Infrared sensor and imaging apparatus

Patent metadata

Field	Value
Publication number	US-11901389-B2
Application number	US-202117325308-A
Country	US
Kind code	B2
Filing date	May 20, 2021
Priority date	May 26, 2020
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

An infrared sensor including: a detection substrate that includes a first substrate in which infrared detection elements are arranged in a lattice shape and first terminals each of which is associated with one of the infrared detection elements are arranged; a readout substrate that includes a second substrate in which second terminals each of which is associated with one of the first terminals are arranged and a readout circuit that reads an electrical signal based on infrared light detected by each one of the infrared detection elements is formed; and bumps that electrically connect each one of the first terminals to one of the second terminals associated with the one of the first terminals, in which at least one of the first terminals, the second terminals, or the bumps is partially arranged at a position between the infrared detection elements that are adjacent in a top view.

First claim

The invention claimed is:

1. An infrared sensor comprising:
a detection substrate that includes a first substrate in which a plurality of infrared detection elements are arranged in a lattice shape and a plurality of first terminals each of which is associated with one of the infrared detection elements are arranged;
a readout substrate that includes a second substrate in which a plurality of second terminals each of which is associated with one of the plurality of first terminals are arranged and a readout circuit that reads an electrical signal based on infrared light detected by each one of the plurality of infrared detection elements is formed; and
a plurality of bumps that electrically connects each one of the plurality of first terminals to one of the plurality of second terminals associated with the one of the plurality of first terminals, wherein
at least one of the plurality of first terminals, the plurality of second terminals, or the plurality of bumps is partially arranged at a position between the infrared detection elements that are adjacent in a top view.

2. The infrared sensor according to claim 1 , wherein
at least one of the plurality of bumps is partially arranged at a position in a gap formed between the plurality of first terminals and the plurality of second terminals.

3. The infrared sensor according to claim 1 , wherein
at least one of the plurality of bumps is arranged to be shifted from centers of the plurality of infrared detection elements within a range from equal to or more than 10% to equal to or less than 50% of a pitch size of the plurality of infrared detection elements.

4. The infrared sensor according to claim 2 , wherein
the first substrate and the second substrate are rectangular, and
at least one of the plurality of bumps is arranged to be shifted in a longitudinal direction of the first substrate and the second substrate.

5. The infrared sensor according to claim 2 , wherein
every one of the plurality of bumps is arranged at a position in a gap formed between the plurality of first terminals and the plurality of second terminals.

6. The infrared sensor according to claim 2 , wherein
the plurality of first terminals and the plurality of second terminals are deformed in accordance with shifts of the plurality of bumps.

7. The infrared sensor according to claim 1 , wherein
at least one of sets of the plurality of first terminals and the plurality of second terminals associated with each other is arranged at a position between the infrared detection elements that are adjacent to each other in a top view.

8. The infrared sensor according to claim 7 , wherein
corners of the plurality of first terminals and the plurality of second terminals are deformed to avoid electrical contact with the plurality of first terminals and the plurality of second terminals that are adjacent to the corners.

9. The infrared sensor according to claim 7 , wherein
the first substrate and the second substrate are rectangular, and
at least one of sets of the plurality of first terminals and the plurality of second terminals associated with each other is arranged to be shifted in a longitudinal direction of the first substrate and the second substrate.

10. An imaging apparatus comprising:
the infrared sensor according to claim 1 ;
a lens that condenses infrared light on a light receiving surface of the infrared sensor;
a cooler that cools the infrared sensor; and
a controller configured to acquire an electrical signal output from the infrared sensor, and generate image data associated to light received by the plurality of infrared detection elements included in the infrared sensor.

Assignees

• Nec Corp

Inventors

• Tanaka Tomo
• Fukatsu Kimiyoshi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title