Method for manufacturing connection body and method for connecting component

Patent metadata

Field	Value
Publication number	US-11901096-B2
Application number	US-201917054387-A
Country	US
Kind code	B2
Filing date	Jun 6, 2019
Priority date	Jun 6, 2018
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

A method for manufacturing a connection body, and a method for connecting a component, which can secure conduction reliability by trapping conductive particles even when the bump size is minimized. The method includes a disposing step of disposing a filler-containing film having a filler-aligned layer in which individual independent fillers are aligned in a binder resin layer between a first component having a first electrode and a second component having a second electrode; a temporary fixing step of pressing the first component or the second component to sandwich the filler-aligned layer; and a final compression boding step of further pressing the first component or the second component after the temporary fixing step to connect the first electrode and the second electrode.

First claim

What is claimed is:

1. A method for manufacturing a connection body comprising:
a disposing step of disposing a filler-containing film having a filler-aligned layer in which individual independent fillers are aligned in a binder resin layer between a first component having a first connection portion and a second component having a second connection portion;
a temporary fixing step of applying pressure to the first component or the second component to sandwich the filler-aligned layer between the first connection portion and the second connection portion; and
a final compression bonding step of further pressing the first component or the second component after the temporary fixing step to sandwich the filler between the first connection portion and the second connection portion,
wherein the pressure applied in the temporary fixing step is not released, and the pressure of a compression bonding tool is further increased to pressurize the first electronic component and the second electronic component.

2. The method for manufacturing a connection body according to claim 1 , wherein the first connection portion is a first electrode terminal, and the second connection portion is a second electrode terminal, and
wherein the filler is conductive particles.

3. The method according to claim 2 , wherein the filler-containing film has an insulating adhesive layer containing no conductive filler.

4. The method according to claim 3 , wherein the disposing step is performed by disposing the filler-aligned layer on the first electrode terminal or the second electrode terminal, and
wherein the temporary fixing step is performed by pressing from the insulating adhesive layer side.

5. The method according to claim 3 , wherein the insulating adhesive layer is a resin layer having a lower viscosity than the filler-aligned layer.

6. The method according to claim 5 , wherein the total thickness of the resin layer in the filler-containing film is 0.6 times or more and 50 times or less the particle diameter of the filler.

7. The method according to claim 2 , wherein the first electrode terminal is a bump provided on the first component,
and the total thickness of the filler-containing film is thinner than the height of the first electrode terminal.

8. The method according to claim 1 , wherein the filler-aligned layer has a thickness of not more than two times the average particle diameter of the filler.

9. The method according to claim 1 , wherein the heating temperature and pressure at the time of the temporary fixing step are such that conductive particles are held without flowing out from between the bump and the terminal electrode while the adhesive component of an anisotropic conductive film as the filler-containing film flows, and are equal to or lower than the heating temperature and pressure in the subsequent final compression bonding, respectively.

10. The method according to claim 9 , wherein the temporary fixing step sandwiches the conductive particle-aligned layer between the bump and the terminal electrode.

11. The method according to claim 9 , wherein in the temporary fixing step, the bump comes into contact with the conductive particles.

12. The method according to claim 1 , wherein conductive particles are arranged in a regular manner repeating a predetermined alignment in plan view of the film.

13. The method according to claim 1 , wherein the thickness of the filler-containing film is 0.3 times or more and 20 times or less of the particle diameter of the filler.

14. The method according to claim 1 , wherein according to an adhesive strength test for measuring adhesive force, by sandwiching an anisotropic conductive film as the filler-containing film between two glass plates, fixing one glass plate, reinforcing the adhesive state between the fixed glass plate and the anisotropic conductive film, and peeling off the other glass plate at a peeling-off speed of 10 mm/min and a test temperature of 50° C., the adhesive force between the peeled-off glass plate and the surface of the anisotropic conductive film bonded to the glass plate is measured and is 1 N/cm 2 or more.

15. The method according to claim 1 , wherein adhesive force of an anisotropic conductive film as the filler-containing film is measured as a tack force measured by a probe method on at least one of the front and back surfaces of the anisotropic conductive film is set to 10 kPa or more, as measured at a probe pressing speed of 30 mm/min, a pressing pressure of 196.25 gf, a pressing time of 1.0 sec, a peeling speed of 120 mm/min, and a measuring temperature of 23±5° C., in the measurement, the tack force of one surface of the anisotropic conductive film is measured by pasting the other surface to a plain glass plate.

16. A method for connecting a component comprising: a disposing step of disposing a filler-containing film having a filler-aligned layer in which individual independent fillers are aligned in a binder resin layer between a first component having a first connection portion and a second component having a second connection portion;
a temporary fixing step of applying pressure to the first component or the second component to sandwich the filler-aligned layer between the first connection portion and the second connection portion; and
a final compression bonding step of further pressing the first component or the second component after the temporary fixing step to sandwich the filler between the first connection portion and the second connection portion,
wherein the pressure applied in the temporary fixing step is not released, and the pressure of a compression bonding tool is further increased to pressurize the first electronic component and the second electronic component.

Assignees

• Dexerials Corp

Inventors

• Asaba Kosuke
• Aizaki Ryota

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title