Composite structure and housing for electronic device

Patent metadata

Field	Value
Publication number	US-11865750-B2
Application number	US-201917267342-A
Country	US
Kind code	B2
Filing date	Aug 7, 2019
Priority date	Aug 10, 2018
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

A composite structure includes: a metal member; and a thermoplastic resin member bonded to the metal member, in which the metal member has a fine uneven structure at least on a metal surface to which the thermoplastic resin member is bonded, a hardness of the thermoplastic resin member measured by a type A durometer in accordance with JIS K6253 is in a range of equal to or more than A60 and equal to or less than A95, and an acid value of the thermoplastic resin member is equal to or more than 1 mgKOH/g and equal to or less than 100 mgKOH/g. The thermoplastic resin member preferably contains a urethane-based thermoplastic elastomer, an amide-based thermoplastic elastomer, and an acid-modified polyolefin.

First claim

The invention claimed is:

1. A composite structure comprising:
a metal member; and
a thermoplastic resin member bonded to the metal member,
wherein the metal member has a fine uneven structure at least on a metal surface to which the thermoplastic resin member is bonded,
a hardness of the thermoplastic resin member measured by a type A durometer in accordance with JIS K6253 is in a range of equal to or more than A60 and equal to or less than A95, and
an acid value of the thermoplastic resin member is equal to or more than 1 mgKOH/g and equal to or less than 100 mgKOH/g,
wherein an average length (RSm) of a roughness curve element of the metal surface on which the fine uneven structure is formed, the average length being measured in accordance with JIS B0601: 2001, is equal to or more than 10 nm and equal to or less than 500 μm;
a ten-point average roughness (Rzjis) of the metal surface on which the fine uneven structure is formed, the ten-point average roughness being measured in accordance with JIS B0601: 2001, is equal to or more than 10 nm and equal to or less than 300 μm;
the thermoplastic resin member contains a thermoplastic elastomer; and
the thermoplastic elastomer consists of an elastic material that does not need to be vulcanized,
wherein the thermoplastic resin member contains a urethane-based thermoplastic elastomer and an amide-based thermoplastic elastomer,
wherein the thermoplastic resin member further contains an acid-modified polymer,
wherein, in the thermoplastic elastomer, a content of the urethane-based thermoplastic elastomer is equal to or more than 70% by mass and equal to or less than 99% by mass, and a content of the amide-based thermoplastic elastomer is equal to or more than 1% by mass and equal to or less than 30% by mass, and
wherein, in the thermoplastic resin member, a content of the thermoplastic elastomer is equal to or more than 60% by mass and equal to or less than 95% by mass, and a content of the acid-modified polymer is equal to or more than 5% by mass and equal to or less than 40% by mass.

2. The composite structure according to claim 1 ,
wherein the hardness of the thermoplastic resin member is in a range of equal to or more than A71 and equal to or less than A95.

3. The composite structure according to claim 1 ,
wherein the metal member is a surface roughened aluminum alloy plate.

4. The composite structure according to claim 1 ,
wherein the acid-modified polymer is an ethylene/(meth)acrylic acid copolymer.

5. The composite structure according to claim 1 ,
wherein, in the thermoplastic elastomer, the content of the urethane-based thermoplastic elastomer is equal to or more than 75% by mass and equal to or less than 98% by mass, and the content of the amide-based thermoplastic elastomer is equal to or more than 2% by mass and equal to or less than 25% by mass.

6. The composite structure according to claim 1 ,
wherein the metal member is a surface roughened aluminum alloy plate, and
the acid-modified polymer is an ethylene/(meth)acrylic acid copolymer, and
wherein, in the thermoplastic elastomer, the content of the urethane-based thermoplastic elastomer is equal to or more than 75% by mass and equal to or less than 98% by mass, and the content of the amide-based thermoplastic elastomer is equal to or more than 2% by mass and equal to or less than 25% by mass.

7. A housing for an electronic device, comprising:
the composite structure according to claim 1 ,
wherein the housing for an electronic device has a first metal member and a second metal member,
the first metal member is the metal member,
a packing formed of the thermoplastic resin member is bonded to a peripheral edge part of the first metal member, and
an outer shell is formed by integrating the second metal member with the first metal member, with the packing interposed therebetween.

8. A housing for an electronic device, comprising the composite structure according to claim 1 ,
wherein the housing for an electronic device has a plastic member,
a packing formed of the thermoplastic resin member is bonded to a peripheral edge part of the metal member, and
an outer shell is formed by integrating the metal member with the plastic member, with the packing interposed therebetween.

Assignees

• Mitsui Chemicals Inc

Inventors

• Tominaga Takahiro
• Kimura Kazuki

Classifications

• B29C45/14467 Primary

  Joining articles or parts of a single article (B29C45/14377, B29C45/14385, B29C45/14581, B29C45/14614 and B29C45/006 take precedence) · CPC title

• B29C45/2708

  Gates (B29C45/2703 takes precedence) · CPC title

• B29C65/56

  using mechanical means {or mechanical connections, e.g. form-fits} · CPC title

• B29C66/7422

  Aluminium or alloys of aluminium · CPC title

• B29K2075/00

  Use of {PU, i.e.} polyureas or polyurethanes {or derivatives thereof}, as moulding material · CPC title