Substrate processing method and substrate processing device

Patent metadata

Field	Value
Publication number	US-11897009-B2
Application number	US-201916981309-A
Country	US
Kind code	B2
Filing date	Feb 7, 2019
Priority date	Mar 26, 2018
Publication date	Feb 13, 2024
Grant date	Feb 13, 2024

Abstract

A substrate processing technique including a process of forming a liquid film on an upper surface of a substrate and excellently solidifying the liquid film is provided. A substrate processing method includes an atmosphere control step of supplying a drying gas to a front surface of a substrate on which a pattern has been formed and to which a liquid has adhered and making a dry atmosphere around the front surface of the substrate, a to-be-solidified liquid supplying step of supplying a to-be-solidified liquid to the front surface of the substrate, and a solidification step of forming a solidified mass by solidifying a liquid film of the to-be-solidified liquid. The atmosphere control step is started before the liquid film of the to-be-solidified liquid supplied to the front surface of the substrate in the to-be-solidified liquid supplying step is formed.

First claim

The invention claimed is:

1. A substrate processing method, comprising:
an atmosphere control step of supplying a drying gas to a front surface of a substrate on which a pattern has been formed and making a dry atmosphere around the front surface of the substrate;
a to-be-solidified liquid supplying step of supplying a to-be-solidified liquid to the front surface of the substrate; and
a solidification step of forming a solidified mass by solidifying a liquid film of the to-be-solidified liquid,
wherein the atmosphere control step is started before the liquid film of the to-be-solidified liquid supplied to the front surface of the substrate in the to-be-solidified liquid supplying step is formed, and
a solidification point of the to-be-solidified liquid is 5° C. to 40° C.

2. The substrate processing method according to claim 1 , wherein the atmosphere control step is started before the to-be-solidified liquid supplying step is started.

3. The substrate processing method according to claim 1 , wherein the atmosphere control step is ended while the to-be-solidified liquid supplying step is being performed, or when the to-be-solidified liquid supplying step is ended, or after the to-be-solidified liquid supplying step is ended.

4. The substrate processing method according to claim 1 , further comprising a shielding-plate approaching step of causing a shielding plate to relatively approach the substrate, the shielding plate being disposed to face the substrate and having a substantially flat surface that faces the front surface of the substrate,
wherein the shielding-plate approaching step is performed before the atmosphere control step is started.

5. The substrate processing method according to claim 4 , wherein a distance between the substrate and the shielding plate is always constant at least until the to-be-solidified liquid supplying step is completed after the shielding-plate approaching step is completed.

6. The substrate processing method according to claim 5 , wherein the distance between the substrate and the shielding plate is always constant until the solidification step is completed after the shielding-plate approaching step is completed.

7. The substrate processing method according to claim 1 , further comprising a removing step of removing the to-be-solidified liquid that has been solidified from the substrate after the solidification step is completed.

8. A substrate processing apparatus comprising:
a substrate holder that rotates while holding a substrate;
a first gas supply that supplies a drying gas to a front surface of the substrate held by the substrate holder;
a to-be-solidified liquid supply that supplies a to-be-solidified liquid, having a solidification point in a range from 5° C. to 40° C., to the front surface of the substrate held by the substrate holder; and
a solidifier that solidifies the to-be-solidified liquid,
wherein the to-be-solidified liquid supplied to the front surface of the substrate by the to-be-solidified liquid supply forms a liquid film by rotation of the substrate holder, and
wherein the liquid film is formed in a state in which a dry atmosphere has been made around the front surface of the substrate.

9. The substrate processing apparatus according to claim 8 , further comprising a shielding plate that is disposed to face the substrate held by the substrate holder and that has a substantially flat surface that faces the substrate.

10. The substrate processing apparatus according to claim 8 , further comprising a remover that removes the to-be-solidified liquid that has been solidified from the substrate.

Assignees

• Screen Holdings Co Ltd

Inventors

• Ueda Dai
• Sasaki Yuta
• Hanawa Yosuke
• Kitagawa Hiroaki

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0408

  for drying · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title