element strings, each string connected in parallel, and wherein each subpixel is selectively engageable in response to signals on the control lines; and,
each subpixel comprising a plurality of repair nodes, each repair node selectively connectable to bypass a corresponding emissive element.

21. The backlight of claim 20 wherein at least one serially connected emissive element string includes a laser fusible link connecting the second contact of a first emissive element to the first contact of an adjacent serially connected second emissive element.

Assignees

• Elux Inc

Inventors

• Lee Jong-Jan
• Schuele Paul J

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/831

  characterised by their shape · CPC title

• H10H20/821

  of the light-emitting regions, e.g. non-planar junctions · CPC title

• H10H20/01

  Manufacture or treatment · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title