Mold clamping device of injection molding machine and method of adjusting mold thickness of mold clamping device

US11865756B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11865756-B2
Application numberUS-202017113120-A
CountryUS
Kind codeB2
Filing dateDec 7, 2020
Priority dateDec 9, 2019
Publication dateJan 9, 2024
Grant dateJan 9, 2024

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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A mold clamping device of an injection molding machine includes a mold clamping shaft fixed to a movable platen, a mold clamping ram to press the mold clamping shaft against a fixed platen, a ram position detecting member that detects a position of the mold clamping ram, an encoder detecting a position of the movable platen, a ram position control member that hydraulically controls a position of the mold clamping ram, a storage unit storing a difference value of mold closing positions of the movable platen before and after mold replacement, and a control unit. The control unit calculates the difference value when mold thickness adjustment is performed, calculates a movement position of the mold clamping ram based on a current position of the mold clamping ram and the difference value, moves the mold clamping ram to the movement position, and stops the mold clamping ram to perform mold clamping.

First claim

Opening claim text (preview).

What is claimed is: 1. A mold clamping device of an injection molding machine comprising: a mold clamping shaft integrated with a mold opening/closing nut, the mold opening/closing nut is adapted to be moved by rotating a mold opening/closing screw shaft to perform opening and closing of a movable platen; a mold clamping ram incorporated in a support platen pressing the mold clamping shaft, the mold clamping ram hydraulically performing mold clamping of the movable platen, wherein the mold clamping shaft includes annular convex parts at a constant pitch on an outer circumference thereof, a half nut device incorporating a half nut which engages with the annular convex parts is coaxially attached to a distal end of the mold clamping ram, and the mold clamping shaft, the half nut device, and the mold clamping ram are disposed on one shaft, the mold clamping device further comprising: a ram position detecting member which detects a position of the mold clamping ram; an encoder which detects a position of the movable platen; a ram position control member which hydraulically controls the position of the mold clamping ram; a storage unit which stores a difference value between a first mold closing position of the movable platen for a first mold, and a second mold closing position of the movable platen for a second mold; and a control unit which performs is control of the mold clamping device, wherein the control unit calculates the difference value when mold thickness adjustment is performed, calculates a movement position of the mold clamping ram on the basis of a current position of the mold clamping ram and the difference value, moves the mold clamping ram to the movement position, and then causes the half nut to engage with the mold clamping shaft to perform the mold clamping of the movable platen. 2. The mold clamping device of an injection molding machine according to claim 1 , wherein the mold clamping device further includes a photoelectric detector provided in the half nut, when a first mold thickness adjustment is performed after power is supplied to the mold clamping device, the control unit moves the mold clamping ram from a rearward limit, stops the mold clamping ram when the photoelectric detector detects that the annular convex parts have reached a position facing teeth of the half nut, and performs the mold clamping, and when the mold thickness adjustment is performed for a second time and subsequent times after power is supplied to the mold clamping device, the control unit moves the mold clamping ram to the movement position calculated on the basis of the difference value and then performs the mold clamping. 3. The mold clamping device of an injection molding machine according to claim 1 , wherein the mold clamping device offsets the movement position by a pitch of the annular convex parts when the movement position calculated by adding the current position of the mold clamping ram to the difference value does not fall within a range from a rearward limit position of the mold clamping ram to a forward limit position of the mold clamping ram. 4. The mold clamping device of an injection molding machine according to claim 2 , wherein the mold clamping device offsets the movement position by a pitch of the annular convex parts when the movement position calculated by adding the current position of the mold clamping ram to the difference value does not fall within a range from a rearward limit position of the mold clamping ram to a forward limit position of the mold clamping ram. 5. A method of adjusting a mold thickness of a mold clamping device in which opening and closing of a movable platen is performed by rotating a mold opening/closing screw shaft to move a mold opening/closing nut and moving a mold clamping shaft integrated with the mold opening/closing nut, and mold clamping of the movable platen is hydraulically performed by a mold clamping ram incorporated in a support platen pressing the mold clamping shaft, the method of adjusting a mold thickness of a mold clamping device comprising: a difference value calculation step of calculating a difference value of a first mold closing position of the movable platen for a first mold, and a second mold closing position of the movable platen for a second mold; a movement position calculation step of calculating a movement position of the mold clamping ram on the basis of a current position of the mold clamping ram and the difference value; and a mold clamping step of performing mold clamping of the movable platen by engaging a half nut coaxially attached to a distal end of the mold clamping ram with the mold clamping shaft after the mold clamping ram is moved to the movement position. 6. The method of adjusting a mold thickness of a mold clamping device according to claim 5 , wherein, when a mold thickness is adjusted for a first time after power is supplied to the mold clamping device, the mold clamping ram is moved from a rearward limit, the mold clamping ram is stopped when it is detected that annular convex parts formed on an outer circumference of the mold clamping shaft have reached a position facing teeth of the half nut, and the mold clamping is performed, and when a mold thickness is adjusted for a second time and subsequent times after power is supplied to the mold clamping device, the mold clamping ram is moved to the movement position calculated in the movement position calculation step and then the mold clamping is performed. 7. The method of adjusting a mold thickness of a mold clamping device according to claim 5 , wherein the movement position calculation step calculates a position that is offset from the movement position by a pitch of the annular convex parts as a new movement position when the movement position calculated by adding the current position of the mold clamping ram to the difference value does not fall within a range from a rearward limit position of the mold clamping ram to a forward limit position of the mold clamping ram. 8. The method of adjusting a mold thickness of a mold clamping device according to claim 6 , wherein the movement position calculation step calculates a position that is offset from the movement position by a pitch of the annular convex parts as a new movement position when the movement position calculated by adding the current position of the mold clamping ram to the difference value does not fall within a range from a rearward limit position of the mold clamping ram to a forward limit position of the mold clamping ram.

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What does patent US11865756B2 cover?
A mold clamping device of an injection molding machine includes a mold clamping shaft fixed to a movable platen, a mold clamping ram to press the mold clamping shaft against a fixed platen, a ram position detecting member that detects a position of the mold clamping ram, an encoder detecting a position of the movable platen, a ram position control member that hydraulically controls a position o…
Who is the assignee on this patent?
Sodick Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/80. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 09 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).