Electronic component, electric device including the same

Patent metadata

Field	Value
Publication number	US-11877485-B2
Application number	US-202117315456-A
Country	US
Kind code	B2
Filing date	May 10, 2021
Priority date	Aug 22, 2017
Publication date	Jan 16, 2024
Grant date	Jan 16, 2024

Abstract

Provided is an electronic device including a display panel including a base substrate, pixels, a first insulation layer, and panel pads spaced along a first direction from pixels and each arranged along a second direction crossing the first direction, a circuit board disposed on the display panel and connected to panel pads, and an adhesive interconnect layer disposed between the display panel and the circuit board and electrically connecting the display panel and the circuit board. The circuit board includes a flexible substrate including a top surface facing the base substrate, output pads disposed on the flexible substrate and connected to panel pads, each obliquely extending in the first and second directions and arranged along the second direction, an alignment pad spaced along the second direction from output pads, and a stress relaxation pad disposed between output pads and alignment pads and electrically insulated from panel pads.

First claim

What is claimed is:

1. An electronic device comprising:
a display panel including a display area, a peripheral area, and a pad area in a plan view, the display panel comprising:
a plurality of pixels disposed in the display area, and
a plurality of panel pads disposed in the pad area, the plurality of panel pads being spaced apart in a first direction from the plurality of pixels and each of the plurality of panel pads being arranged along a second direction crossing the first direction;
a circuit board, the circuit board comprising:
a plurality of output pads which are connected to the plurality of panel pads, respectively, and
an alignment pad spaced apart from the plurality of output pads along the second direction; and

a first pad spaced apart in the second direction from the plurality of output pads in a plan view and electrically insulated from the plurality of panel pads.

2. The electronic device of claim 1 , wherein the plurality of output pads have predetermined extension angles with respect to the first direction and at least two pads among the plurality of output pads have different extension angles.

3. The electronic device of claim 1 , wherein intervals of the plurality of panel pads become greater as distances from a center of the pad area increase.

4. The electronic device of claim 1 , wherein intervals of the plurality of output pads are different according to distances from a center of the pad area.

5. The electronic device of claim 1 , wherein the first pad is disposed between the plurality of output pads and the alignment pad in a plan view.

6. The electronic device of claim 1 , wherein each of the plurality of output pads extends obliquely with respect to the first direction and the second direction, and the plurality of output pads are arranged along the second direction.

7. The electronic device of claim 1 , wherein a length of the first pad in the first direction is greater than or equal to a length of the alignment pad in the first direction and is less than or equal to lengths of the plurality of output pads in the first direction.

8. The electronic device of claim 7 , wherein the display panel further comprises an additional alignment pad disposed on a base substrate on which the plurality of panel pads are disposed and spaced apart from the alignment pad in the first direction, and
wherein the first pad is spaced apart from the alignment pad, the output pad, and the additional alignment pad in a plan view.

9. The electronic device of claim 1 , wherein the plurality of output pads overlap the plurality of panel pads in a plan view and the first pad is spaced apart from the plurality of panel pads in a plan view.

10. The electronic device of claim 9 , further comprising an adhesive interconnect layer disposed between the display panel and the circuit board, and electrically connecting the display panel and the circuit board.

11. The electronic device of claim 10 , wherein the plurality of panel pads are disposed between a base substrate and a first insulation layer, and
wherein the adhesive interconnect layer is in contact with the first insulation layer in an area in which the adhesive interconnect layer is superimposed on the first pad.

12. The electronic device of claim 11 ,
wherein at least a portion of the plurality of panel pads are partially exposed by the first insulation layer, and
wherein the adhesive interconnect layer comprises:
an adhesive layer, and
a plurality of conductive particles dispersed in the adhesive layer, and
wherein the adhesive layer and the first insulation layer are in contact with each other in an area in which the adhesive interconnect layer is superimposed on the first pad.

13. The electronic device of claim 11 , further comprising a second insulation layer disposed between the first insulation layer and the base substrate,
wherein an adhesive force between the first insulation layer and the adhesive interconnect layer is greater than an adhesive force between the first insulation layer and the second insulation layer.

14. The electronic device of claim 1 , wherein the first pad is disposed on a flexible substrate.

15. The electronic device of claim 14 , wherein the display panel further comprises a second pad spaced apart from the plurality of panel pads and overlap the first pad in a plan view.

16. The electronic device of claim 15 , wherein the plurality of panel pads are disposed between a base substrate and a first insulation layer, and
wherein a portion of the first insulation layer overlapping the second pad is removed.

17. The electronic device of claim 1 , further comprising alignment mark which is spaced apart in the first direction and electrically insulated from the plurality of panel pads.

18. The electronic device of claim 17 , wherein the alignment mark is connected to a pad disposed in the outermost side among the plurality of output pads.

19. The electronic device of claim 17 , wherein the first pad comprises a plurality of sub-pads which are spaced apart from each other along the second direction.

20. The electronic device of claim 19 , wherein the sub-pads extend in a direction crossing the plurality of output pads.

21. The electronic device of claim 19 , wherein the sub-pads extend in a direction parallel to the plurality of output pads.

22. The electronic device of claim 21 , wherein the sub-pads extend in a direction parallel to the output pad closest to the sub-pads among the plurality of output pads.

23. The electronic device of claim 19 , wherein a length of the sub-pads in the first direction allows the sub-pads not to overlap the alignment mark.

24. The electronic device of claim 23 , wherein the length of the sub-pads in the first direction is larger than a length of the alignment pad in the first direction and the length of the sub-pads in the first direction is smaller than each length of the plurality of output pads in the first direction.

25. The electronic device of claim 24 , wherein the sub-pads comprises a first sub-pad disposed adjacent to the alignment pad, a second sub-pad, and a third sub-pad disposed adjacent to the plurality of output pads, the second sub-pad being disposed between the first sub-pad and the second sub-pad, and
wherein a shape of the first sub-pad is different from shapes of the second pad and the third sub-pad.

26. The electronic device of claim 25 , wherein the shape of the first sub-pad is similar to a shape of the alignment pads.

27. The electronic device of claim 25 , wherein a length of the second sub-pad and a length of the third sub-pad are similar to a length of the plurality of output pads, and
wherein a length of the first sub-pad is smaller than the length of the second sub-pad and the third sub-pad.

Assignees

• Samsung Display Co Ltd

Inventors

• Lee Chung-Seok
• Kim Joonsam
• Jung Chulho

Classifications

• H10W46/607

  Located on parts of packages, e.g. on encapsulations or on package substrates · CPC title

• H10W46/301

  for alignment · CPC title

• H10W46/101

  characterised by the type of information, e.g. logos or symbols · CPC title

• H10W46/00 Primary

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title