Mobile device including improved electro-acoustic conversion chip

Patent metadata

Field	Value
Publication number	US-11879758-B2
Application number	US-202117563015-A
Country	US
Kind code	B2
Filing date	Dec 27, 2021
Priority date	Dec 30, 2020
Publication date	Jan 23, 2024
Grant date	Jan 23, 2024

Abstract

The present disclosure provides a linear motor including: a housing body with a containment space; a vibrator assembly suspended in the containment space by an elastic member for vibrating along a vibration direction; a stator assembly fixedly connected to the housing body and having a magnetic axis along the vibration direction; and two magnets located on both sides of the magnetic axis and spaced from the stator assembly, including a first magnet section and a second magnet section located on both sides of the first magnet section. A magnetic field strength of the first magnet section along the magnetic axis is greater than a magnetic field strength of the second magnet section along the magnetic axis. The configuration of the invention can effectively reduce the static attraction force of the magnetic circuit, and increase the overall rigidity of the linear motor.

First claim

What is claimed is:

1. A sensor package, comprising:
a package cover;
an electro-acoustic conversion chip fixed to the package cover;
a processing chip fixed on a surface of one side of the electro-acoustic conversion chip away from the package cover and electrically connected to the electro-acoustic conversion chip;
a suction structure;
an electrical connector electrically connected to the suction structure for activating the suction structure;
a first cavity formed by the processing chip and the electro-acoustic conversion chip;
a second cavity formed by the package cover and the electro-acoustic conversion chip;
wherein
the processing chip includes a groove with an opening facing the electro-acoustic conversion chip for accommodating the suction structure, a first through hole communicating with the first cavity and at least partially receiving the electrical connector; the package cover and the acoustic conversion chip are connected to form a second cavity; and
the package cover includes a second through hole communicating with the second cavity.

2. The sensor package as described in claim 1 , further including a first connection structure; wherein the processing chip comprises a first perimeter surrounding the groove; the electro-acoustic conversion chip comprises a second perimeter opposite to the first perimeter; the first connection structure is connected to the first perimeter and the second perimeter, respectively; the processing chip, the first connection structure, and the acoustic conversion chip enclose cooperatively for forming the first cavity.

3. The sensor package as described in claim 2 further comprising a second connection structure, wherein the electro-acoustic conversion chip further comprises a third perimeter; the third perimeter and the second perimeter are respectively located on opposite sides of the electro-acoustic conversion chip; the package cover comprises a fourth perimeter surrounding the second through hole; the second connection structure is connected to the third perimeter and the fourth perimeter respectively; the package cover, the second connection structure, and the acoustic conversion chip enclose cooperatively for forming the second cavity.

4. The sensor package as described in claim 3 , wherein the electro-acoustic conversion chip comprises a main body connected to the first connection structure, and a sidewall connected to a periphery of the main body for connecting to the second connection structure.

5. The sensor package as described in claim 4 , wherein the first connection structure comprises a first soldering pad connected to the processing chip, a second soldering pad connected to the electro-acoustic conversion chip, and a first solder connecting the first soldering pad and the second soldering pad.

6. The sensor package as described in claim 4 , wherein the second connection structure comprises a third soldering pad connected with the electro-acoustic conversion chip, a fourth soldering pad connected with the package cover, and a second solder connecting the third soldering pad and the fourth soldering pad.

7. The sensor package as described in claim 3 , wherein the electro-acoustic conversion chip comprises a main body connected to the first connection structure, and a sidewall connected to a periphery of the main body for connecting to the first connection structure.

8. The sensor package as described in claim 7 , wherein the first connection structure comprises a first soldering pad connected to the processing chip, a second soldering pad connected to the electro-acoustic conversion chip, and a first solder connecting the first soldering pad and the second soldering pad.

9. The sensor package as described in claim 7 , wherein the second connection structure comprises a third soldering pad connected with the electro-acoustic conversion chip, a fourth soldering pad connected with the package cover, and a second solder connecting the third soldering pad and the fourth soldering pad.

10. The sensor package as described in claim 3 , wherein the first connection structure comprises a first soldering pad connected to the processing chip, a second soldering pad connected to the electro-acoustic conversion chip, and a first solder connecting the first soldering pad and the second soldering pad.

11. The sensor package as described in claim 3 , wherein the second connection structure comprises a third soldering pad connected with the electro-acoustic conversion chip, a fourth soldering pad connected with the package cover, and a second solder connecting the third soldering pad and the fourth soldering pad.

12. The sensor package as described in claim 2 , wherein the first connection structure comprises a first soldering pad connected to the processing chip, a second soldering pad connected to the electro-acoustic conversion chip, and a first solder connecting the first soldering pad and the second soldering pad.

13. An electronic terminal comprising a sensor package as described in claim 1 .

Assignees

• Aac Acoustic Tech Shenzhen Co Ltd

Inventors

• Bai Yang
• Chen Yanxin
• Zhang Rui

Classifications

• G01F1/05 Primary

  by using mechanical effects · CPC title

• H02K41/02

  Linear motors; Sectional motors · CPC title

• B81B7/0038 Primary

  using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters · CPC title

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title

• B81B7/0074

  3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board · CPC title