Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package

Patent metadata

Field	Value
Publication number	US-11905412-B2
Application number	US-202017600463-A
Country	US
Kind code	B2
Filing date	Apr 3, 2020
Priority date	Apr 3, 2019
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

First claim

The invention claimed is:

1. A resin composition comprising:
a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures, wherein the aromatic hydrocarbon group containing two or more aromatic ring structures is (a1) a divalent aromatic hydrocarbon group having two or more aromatic rings in which two of the two or more aromatic rings are linked via a single bond or a linking group having 5 or less carbon atoms or (a2) a divalent fused polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures; and
a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

2. The resin composition according to claim 1 , wherein the component (A) is a compound represented by the following general formula (A-1):

wherein R a1 to R a4 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, X a1 represents a divalent group represented by the following general formula (A-2) or a divalent fused polycyclic aromatic hydrocarbon group containing two or more aromatic ring structures, n a1 to n a4 each independently represent an integer of 0 to 5, and n a5 represents an integer of 1 to 5:

wherein R a5 and R a6 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, X a2 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond, n a6 and n a7 each independently represent an integer of 0 to 4, and n a8 represents an integer of 1 to 3.

3. The resin composition according to claim 1 , wherein the resin composition has a content of phosphorus atoms derived from the component (A) of 0.2 to 5% by mass based on solid components in the resin composition except for an inorganic filler.

4. The resin composition according to claim 1 , wherein the ethylenically unsaturated bond-containing group of the component (B) is a (meth)acryloyl group.

5. The resin composition according to claim 1 , wherein the component (B) has a weight average molecular weight (Mw) of 500 to 7,000.

6. The resin composition according to claim 1 , further comprising at least one thermosetting resin (C) selected from the group consisting of an epoxy resin, a cyanate resin, and a maleimide compound.

7. The resin composition according to claim 6 , wherein the resin composition comprises the maleimide compound as the component (C), the maleimide compound being a modified maleimide compound having a structural unit derived from a maleimide compound (c1) having at least two or more N-substituted maleimide groups and a structural unit derived from an amine compound (c2) having a primary amino group.

8. The resin composition according to claim 7 , wherein the modified maleimide compound is a compound represented by the following general formula (C-2):

wherein X c1 and X c4 are each independently a divalent organic group.

9. The resin composition according to claim 1 , further comprising one or more selected from the group consisting of a styrene-based thermoplastic elastomer (D), a curing accelerator (E), and an inorganic filler (F).

10. A prepreg comprising the resin composition according to claim 1 and a sheet-shaped fiber-reinforced substrate.

11. A laminate comprising the prepreg according to claim 10 and a metal foil.

12. A multilayer printed wiring board comprising the prepreg according to claim 10 .

13. A semiconductor package comprising the multilayer printed wiring board according to claim 12 and a semiconductor device mounted on the multilayer printed wiring board.

14. A multilayer printed wiring board comprising the laminate according to claim 11 .

15. A semiconductor package comprising the multilayer printed wiring board according to claim 14 and a semiconductor device mounted on the multilayer printed wiring board.

16. A method of producing a laminate, the method comprising a step of curing with heat the resin composition according to claim 1 ,
the component (A) having a melting point of 50 to 250° C.,
the curing with heat being performed at a temperature of the melting point of the component (A) or higher,
the component (A) in the resin composition before curing with heat having a particle shape.

Assignees

• Showa Denko Materials Co Ltd
• Resonac Corp

Inventors

• Taki Takahiro
• Ejiri Takako
• Iwakura Tetsuro
• Uchimura Kana
• Fujii Toshiki
• Omori Yukako
• Kato Tetsuya
• Fujioka Osamu

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• C08L79/085 Primary

  Unsaturated polyimide precursors · CPC title

• B32B5/022

  Non-woven fabric · CPC title

• B32B15/14

  next to a fibrous or filamentary layer · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title