Electronic device having heat collection/diffusion structure

Patent metadata

Field	Value
Publication number	US-2019364695-A1
Application number	US-201916515275-A
Country	US
Kind code	A1
Filing date	Jul 18, 2019
Priority date	Feb 18, 2016
Publication date	Nov 28, 2019
Grant date	—

Abstract

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

First claim

1 . An apparatus comprising:
at least one electronic component configured to generate heat; a structure comprising thermal interfacing material (TIM) disposed directly above the electronic component configured to receive the heat from the at least one electronic component; and a heat pipe having a first end and a second end, wherein the first end is disposed directly above the structure comprising TIM to receive the heat from the structure comprising TIM, and wherein the heat pipe is configured to transfer the heat from the first end to the second end.

2 . The apparatus of claim 1 , wherein the structure comprising TIM comprises:
a first layer of TIM disposed directly above the at least one electronic component; a shield cover disposed directly above the first layer of TIM; and a second layer of TIM disposed directly above the shield cover.

3 . The apparatus of claim 2 , wherein the first layer of TIM includes liquid TIM and wherein the second layer of TIM includes solid TIM.

4 . The apparatus of claim 1 , wherein the structure comprising TIM comprises:
at least one layer of TIM disposed directly above the at least one electronic component; and a heat collecting element directly above one of the at least one layer of TIM.

5 . The apparatus of claim 4 , wherein the heat collecting element comprises copper.

6 . The apparatus of claim 1 , further comprising:
a support structure disposed on a first side and a second side of the heat pipe.

7 . The apparatus of claim 6 , wherein the support structure comprises an opening proximate to the heat pipe, and wherein the heat pipe is configured to transfer at least some of the heat towards the opening.

8 . The apparatus of claim 1 , wherein the at least one electronic component comprises at least one of an application processor, a power amplifier, or memory.

9 . An apparatus comprising:
a printed circuit board (PCB); an application processor mounted on the PCB; a layer of thermal interfacing material (TIM) disposed directly on the application processor, such that the application processor is disposed between the PCB and the layer of TIM, and the TIM is configured to receive heat generated by the application processor; a heat collection device disposed directly on the TIM, such that the TIM is disposed directly between the application processor and the heat collection device, and the heat collection device is configured to receive heat from the TIM; and a heat pipe having a first end and a second end, wherein the first end is disposed directly on the heat collection device, such that the heat collection device is between the first end of the heat pipe and the layer of TIM, and wherein the heat pipe is configured to receive heat from the heat collection device at the first end transfer the heat from the first end to the second end.

10 . The apparatus of claim 9 , wherein the heat collection device comprises a copper plate.

11 . The apparatus of claim 9 , further comprising:
a bracket disposed on the heat collection device, wherein the bracket comprises a recess, and wherein the at least the first end of the heat pipe is disposed on the recess.

12 . A portable communication device comprising:
a display; a printed circuit board disposed below the display; an electronic component disposed on a face, of the printed circuit board, directed toward the display; a first thermal interfacing material disposed on the electronic component; a shielding member enclosing at least a portion of the electronic component and at least a portion of the first thermal interfacing material so as to shield an electromagnetic interference associated with the electronic component; a second thermal interfacing material disposed on the shielding member; a heat pipe disposed over the shielding member so at to receive at least a portion of heat radiated from the electronic component through the first thermal interfacing material, the shielding member and the second thermal interfacing material; and a support member enclosing at least a portion of the heat pipe and supporting the display.

13 . The portable communication device of claim 12 , wherein the shielding member covers at least a portion of at least one side face of the electronic component and at least a portion of a top face of the first thermal interfacing material.

14 . The portable communication device of claim 12 , wherein the shielding member includes a frame part which is located substantially perpendicular to the printed circuit board and a cover part which is located substantially parallel to the printed circuit board,
wherein the frame part is spaced apart from one corresponding a side face of the electronic component, and wherein an inner area of the cover part is contact with the first thermal interfacing material.

15 . The portable communication device of claim 14 , wherein at least a portion of an outer area, of the cover part, enclosing the inner area is contact with the frame part.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Haejin
• Koo Kyungha
• Jung Chunghyo
• Jang Se-Young
• Bang Jungje
• Ye Jaeheung
• Cho Chi-Hyun

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28D15/0233

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K9/0007

  Casings (standardised racks H05K9/0062) · CPC title