Copper-clad laminate, wiring board, and copper foil provided with resin

Patent metadata

Field	Value
Publication number	US-11895770-B2
Application number	US-201917281845-A
Country	US
Kind code	B2
Filing date	Sep 27, 2019
Priority date	Oct 5, 2018
Publication date	Feb 6, 2024
Grant date	Feb 6, 2024

Abstract

A copper-clad laminate includes an insulating layer and a copper foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, a chromium element amount on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 2.0 μm or less in terms of ten-point average roughness.

First claim

The invention claimed is:

1. A copper-clad laminate comprising an insulating layer and a
copper foil in contact with at least one surface of the insulating layer, the copper foil having a layer treated with a silane coupling agent having an amino group in the molecule as a silane coupling agent layer,
wherein the insulating layer contains a cured product of a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond,
a chromium element amount on an exposed surface, on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and
a surface roughness of the exposed surface is 2.0 μm or less in terms of ten-point average roughness, and
wherein the thickness of the silane coupling agent layer is sufficient to cause a a nitrogen element that can be confirmed by X-ray photoelectron spectroscopy to exist on the exposed surface upon etching treatment of the copper-clad laminate and exposure of the insulating layer.

2. The copper-clad laminate according to claim 1 , wherein the substituent is a group represented by the following Formula (1) or the following Formula (2):

wherein in Formula (1), R 1 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms and R 2 represents an alkylene group having 1 to 10 carbon atoms or a direct bond,

wherein in Formula (2), R 3 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

3. The copper-clad laminate according to claim 1 , wherein a nitrogen element amount on the exposed surface measured by X-ray photoelectron spectroscopy is 1.0 at % or more with respect to a total element amount measured by X-ray photoelectron spectroscopy.

4. The copper-clad laminate according to claim 1 , wherein the nitrogen element is derived from a nitrogen atom contained in a compound having an amino group.

5. A wiring board comprising:
wiring formed by partially removing the copper foil provided in the copper-clad laminate according to claim 1 ; and
the insulating layer.

6. The wiring board according to claim 5 , wherein
a plurality of the insulating layers are provided, and
the wiring is disposed between the insulating layers.

7. A copper foil with resin, comprising a resin layer and a copper foil in contact with at least one surface of the resin layer,
wherein the copper foil having a layer treated with a silane coupling agent having an amino group in the molecule as a silane coupling agent layer,
the resin layer contains a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond or a semi-cured product of the resin composition,
a chromium element amount on an exposed surface, on which the resin layer is exposed after the copper foil with resin in which the resin layer has been cured is etched with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and
a surface roughness of the exposed surface is 2.0 μm or less in terms of ten-point average roughness, and
wherein the thickness of the silane coupling agent layer is sufficient to cause a nitrogen element that can be confirmed by X-ray photoelectron spectroscopy to exist on the exposed surface upon etching treatment of the copper foil with resin and exposure of the resin layer.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Inoue Yuki
• Arisawa Tatsuya
• Yamaguchi Shun

Classifications

• H05K1/056 Primary

  the metal substrate being covered by an organic insulating layer · CPC title

• B32B15/08 Primary

  of synthetic resin · CPC title

• G01N23/2273

  Measuring photoelectron spectrum, e.g. electron spectroscopy for chemical analysis [ESCA] or X-ray photoelectron spectroscopy [XPS] · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K3/002

  by liquid chemical etching · CPC title