Controlling beam divergence in a vertical-cavity surface-emitting laser

Patent metadata

Field	Value
Publication number	US-11088508-B2
Application number	US-201715688218-A
Country	US
Kind code	B2
Filing date	Aug 28, 2017
Priority date	Aug 28, 2017
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

In some implementations, a vertical cavity surface emitting laser (VCSEL) includes a substrate layer and epitaxial layers on the substrate layer. The epitaxial layers may include an active layer, a first mirror, a second mirror, and one or more oxidation layers. The active layer may be between the first mirror and the second mirror, and the one or more oxidation layers may be proximate to the active layer. The one or more oxidation layers may be configured to control beam divergence of a laser beam emitted by the VCSEL based on at least one of: a quantity of the one or more oxidation layers, a shape of the one or more oxidation layers, a thickness of the one or more oxidation layers, or a proximity of the one or more oxidation layers to the active layer.

First claim

What is claimed is:

1. A vertical cavity surface emitting laser (VCSEL), comprising:
a substrate layer; and
epitaxial layers on the substrate layer,
the epitaxial layers including an active layer, a first mirror, a second mirror, and an oxidation layer,
wherein the active layer is between the first mirror and the second mirror,
wherein the oxidation layer includes a first oxidation layer and a second oxidation layer,
wherein the second oxidation layer is a closest oxidation layer to the active layer and the substrate layer,
wherein the first oxidation layer includes a first tapered end that is tapered from a farthest side from the substrate layer to a closest side to the substrate layer,
wherein a taper length of the first tapered end is between 0.5 and 2 micrometers,
wherein the first oxidation layer has a first aperture size at the farthest side from the substrate layer and a second aperture size at the closest side to the substrate layer,
the first aperture size being less than the second aperture size,

wherein the second oxidation layer is located between the first oxidation layer and the active layer,
wherein the first tapered end of the first oxidation layer has greater than or equal to a threshold degree of tapering and a second end of the second oxidation layer has less than the threshold degree of tapering, and
wherein the oxidation layer is configured to control beam divergence of a laser beam emitted by the VCSEL based on:
a proximity of the oxidation layer to the active layer.

2. The VCSEL of claim 1 , wherein the first oxidation layer is configured to create an effective refractive index step, between an active region of the active layer and an oxidation area associated with the first oxidation layer, to form a wide beam divergence of the laser beam when compared to a beam divergence created by a differently configured oxidation layer.

3. The VCSEL of claim 1 , wherein the oxidation layer includes a third oxidation layer to control the beam divergence.

4. The VCSEL of claim 1 , wherein a shape of at least one of the first oxidation layer or the second oxidation layer is configured to further control the beam divergence.

5. The VCSEL of claim 1 , wherein a thickness of at least one of the first oxidation layer or the second oxidation layer is configured to further control the beam divergence.

6. The VCSEL of claim 1 , wherein the proximity of the oxidation layer to the active layer is configured to control the beam divergence.

7. The VCSEL of claim 1 , wherein the VCSEL is a top emitting VCSEL.

8. The VCSEL of claim 1 , wherein the VCSEL is a bottom emitting VCSEL.

9. The VCSEL of claim 1 , wherein the second end of the second oxidation layer is not tapered.

10. A method of controlling beam divergence in a vertical cavity surface emitting laser (VCSEL), comprising:
forming, on a substrate layer of the VCSEL, an active layer, a first mirror, and a second mirror,
wherein the active layer is formed between the first mirror and the second mirror; and

forming an oxidation layer that includes a first oxidation layer and a second oxidation layer,
wherein the second oxidation layer is a closest oxidation layer to the active layer and the substrate layer,
wherein the first oxidation layer includes a first tapered end that is tapered from a farthest side from the substrate layer to a closest side to the substrate layer,
wherein a taper length of the first tapered end is between 0.5 and 2 micrometers,
wherein the first oxidation layer has a first aperture size at the farthest side from the substrate layer and a second aperture size at the closest side to from the substrate layer,
the first aperture size being less than the second aperture size,

wherein the second oxidation layer is located between the first oxidation layer and the active layer,
wherein the first tapered end of the first oxidation layer has greater than or equal to a threshold degree of tapering and a tapered end of the second oxidation layer has less than the threshold degree of tapering, and
wherein the oxidation layer is configured to control beam divergence of a laser beam emitted by the VCSEL based on:
a proximity of the oxidation layer to the active layer.

11. The method of claim 10 , wherein the first oxidation layer is configured to create a relatively large effective refractive index step, proximate to an active region of the active layer, to form a relatively wide beam divergence of the laser beam when compared to a beam divergence created by a differently configured oxidation layer.

12. The method of claim 10 , wherein the first oxidation layer is configured to create a relatively small effective refractive index step, proximate to an active region of the active layer, to form a relatively narrow beam divergence of the laser beam when compared to a beam divergence created by a differently configured oxidation layer.

13. The method of claim 10 , wherein the VCSEL is a top emitting VCSEL.

14. A vertical cavity surface emitting laser (VCSEL) wafer, comprising:
a substrate layer; and
epitaxial layers on the substrate layer,
wherein the epitaxial layers include:
an active layer between a first mirror and a second mirror,
a first oxidation layer configured to control beam divergence of an emitted laser beam by controlling an effective refractive index step proximate to an active region of the active layer based on:
a proximity of the first oxidation layer to the active region of the active layer,

wherein the first oxidation layer includes a first tapered end that is tapered from a farthest side from the substrate layer to a closest side to the substrate layer,
wherein a taper length of the first tapered end is between 0.5 and 2 micrometers,
wherein the first oxidation layer has a first aperture size at the farthest side from the substrate layer and a second aperture size at the closest side to from the substrate layer,
the first aperture size being less than the second aperture size and,

a second oxidation layer located between the first oxidation layer and the active layer,
wherein the second oxidation layer is a closest oxidation layer to the active layer and the substrate layer, and
wherein the first tapered end of the first oxidation layer has greater than or equal to a threshold degree of tapering and a tapered end of the second oxidation layer has less than the threshold degree of tapering.

15. The VCSEL wafer of claim 14 , wherein the epitaxial layers further include:
a third oxidation layer to control the beam divergence.

16. The VCSEL wafer of claim 14 , wherein the VCSEL is a top emitting VCSEL or a bottom emitting VCSEL.

17. The VCSEL wafer of claim 14 , wherein the beam divergence is further controlled based on a shape of the first oxidation layer.

18. The VCSEL wafer of claim 14 , wherein the beam divergence is further controlled based on a thickness of the first oxidation layer.

19. The VCSEL wafer of claim 14 , wherein the beam divergence is controlled based on the proximity of the first oxidation layer to the active region of the active layer.

20. The VCSEL wafer of claim 14 , wherein the first oxidation layer is configured to create an effective refractive index step, between the active region of the active layer and an oxidation area associated with the first oxidation layer, to form a wide beam divergence of the emitted laser beam when compared to a beam divergence created by a differently configured oxidation layer.

Assignees

• Lumentum Operations Llc

Inventors

• Yuen Albert
• Barve Ajit Vijay
• Zhao Guowei
• Hegblom Eric R

Classifications

• H10H20/8142

  forming resonant cavity structures · CPC title

• H01S2301/16

  Semiconductor lasers with special structural design to influence the modes, e.g. specific multimode · CPC title

• H01S5/18311 Primary

  using selective oxidation · CPC title

• H01S2301/176

  Specific passivation layers on surfaces other than the emission facet · CPC title

• H01S2301/18

  Semiconductor lasers with special structural design for influencing the near- or far-field · CPC title