Micro-electromechanical system device and method of forming the same

Patent metadata

Field	Value
Publication number	US-11878905-B2
Application number	US-202016937552-A
Country	US
Kind code	B2
Filing date	Jul 23, 2020
Priority date	Jul 23, 2020
Publication date	Jan 23, 2024
Grant date	Jan 23, 2024

Abstract

The present disclosure related to a micro-electromechanical system (MEMS) device and a method of forming the same. The MEMS device includes a substrate, a cavity, an interconnection structure and a proof mass. The substrate includes a first surface and a second surface opposite to the first surface. The cavity is disposed in the substrate to extend between the first surface and the second surface. The interconnection structure is disposed on the first surface of the substrate, over the cavity. The proof mass is disposed on the interconnection structure, wherein the proof mass is partially suspended over the interconnection structure.

First claim

What is claimed is:

1. A micro-electromechanical system device comprising:
a substrate, comprising a first surface and a second surface opposite to the first surface;
a cavity disposed in the substrate, extending between the first surface and the second surface;
an interconnection structure disposed on the first surface of the substrate, over the cavity, the interconnection structure comprising a suspended region corresponding to the cavity and a penetrating hole in the suspended region, wherein a first end of the suspended region is closed to the penetrating hole and is not connected to the substrate; and
a proof mass disposed on the interconnection structure, wherein the proof mass is partially suspended over the interconnection structure, the proof mass further comprises a base layer and a mass layer, and the base layer comprises a dielectric material, wherein at least one end of the proof mass is suspended over the interconnection structure.

2. The micro-electromechanical system device accordingly to claim 1 , wherein the base layer is directly disposed on the interconnection structure, and the mass layer is disposed on the base layer.

3. The micro-electromechanical system device accordingly to claim 1 , wherein one end of the mass layer is disposed on the base layer, and another end of the mass layer is suspended over the interconnection structure.

4. The micro-electromechanical system device accordingly to claim 1 , wherein the mass layer further comprises a protrusion surrounding a sidewall of the base layer.

5. The micro-electromechanical system device accordingly to claim 4 , wherein the protrusion directly contacts the interconnection structure.

6. The micro-electromechanical system device accordingly to claim 2 , wherein a second end of the suspended region is connected to the substrate.

7. The micro-electromechanical system device accordingly to claim 6 , wherein the base layer is disposed adjacent to the first end of the suspended region.

8. The micro-electromechanical system device accordingly to claim 6 , wherein the mass layer is extended from the first end of the suspended region to the second end of the suspended region.

9. The micro-electromechanical system device accordingly to claim 1 , further comprising an oxide layer disposed between the interconnection structure and the substrate.

10. The micro-electromechanical system device accordingly to claim 1 , wherein the cavity has a thickness the same as a thickness of the substrate.

Assignees

• Vanguard Int Semiconduct Corp

Inventors

• Xia jia jie

Classifications

• B81B3/0021 Primary

  Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title

• G01P15/08

  with conversion into electric or magnetic values · CPC title

• B81C2203/03

  Bonding two components · CPC title

• G01P2015/0817

  for pivoting movement of the mass, e.g. in-plane pendulum · CPC title

• G01P15/097 Primary

  by vibratory elements · CPC title