Electronic device including heat dissipation structure

Patent metadata

Field	Value
Publication number	US-11910516-B2
Application number	US-201917293280-A
Country	US
Kind code	B2
Filing date	Nov 8, 2019
Priority date	Nov 12, 2018
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

First claim

The invention claimed is:

1. An electronic device comprising:
a first printed circuit board arranged in a first direction;
a first thermal diffusion member including at least one of a heat pipe or a vapor chamber and arranged in parallel to the first printed circuit board;
a second printed circuit board arranged in a second direction substantially perpendicular to the first direction to be separated from the first printed circuit board and electrically connected to the first printed circuit board; and
a heat transfer member including
at least one partial area arranged to face the first thermal diffusion member and
at least one other partial area arranged to face one surface of the second printed circuit board,
wherein the at least one other partial area of the heat transfer member is bent from the at least one partial area of the heat transfer member.

2. The electronic device of claim 1 , wherein the first printed circuit board includes a first communication circuit arranged thereon, and
wherein the second printed circuit board includes a second communication circuit arranged thereon.

3. The electronic device of claim 2 , wherein the second communication circuit is arranged on the one surface of the second printed circuit board, and
wherein the second communication circuit includes at least one antenna arranged on another surface thereof.

4. The electronic device of claim 1 , wherein an area provided by bending at least a portion of the heat transfer member is arranged to face the one surface of the second printed circuit board, and
wherein at least a portion of another area of the heat transfer member is arranged to face the first thermal diffusion member so as to form a heat transfer path that transfers heat generated from the one surface of the second printed circuit board to the first thermal diffusion member.

5. The electronic device of claim 1 , further comprising:
at least one electronic element arranged on the first printed circuit board;
at least one other electronic element arranged on the second printed circuit board; and
a second thermal diffusion members,
wherein the heat transfer member comprises:
a first heat transfer area arranged in a first direction to correspond to one surface of the at least one other electric element;
a second heat transfer area arranged in the first direction to be stepped from the first heat transfer area; and
a third heat transfer area arranged between the first and second heat transfer areas and bent from the first heat transfer area to a second direction perpendicular to the first,
wherein a first surface of the first heat transfer area is arranged to correspond to one surface of the first printed circuit board, a second surface of the first heat transfer area opposite to the first surface of the first heat transfer area is arranged to correspond to the one surface of the second printed circuit board,
wherein a first surface of the second heat transfer area is arranged to correspond to one surface of the first thermal diffusion member and a second surface of the second heat transfer area opposite to the first surface of the second heat transfer area is arranged to correspond to one surface of the second thermal diffusion member, and
wherein the third heat transfer area interconnects the first and second heat transfer areas, which are arranged to be stepped.

6. The electronic device of claim 5 , wherein the second printed circuit board includes at least one of an antenna modem or an antenna module,
wherein the second printed circuit board includes an antenna array and a communication module,
wherein the second printed circuit board includes a shield member that surrounds the communication module, and
wherein one surface of the shield member includes an antenna-side heat transfer member facing the first surface of the first heat transfer area.

7. The electronic device of claim 5 , wherein the third heat transfer area includes a bending member, and
wherein a shape of the bending member includes at least one of an “L” shape, a “Z” shape, or a thunderbolt shape.

8. The electronic device of claim 5 , wherein
the second thermal diffusion member includes at least one of a heat pipe or a vapor chamber.

9. The electronic device of claim 8 , wherein the vapor chamber includes a chamber heat transfer member arranged to correspond to the first surface of the second heat transfer area, and
a chamber body configured to diffuse or disperse heat transferred to the chamber heat transfer member.

10. The electronic device of claim 5 , wherein the first and second thermal diffusion members include at least one of copper or a ceramic material.

11. The electronic device of claim 1 , wherein:
the second printed circuit board includes a plurality of electric elements arranged in the second direction perpendicular to the first direction,
the heat transfer member includes first and second heat transfer areas arranged in the second direction to correspond to one surfaces of the plurality of electric elements, a third heat transfer area connected to the first heat transfer area and arranged in the first direction, and a fourth heat transfer area interconnecting the second heat transfer area and the third heat transfer area; and
the first thermal diffusion member connected to the third heat transfer area.

12. The electronic device of claim 11 , wherein the plurality of electric elements include at least one of a modular antenna modem or an antenna module.

13. The electronic device of claim 11 , wherein
the first thermal diffusion member is configured to diffuse or disperse heat transferred from the plurality of electric elements to the first, second, third, and fourth heat transfer areas.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Moon Hongki
• Park Yoonsun
• Kang Seunghoon
• Koo Kyungha
• Jang Seyoung
• Jung Woojune

Classifications

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K1/14

  Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K2201/064

  Fluid cooling, e.g. by integral pipes · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title