Method for manufacturing optical device and optical device

Patent metadata

Field	Value
Publication number	US-11909172-B2
Application number	US-202117141223-A
Country	US
Kind code	B2
Filing date	Jan 5, 2021
Priority date	Jan 8, 2020
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

An object of the present invention is to provide a method for manufacturing an optical device having a laser diode, which method is suitable for mass production, and an optical device having a laser diode which allows accurate property evaluations thereof with small measurement errors. Specifically, the method includes: an etching process of etching a semiconductor lamination unit to form a mesa structure having a resonator end face, thereby forming a laser diode; and a reflecting layer forming process of forming a light reflecting layer such that the light reflecting layer covers entire side surfaces of the mesa structure, wherein the semiconductor lamination unit has a substate, a n-type clad layer including a nitride semiconductor layer having n-type conductivity, a light-emitting layer including at least one quantum well, and a p-type clad layer including a nitride semiconductor layer having p-type conductivity, laminated in this order.

First claim

The invention claimed is:

1. An optical device having a laser diode, wherein the laser diode comprises:
a substrate;
a n-type clad layer formed on the substrate and including a nitride semiconductor layer having n-type conductivity;
a light-emitting layer formed on the n-type clad layer and including at least one quantum well;
a p-type clad layer formed on the light-emitting layer and including a nitride semiconductor layer having p-type conductivity, and
a photodetector formed on the substrate, having a mesa structure and capable of receiving and detecting light emitted from the laser diode,
wherein at least a portion of the n-type clad layer, the light-emitting layer and the p-type clad layer constitute a mesa structure having a resonator end face, and entire side surfaces of the mesa structure are covered with a light reflecting layer,

wherein all side surfaces of the mesa structure of the photodetector are covered with the light reflecting layer, and
where a light reflectance of the light reflecting layer is 50% or more with respect to a desired wavelength.

2. The optical device of claim 1 , wherein a laser beam receiving face of the photodetector is positioned to be opposed to a main laser beam emitting face of the laser diode.

3. The optical device of claim 1 , comprising a plurality of the laser diodes.

4. The optical device of claim 1 , wherein the p-type clad layer includes: a p-type longitudinally conductive layer containing Al s Ga 1-s N(0.3≤s≤1), having film thickness smaller than 0.5 μm and a graded Al composition “s” which decreases in the direction away from the top surface of the substrate; and a p-type transversely conductive layer composed of Al t Ga 1-t N(0<t≤1).

5. The optical device of claim 1 , wherein the light reflecting layer is a dielectric lamination film.

6. The optical device of claim 1 , wherein the light reflecting layer is made of oxide of at least one selected from the group consisting of aluminum, hafnium, silicon, titanium, zirconium, lead, and gallium.

7. The optical device of claim 5 , wherein the dielectric lamination film is a lamination film in which a hafnium oxide film and an aluminum oxide film are laminated at ≥1 lamination cycle.

8. The optical device of claim 1 , wherein the substrate is an AlN substrate and an angle formed by a surface adjacent to the resonator end face, of the light reflecting layer, with respect to the (0001) plane of the AlN substrate is in the range of ≥85° and ≤95°.

9. The optical device of claim 1 , wherein the n-type clad layer, the light-emitting layer and the p-type clad layer are AlGaN layers and the (1-100) plane of the AlGaN layers constitutes the resonator end face.

Assignees

• Asahi Chemical Ind
• National Univ Corporation Tokai National Higher Education And Research System

Inventors

• Zhang Ziyi
• Kushimoto Maki
• Amano Hiroshi

Classifications

• H01S5/0264 Primary

  for monitoring the laser-output · CPC title

• H01S5/0201

  Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth · CPC title

• H01S5/0287

  Facet reflectivity · CPC title

• H01S5/22

  having a ridge or stripe structure · CPC title

• H01S5/4031

  Edge-emitting structures · CPC title