Mold clamping device of injection molding machine and method of adjusting mold thickness of mold clamping device
US-11865756-B2 · Jan 9, 2024 · US
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Patent family 71402462
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 71402462 |
| Family type | — |
| Earliest priority | Dec 9, 2019 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11865756B2 — Mold clamping device of injection molding machine and method of adjusting mold thickness of mold clamping device |
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US11865756B2 — Mold clamping device of injection molding machine and method of adjusting mold thickness of mold clamping device (published Jan 9, 2024)
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