Pressurizing device and pressurizing method

Patent metadata

Field	Value
Publication number	US-11901199-B2
Application number	US-202017024230-A
Country	US
Kind code	B2
Filing date	Sep 17, 2020
Priority date	Apr 27, 2016
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

A pressurizing device includes: a mounting base; an upper mold which pressurizes the target object mounted on the mounting base from above; a heating lower mold which is a lower mold heated in advance by a heater, and which heats the target object under pressure by sandwiching the mounting base with the upper mold; a cooling lower mold which is a lower mold cooled in advance by a cooler, and which cools the target object under pressure by sandwiching the mounting base with the upper mold; and a control device which switches the lower mold that contributes to the pressurization of the target object to the heating lower mold or the cooling lower mold in accordance with the status of progress of the pressurization process for the target object.

First claim

The invention claimed is:

1. A pressurizing apparatus, comprising:
a mounting base on which a target object is mountable;
an upper unit including a base member, which is moveable upward and downward, and an upper mold fixed on the base member and for pressurizing the target object when the target object is mounted on the mounting base from an upper side thereof;
a heating lower mold that is a heated lower mold and is configured to heat the target object while pressurizing it in a state where the mounting base is sandwiched between the upper mold and the heating lower mold;
a cooling lower mold that is a cooled lower mold and is configured to cool the target object while pressurizing it in a state where the mounting base is sandwiched between the upper mold and the cooling lower mold;
a control device configured to control, according to a state of progress in a pressurization processing of the target object, driving of the heating lower mold and the cooling lower mold to switch the one of the heating lower mold and the cooling lower mold contributing to the pressurization of the target object;
a side mold disposed around the upper mold and, when closely contacting with the mounting base, configured to form a hermetically closed space around the target object together with the upper mold and the mounting base; and
a suction apparatus for sucking air from the hermetically closed space to bring a surrounding of the target object into a vacuum state,
wherein the control device is configured, prior to the pressurization of the target object, to bring the side mold into contact with the mounting base to form the hermetically closed space and to drive the suction apparatus to bring the hermetically closed space into the vacuum state.

2. The pressurizing apparatus according to claim 1 , further comprising:
an intervening pad configured to intervene between the upper mold and the target object,
wherein the intervening pad includes:
a deforming layer configured to flexibly deform according to a shape of the target object; and
a heat insulating layer configured to intervene between the deforming layer and the target object and thermally insulate the target object from the deforming layer.

3. The pressurizing apparatus according to claim 2 , wherein the heating lower mold is configured to heat the target object to a temperature higher than a temperature at which the deforming layer breaks.

4. The pressurizing apparatus according to claim 2 , wherein the control device is configured to bring the intervening pad into contact with the target object to hold the target object by the intervening pad, and subsequently to cause the heating lower mold to heat and pressurize the target object.

5. A pressurizing method for pressurizing and heating a target object mounted on a mounting base, the method comprising:
sandwiching the mounting base on which the target object is mounted between (i) an upper mold fixed on an upwardly-and-downwardly moveable base member and (ii) a heating lower mold, which is a heated lower mold, and heating the target object with heat from the heating lower mold while pressurizing the target object, a side mold being disposed around the upper mold and configured to form, when closely contacting with the mounting base, a hermetically closed space around the target object together with the upper mold and the mounting base;
sandwiching the mounting base between the upper mold and a cooling lower mold, which is a cooled lower mold, and cooling the target object while pressurizing the target object;
bringing, prior to the pressurization of the target object, the side mold into contact with the mounting base to form the hermetically closed space; and
sucking, prior to the pressurization of the target object, air from the hermetically closed space to bring a surrounding of the target object into a vacuum state.

Assignees

• Nikkiso Co Ltd

Inventors

• Mori Takahiro
• IDESAKO Satoshi

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title