PCB production by laser systems

Patent metadata

Field	Value
Publication number	US-11877398-B2
Application number	US-202117249217-A
Country	US
Kind code	B2
Filing date	Feb 24, 2021
Priority date	Feb 11, 2021
Publication date	Jan 16, 2024
Grant date	Jan 16, 2024

Abstract

Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

First claim

What is claimed is:

1. A method of fabricating a printed circuit board (PCB) assembly, comprising depositing a layer of metal on a PCB substrate by laser-assisted deposition (LAD) in which jetting of metal droplets from a first donor substrate onto the PCB substrate and/or into one or more holes therein is effected using a laser to form the layer of metal on the PCB substrate, the layer of metal being subsequently dried and sintered, with the jetting, drying, and sintering being repeated until the layer of metal reaches a desired thickness, and thereafter forming at least one passivation layer over the layer of metal by jetting an epoxy from a second donor substrate using the same laser that was used for forming the layer of metal on the PCB to form a layer of the epoxy.

2. The method of fabricating the PCB assembly as in claim 1 , further comprising ablating the layer of metal if it exceeds the desired thickness.

3. The method of fabricating the PCB assembly as in claim 2 , wherein the ablating is performed using the laser used to jet the metal droplets from the first donor substrate.

4. The method of fabricating the PCB assembly as in claim 1 , further comprising printing an additional metal layer over the layer of epoxy by LAD.

5. The method of fabricating the PCB assembly as in claim 4 , wherein the layer of metal includes a first metal trace, the epoxy layer includes at least a first portion of epoxy that covers at least a first portion of the first metal trace, and the additional metal layer includes a second metal trace having at least a portion disposed over the first portion of the epoxy layer that covers the first portion of the first metal trace.

6. The method of fabricating the PCB assembly as in claim 1 , further comprising curing the layer of epoxy by hot air and/or infrared (IR) irradiation.

7. The method of fabricating the PCB assembly as in claim 1 , wherein the one or more holes in the PCB substrate are formed in a first side of the PCB substrate by drilling or laser engraving the first side of the PCB substrate, but do not pass through an entire thickness of the PCB substrate, the layer of metal is formed in the one or more holes by LAD from the first side of the PCB substrate, the PCB substrate is subsequently flipped and the one or more holes are completed through the thickness of the PCB substrate by drilling or laser engraving through a second side of PCB substrate, and remaining portions of the one or more holes exposed by the drilling or laser engraving through the second side of PCB substrate are metalized by LAD.

8. The method of fabricating the PCB assembly as in claim 1 , further comprising printing a solder mask layer over the at least one passivation layer and any intervening layers and/or components of the PCB assembly, the solder mask layer being printed by LAD.

9. The method of fabricating the PCB assembly as in claim 8 , further comprising printing a label by LAD over the solder mask layer.

10. The method of fabricating the PCB assembly as in claim 9 , further comprising printing metal connectors in holes in the solder mask layer by LAD.

11. The method of fabricating the PCB assembly as in claim 1 , further comprising printing metal connectors in holes in the layer of epoxy by LAD.

12. A method of fabricating of a printed circuit board (PCB) assembly, comprising printing, by laser assisted deposition (LAD) a metal onto an epoxy laminate, the metal being jetted as droplets from a metal coating or foil on a donor substrate by a laser into channels and/or holes created in the epoxy laminate by laser engraving, and subsequently attaching the epoxy laminate to a PCB substrate or a previously formed epoxy layer disposed over the PCB substrate by hot pressing to form at least a portion of the PCB assembly, with the metal jetted into the channels and/or holes of the epoxy laminate being between the PCB substrate and an upper surface of the epoxy laminate in the portion of the PCB assembly and the epoxy laminate forming a passivation layer over the metal.

13. The method of fabricating the PCB assembly as in claim 12 , further comprising printing a solder mask layer over the upper surface of the epoxy laminate and any intervening layers and/or components of the PCB assembly, the solder mask layer being printed by LAD.

14. The method of fabricating the PCB assembly as in claim 13 , further comprising printing metal connectors in holes in the solder mask layer by LAD.

15. The method of fabricating the PCB assembly as in claim 13 , further comprising printing a label by LAD over the solder mask layer.

16. A method for fabricating a printed circuit board (PCB) assembly, comprising:
drilling or laser engraving one or more vias in a PCB substrate from a first side of the PCB substrate, the vias not extending through an entire thickness of the PCB substrate;
depositing, by laser-assisted deposition (LAD), a metal paste over at least a first portion of the PCB substrate and into the one or more vias to a first thickness, the depositing performed by jetting metal paste from a donor film on a first carrier substrate by an incident laser beam onto the PCB substrate and into the one or more vias, curing the metal paste deposited on the at least first portion of the PCB substrate and into the one or more vias, and sintering the deposited and cured metal paste using a same laser that was used for depositing the metal paste, and repeating the depositing, curing and sintering of the metal paste, thereby forming successive thicknesses thereof on the PCB substrate and in the one or more vias, until a desired thickness of the metal paste on the PCB substrate and in the one or more vias is reached;
printing a passivation layer by LAD on the desired thickness of metal paste on the PCB substrate and in the one or more vias, the printing performed by jetting epoxy from a second carrier substrate using the same laser that was used for depositing the metal paste, and curing the passivation layer; and
forming a solder mask by LAD over the passivation layer, the solder mask being formed by jetting mask material from a third carrier substrate using the same laser that was used for depositing the metal paste, and curing the solder mask.

17. The method of fabricating the PCB assembly of claim 16 , wherein the solder mask layer is cured using heat or ultraviolet (UV) irradiation.

18. The method of fabricating the PCB assembly of claim 17 , wherein the passivation layer is cured using heat or infrared (IR) irradiation.

19. The method of fabricating the PCB assembly of claim 18 , wherein the metal paste is cured using heat or infrared (IR) irradiation.

20. The method of fabricating the PCB assembly of claim 19 , wherein the PCB substrate is moved between the drilling, the depositing, the printing, and the forming processes on a stage translatable between positions at which the drilling, the depositing, the printing, and the forming processes take place.

21. The method of fabricating the PCB assembly of claim 19 , wherein the processes of depositing of metal paste and printing of passivation layers are performed multiple times prior to forming the solder mask so as to form multiple layers of both metal paste and epoxy between the PCB substrate and the solder mask.

22. The method of fabricating the PCB assembly of claim 19 , further comprising forming first metal electrical connectors for an electronic component within the passivation layer prior to forming the solder mask.

23. The met

Assignees

• Io Tech Group Ltd

Inventors

• Zenou Michael
• Nesher Guy

Classifications

• H05K1/111 Primary

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K3/341

  Surface mounted components · CPC title

• H05K13/046

  Surface mounting (surface mounted components H05K3/341) · CPC title

• H05K2201/10666

  Plated through-hole for surface mounting on PCB · CPC title

• H05K3/0032 Primary

  of organic insulating material · CPC title