Planarization apparatus, planarization process, and method of manufacturing an article

Patent metadata

Field	Value
Publication number	US-11869813-B2
Application number	US-202017122910-A
Country	US
Kind code	B2
Filing date	Dec 15, 2020
Priority date	Dec 15, 2020
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

A method of real time leveling control between a superstrate and a substrate is provided. A contact force model indicating a relationship between a total contact force for planarization of a formable material between the superstrate and the substrate and a force component of the total contact force along each of a plurality peripheral axes is identified. A set point force required for performing the planarization is determined. Each force component is calculated based on the contact force model. The planarization is performed by applying each force component along a corresponding axis of the plurality of axes. The contact force model is identified based on a parallel condition between two contacting surfaces of a superstrate chuck for retaining the superstrate and a stack of the superstrate, the substrate, and formable material between the superstrate and the substrate.

First claim

What is claimed is:

1. A method of leveling control between a superstrate and a substrate, comprising:
identifying a contact force model indicating a relationship between a total contact force for planarization of a formable material between the superstrate and the substrate and a force component of the total contact force along each of a plurality of peripheral axes; and
determining a set point force required for performing the planarization;
calculating each force component based on the contact force model; and
performing planarization by applying each force component along a corresponding axis of the plurality of peripheral axes;
wherein the contact force model is identified based on a parallel condition between two contacting surfaces of:
a superstrate chuck for retaining the superstrate; and
a stack of the superstrate, the substrate, and formable material between the superstrate and the substrate.

2. The method of claim 1 , wherein each of the plurality of peripheral axes extend in a parallel direction with respect to an axis along which a planarization head moves orthogonal to a reference plane.

3. The method of claim 2 , wherein each of the peripheral axes are equidistant from a center of a superstrate chuck and are uniformly azimuthally distributed around a periphery of the stack of the superstrate, the substrate, and the formable material.

4. The method of claim 2 , wherein the reference plane is within 100 milliradians of parallelism with a top surface of a substrate chuck.

5. The method of claim 1 , further comprising estimating force components of the total contact force by:
measuring a force generated by an actuator along each of the plurality of peripheral axes at each of a plurality of positions along a first axis of the plurality of the peripheral axes; and
adjusting the measured force to obtain an estimated contact force based on a calibrated spring forces caused by a mechanical compliance force and the parallel condition.

6. The method of claim 5 , wherein the mechanical compliance force includes spring forces.

7. The method of claim 6 , further comprising estimating the calibrated spring forces, prior to performing planarization by:
moving a planarization head including the superstrate chuck to a first position above where the stack is to be located when planarization is being performed;
gathering positions and information of applied control forces of the planarization head after the planarization head settling down to the first position;
moving the planarization head to a second position below where the stack will be located when planarization is being performed;
gathering positions and applied forces information of the planarization head after the planarization head settling down to the second position; and
calibrating the spring force based on the position and applied forces information gathered from upward and downward movements of the planarization head.

8. The method of claim 6 , wherein calibrating the spring forces further comprises moving the planarization head and a substrate chuck for holding the substrate away from each other prior to moving the planarization head.

9. The method of claim 5 , further comprising resetting the calibrated spring forces of the plurality of peripheral axes by collecting and averaging a plurality of measurements of the estimated contact force over a predetermined period of time.

10. A method of manufacturing an article, comprising:
applying a formable material on a substrate;
moving planarization head close to a proximity of contact surfaces between contact surfaces of a superstrate and a stack of a superstrate and the substrate;
resetting force offsets before contact between the superstrate and the substrate;
identifying a contact force mode indicating a relationship between a total contact force for planarization of a formable material between the superstrate and the substrate and a force component of the total contact force along each of a plurality peripheral axes; and
determining a set point force required for performing the planarization;
calculating each force component based on the contact force model; and
performing planarization by applying each force component along a corresponding axis of the plurality of axes;
wherein the contact force model is identified based on a parallel condition between two contacting surfaces of:
a superstrate chuck for retaining the superstrate; and
a stack of the superstrate and the substrate.

11. The method of claim 10 , wherein each of the plurality of peripheral axes extends in parallel with a displacement axis along which the planarization head moves.

12. The method of claim 11 , further comprising estimating the total contact force by:
measuring a force generated by an actuator along each of the plurality of axes at each of a plurality of positions along a first axis of the plurality of the axes; and
adjusting the measured force to obtain an estimated contact force based on a calibrated spring force caused by a mechanical compliance force and the parallel condition.

13. The method of claim 12 , wherein the mechanical compliance force includes spring forces.

14. The method of claim 13 , further comprising calibrating the spring forces, prior to performing planarization by:
moving a planarization head including the superstrate chuck to a first position above where the stack will be located when planarization is being performed;
gathering positions and applied forces information of the planarization head after the planarization head settling down to the first position;
moving the planarization head to a second position below where the stack will be located when planarization is being performed;
gathering positions and applied forces information of the planarization head after the planarization head settling down to the second position; and
calibrating the spring force based on the positions and applied forces information gathered from upward and downward movements of the planarization head.

15. The method of claim 12 , further comprising resetting the calibrating force offsets of the plurality of axes by collecting and averaging a plurality of measurements of the estimated contact force over a predetermined period of time.

16. The method of claim 12 , further comprising measuring the parallel condition between two contacted surface based on rotation of the stack about axes orthogonal to the displacement axis of the planarization head.

Assignees

• Canon Kk

Inventors

• Lu Xiaoming

Classifications

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10W74/016

  using moulds · CPC title

• H10P74/23 Primary

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P95/06

  Planarisation of inorganic insulating materials · CPC title