Power converter with integrated multi-layer cooling

Patent metadata

Field	Value
Publication number	US-11903175-B2
Application number	US-202017425351-A
Country	US
Kind code	B2
Filing date	Jan 24, 2020
Priority date	Jan 24, 2019
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

A power converter includes an integrated multi-layer cooling structure. The power converter includes a plurality of printed circuit boards (PCBs) stacked together in a generally vertical arrangement. A liquid cooling mechanism is attached to a lower-most PCB, and high loss circuitry components are attached to an opposite side of the lower-most PCB. Low loss circuitry components are attached to further PCBs. Magnetic components may be attached to the further PCBs. The high loss components are actively cooled by the liquid cooling mechanism and the low loss components and magnetic components are passively cooled. The liquid cooling mechanism may be a cold plate heatsink. The power converter may include intermediate PCBs disposed between the upper-most PCB and the lower-most PCB, with low loss circuitry components attached to the intermediate PCBs.

First claim

What is claimed is:

1. A power converter comprising:
a first printed circuit board (PCB) and a second PCB attached to the first PCB, wherein the second PCB is disposed vertically relative to the first PCB;
a liquid cooling mechanism mounted to the first PCB;
a plurality of circuitry components including high-loss circuitry components and low-loss circuitry components, wherein the high-loss circuitry components have higher losses relative to the low-loss circuitry components, wherein the high-loss circuitry components are attached to the first PCB; and
wherein the liquid cooling mechanism is operable to actively cool at least the high-loss circuitry components mounted to the first PCB, wherein the high-loss circuitry components are mounted to an opposite side of the PCB relative to the liquid cooling mechanism,
wherein the low-loss circuitry components are attached to the second PCB,
wherein the first PCB is a lower-most PCB and the second PCB is an upper-most PCB, the lower-most PCB disposed below the upper-most PCB, wherein the liquid cooling mechanism is attached to a bottom surface of the lower-most PCB and the high-loss circuitry components are attached to an upper surface of the lower-most PCB,
wherein the low-loss circuitry components are attached to the upper-most PCB, and
wherein the power converter further includes magnetic components attached to the upper-most PCB.

2. The power converter of claim 1 further comprising a plurality of connector rods connecting the first PCB to the second PCB.

3. The power converter of claim 2 , wherein the connector rods are copper and electrically connect the first PCB to the second PCB.

4. The power converter of claim 1 , wherein the magnetic components are attached to an upper surface of the upper-most PCB and the low-loss circuitry components are attached to a lower surface of the upper-most PCB.

5. The power converter of claim 2 , wherein the low-loss circuitry components are attached to both the upper and lower surfaces of the upper-most PCB.

6. The power converter of claim 1 , further comprising at least one intermediate PCB disposed between upper-most PCB and the lower-most PCB.

7. The power converter of claim 6 , wherein the low-loss circuitry components are attached to at least one of an upper or lower surface of the intermediate PCB, and a magnetic component is attached to an upper surface of the upper-most PCB.

8. The power converter of claim 1 , wherein the liquid cooling mechanism is a cold plate heatsink having an inlet and an outlet configured to circulate a liquid coolant therethrough and to transfer heat from the high-loss circuitry components to the liquid coolant.

9. A method of cooling a power converter, the method comprising:
operating a power converter, wherein the power converter includes:
a plurality of printed circuit boards (PCB) connected via a plurality of connector rods, the plurality of PCBs including a lower-most PCB and an upper-most PCB;
a liquid cooling mechanism attached to the lower-most PCB;
high-loss circuitry components attached to the lower-most PCB;
low-loss circuitry components attached to one of the plurality of printed circuit boards, wherein the high-loss circuitry components have higher losses relative to the low-loss circuitry components;

actively cooling the high-loss circuitry components via the liquid cooling mechanism; and
passively cooling the low-loss circuitry components,
wherein the power converter further includes magnetic components attached to the upper-most PCB.

10. The method of claim 9 , actively cooling the high-loss circuitry components includes circulating a coolant through the liquid cooling mechanism and transferring heat from the high-loss circuitry components to the coolant.

11. The method of claim 9 , wherein the power converter further includes a magnetic component disposed on the upper-most PCB.

12. A DC-DC power converter comprising:
a first printed circuit board (PCB) and a second PCB, with the first PCB and the second PCB attached to one another and extending parallel and spaced apart from one another;
a liquid cooling mechanism mounted to the first PCB;
a plurality of circuitry components including high-loss circuitry components and low-loss circuitry components, wherein the high-loss circuitry components have higher losses relative to the low-loss circuitry components, wherein the high-loss circuitry components are attached to the first PCB; and
a magnetic component attached to an upper surface of the second PCB, wherein the low-loss circuitry components are attached to a lower surface of the second PCB, and
wherein the liquid cooling mechanism is operable to actively cool at least the high-loss circuitry components mounted to the first PCB, wherein the high-loss circuitry components are mounted to an opposite side of the first PCB relative to the liquid cooling mechanism.

13. The DC-DC power converter of claim 12 , further comprising a plurality of connector rods of electrically conductive material connecting the first PCB to the second PCB.

14. The DC-DC power converter of claim 12 , wherein the low-loss circuitry components are attached to both the upper and lower surfaces of the second PCB.

Assignees

• Magna Int Inc

Inventors

• Chen Yang
• Liu Wenbo
• Yurek Andrew
• Sheng Bo
• Zhou Xiang
• Liu Yan-Fei
• Iyer Lakshmi Varaha
• Schlager Gerd
• Neudorfhofer Michael
• Baeck Wolfgang

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H02M3/003 Primary

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title