Infrared sensor, infrared sensor array, and method of manufacturing infrared sensor

Patent metadata

Field	Value
Publication number	US-11906363-B2
Application number	US-202117347470-A
Country	US
Kind code	B2
Filing date	Jun 14, 2021
Priority date	Feb 28, 2019
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

An infrared sensor includes: a base substrate; a bolometer infrared receiver; a first beam; and a second beam. Each of the first and second beams has a connection portion connected to the base substrate and/or a member on the base substrate and a separated portion away from the base substrate, and is physically joined to the infrared receiver at the separated portion. The infrared receiver is supported by the first and second beams to be away from the base substrate. The infrared receiver includes a resistance change portion including a resistance change material the electrical resistance of which changes with temperature. The resistance change portion includes an amorphous semiconductor, and the first and second beams include a crystalline semiconductor made of the same base material as the resistance change material, and is electrically connected to the resistance change portion at the separated portion.

First claim

What is claimed is:

1. An infrared sensor comprising:
a base substrate;
an infrared receiver;
a first beam; and
a second beam, wherein:
each of the first beam and the second beam has a connection portion connected to the base substrate and/or a member on the base substrate and a separated portion away from the base substrate, and is physically joined to the infrared receiver at the separated portion,
the infrared receiver is supported by the first beam and the second beam to be away from the base substrate,
the infrared receiver includes a resistance change portion including a resistance change material an electrical resistance of which changes with temperature,
the resistance change portion includes an amorphous semiconductor,
each of the first beam and the second beam includes a crystalline semiconductor made of a base material same as a base material of the resistance change material, and is electrically connected to the resistance change portion at the separated portion,
the first beam and the second beam are doped with impurities,
a concentration of the impurities, with which the first beam and the second beam are doped, changes continuously at an interface between each of the first and second beams and the resistance change portion along a direction normal to the interface,
in a vicinity of the interface, a gradient of the concentration of the impurities, with which the first beam and the second beam are doped, along the direction normal to the interface is smaller than or equal to 10 18 cm −3 /nm, and
the vicinity of the interface is an area from the interface to a region a specified distance away from the interface in the direction normal to the interface.

2. The infrared sensor according to claim 1 , wherein
the base material is silicon or silicon germanium.

3. The infrared sensor according to claim 1 , wherein
the infrared receiver further includes an insulation layer and an infrared absorbing layer, and
the insulation layer is disposed on the resistance change portion and the infrared absorbing layer is disposed on the insulation layer.

4. The infrared sensor according to claim 1 , wherein
the resistance change portion is an amorphous region of a semiconductor layer including the base material and the first and second beams are crystalline regions of the semiconductor layer including the base material.

5. The infrared sensor according to claim 1 , further comprising:
a first prop and a second prop disposed on the base substrate and extending in a direction away from an upper surface of the base substrate, wherein
the first prop and the second prop are electrically conductive,
the first beam is connected to the first prop at the connection portion,
the second beam is connected to the second prop at the connection portion, and
the infrared receiver, the first beam, and the second beam are suspended over the base substrate by the first prop and the second prop in cross-sectional view.

6. The infrared sensor according to claim 1 , wherein
the base substrate has a recess,
the recess is positioned between the base substrate and the infrared receiver, the separated portion of the first beam, and the separated portion of the second beam,
each of the first beam and the second beam is connected to the base substrate at the connection portion, and
the infrared receiver, the separated portion of the first beam, and the separated portion of the second beam are suspended over the recess of the base substrate in cross-sectional view.

7. The infrared sensor according to claim 1 , further comprising:
an infrared reflection film on a surface of the base substrate at a position facing the infrared receiver.

8. The infrared sensor according to claim 1 , further comprising:
a readout integrated circuit (ROIC) inside the base substrate.

9. The infrared sensor according to claim 1 , wherein
a section of the first beam, the section being between a portion joined to the infrared receiver and the connection portion, has a first phononic crystal structure having a plurality of through holes that are orderly arranged, and
a section of the second beam, the section being between a portion joined to the infrared receiver and the connection portion, has a second phononic crystal structure having a plurality of through holes that are orderly arranged.

10. The infrared sensor according to claim 9 , wherein
the first phononic crystal structure includes a first domain and a second domain which are phononic crystal regions,
through holes of the through holes included in the first domain are orderly arranged in a first direction in plan view,
through holes of the through holes included in the second domain are orderly arranged in a second direction in plan view, the second direction being different from the first direction,
the second phononic crystal structure includes a third domain and a fourth domain which are phononic crystal regions,
through holes of the through holes included in the third domain are orderly arranged in a third direction in plan view, and
through holes of the through holes included in the fourth domain are orderly arranged in a fourth direction in plan view, the fourth direction being different from the third direction.

11. An infrared sensor array comprising:
a plurality of infrared sensors arranged in a two-dimensional array, wherein
the infrared sensors include the infrared sensor according to claim 1 .

12. A method of manufacturing the infrared sensor according to claim 1 , comprising:
forming the resistance change portion by implanting, into the base material which is crystalline, ions of an element included in the base material.

13. The method of manufacturing the infrared sensor according to claim 12 , wherein
the resistance change portion is an amorphous region of a semiconductor layer including the base material and the first and second beams are crystalline regions of the semiconductor layer including the base material,
a crystalline layer including the base material that is crystalline is formed at a position away from the base substrate, and
the amorphous region is formed in part of the crystalline layer by implanting ions of an element included in the base material into a region of the crystalline layer formed, so as to form the semiconductor layer having the resistance change portion corresponding to the amorphous region formed and the first and second beams corresponding to the crystalline regions in which a crystalline structure of the base material remains.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Takahashi Kouhei
• Tambo Naoki
• Nakamura Kunihiko
• Fujikane Masaki
• Naito Yasuyuki

Classifications

• H10F71/10

  the devices comprising amorphous semiconductor material · CPC title

• H10F30/15

  comprising amorphous semiconductors · CPC title

• H10F39/10

  Integrated devices · CPC title

• G01J5/22 Primary

  Electrical features thereof · CPC title

• H01L31/095

  Electricity · mapped topic