Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition

Patent metadata

Field	Value
Publication number	US-11905409-B2
Application number	US-202318112837-A
Country	US
Kind code	B2
Filing date	Feb 22, 2023
Priority date	Sep 1, 2020
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).

First claim

The invention claimed is:

1. A resin composition comprising:
a polyphenylene ether compound having at least one of groups represented by the following Formulas (1) and (2); and
an allyl compound represented by the following Formula (3):

(in Formula (1), p represents an integer 0 to 10, Z represents an arylene group, and R 1 to R 3 each independently represent a hydrogen atom or an alkyl group)

(in Formula (2), R 4 represents a hydrogen atom or an alkyl group)

(in Formula (3), R A represents an alkyl or alkenyl group having 8 to 22 carbon atoms).

2. The resin composition according to claim 1 , further comprising an inorganic filler.

3. The resin composition according to claim 1 , comprising the allyl compound at 10 to 50 parts by mass with respect to 100 parts by mass of a sum of the polyphenylene ether compound and the allyl compound.

4. The resin composition according to claim 1 , further comprising a styrenic polymer having a structural unit represented by the following Formula (15):

(in Formula (15), R 39 to R 41 each independently represent a hydrogen atom or an alkyl group, and R 42 represents a group selected from the group consisting of a hydrogen atom, an alkyl group, an alkenyl group, and an isopropenyl group).

5. The resin composition according to claim 4 , comprising the allyl compound at 10 to 50 parts by mass with respect to 100 parts by mass of a sum of the polyphenylene ether compound, the allyl compound, and the styrenic polymer.

6. The resin composition according to claim 4 , wherein a weight average molecular weight of the styrenic polymer is 10,000 to 300,000.

7. The resin composition according to claim 4 , wherein the styrenic polymer is at least one selected from the group consisting of a hydrogenated methylstyrene (ethylene/butylene) methylstyrene copolymer, a hydrogenated methylstyrene (ethylene-ethylene/propylene) methylstyrene copolymer, a hydrogenated styrene isoprene copolymer, a hydrogenated styrene isoprene styrene copolymer, a hydrogenated styrene (ethylene/butylene) styrene copolymer, a hydrogenated styrene (ethylene/propylene) styrene copolymer, a hydrogenated styrene (ethylene-ethylene/propylene) styrene copolymer, a styrene-isobutylene copolymer, and a styrene-isobutylene-styrene copolymer.

8. The resin composition according to claim 4 , comprising the styrenic polymer at 10 to 60 parts by mass with respect to 100 parts by mass of a sum of the polyphenylene ether compound, the allyl compound, and the styrenic polymer.

9. The resin composition according to claim 1 , further comprising a reaction initiator.

10. A prepreg comprising:
the resin composition according to claim 1 or a semi-cured product of the resin composition; and
a fibrous substrate.

11. A film with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and
a support film.

12. A metal foil with resin comprising:
a resin layer containing the resin composition according to claim 1 or a semi-cured product of the resin composition; and
a metal foil.

13. A metal-clad laminate comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 ; and
a metal foil.

14. A wiring board comprising:
an insulating layer containing a cured product of the resin composition according to claim 1 , and
wiring.

15. A metal-clad laminate comprising:
an insulating layer containing a cured product of the prepreg according to claim 10 ; and
a metal foil.

16. A wiring board comprising:
an insulating layer containing a cured product of the prepreg according to claim 10 ; and
wiring.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Tsuda Kosuke
• Saito Hirosuke
• Wang Yiqun
• Inoue Hiroharu

Classifications

• C08L71/126 Primary

  modified by chemical after-treatment · CPC title

• C08J5/18

  Manufacture of films or sheets · CPC title

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title

• C08K3/36

  Silica · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title