Fabric-mounted components

Patent metadata

Field	Value
Publication number	US-11864322-B2
Application number	US-202318164180-A
Country	US
Kind code	B2
Filing date	Feb 3, 2023
Priority date	Apr 27, 2020
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

First claim

What is claimed is:

1. An item, comprising:
fabric comprising strands of material, wherein the strands of material include a conductive strand; and
an electrical component mounted to the fabric, wherein the electrical component comprises a substrate, a contact on the substrate, an encapsulant, and a conductive via passing through the encapsulant, and wherein the conductive via electrically couples the conductive strand to the contact.

2. The item defined in claim 1 wherein the electrical component comprises an electrical device mounted to the substrate and wherein the encapsulant encapsulates the electrical device.

3. The item defined in claim 2 wherein the substrate comprises a printed circuit substrate.

4. The item defined in claim 2 wherein the encapsulant comprises thermoplastic material.

5. The item defined in claim 2 further comprising solder that electrically couples the conductive strand to the conductive via.

6. The item defined in claim 5 wherein the conductive via passes through a trench in the encapsulant and wherein the solder is at least partially received within the trench.

7. The item defined in claim 5 wherein the conductive via has a non-planar surface that is soldered to the conductive strand.

8. The item defined in claim 1 further comprising an encapsulation film on the electrical component, wherein the conductive strand is interposed between the conductive via and the encapsulation film.

9. The item defined in claim 2 wherein the substrate has first and second opposing surfaces, wherein the electrical device is mounted to the first surface, and wherein the electrical component comprises an additional electrical device mounted to the second surface.

10. The item defined in claim 9 further comprising an additional encapsulant that encapsulates the additional electrical device.

11. An item, comprising:
knit fabric comprising strands of material, wherein the strands of material include a conductive strand; and
an electrical component mounted to the knit fabric, wherein the electrical component comprises an electrical device encapsulated by a protective structure, and wherein the protective structure comprises a trench and an interconnect passing through the trench that electrically couples the electrical device to the conductive strand.

12. The item defined in claim 11 wherein the interconnect is selected from the group consisting of: a conductive via and printed circuit layers.

13. The item defined in claim 11 further comprising solder in the trench that electrically couples the conductive strand to the interconnect.

14. The item defined in claim 11 wherein the electrical component comprises a printed circuit substrate to which the electrical device is mounted.

15. The item defined in claim 14 wherein the electrical component comprises a contact pad on the printed circuit substrate that is electrically coupled to the interconnect in the trench.

16. An item, comprising;
fabric formed from strands of material, wherein the strands of material include first and second conductive strands; and
an electrical component mounted to the fabric, wherein the electrical component comprises a printed circuit substrate, first and second contact pads on the printed circuit substrate, first and second grooves overlapping the printed circuit substrate, and first and second interconnect structures respectively received within the first and second grooves, wherein the first interconnect structure electrically couples the first conductive strand to the first contact pad, and wherein the second interconnect structure electrically couples the second conductive strand to the second contact pad.

17. The item defined in claim 16 wherein the fabric comprises knit fabric and wherein the electrical component comprises an electrical device on the printed circuit substrate.

18. The item defined in claim 17 wherein the electrical component comprises a plastic protective structure and wherein the first and second grooves are formed in the plastic protective structure.

19. The item defined in claim 18 wherein the electrical device comprises an optical component and wherein the plastic protective structure is transparent.

20. The item defined in claim 17 wherein the first and second interconnect structures are selected from the group consisting of: conductive vias and printed circuit layers.

Assignees

• Apple Inc

Inventors

• Ibrahim Kani Bilal Mohamed
• Grena Benjamin J
• Kim Kyusang
• Kindlon David M
• Lupo Pierpaolo
• Renjan Kishore N
• Vadeentavida Manoj

Classifications

• H10W70/655

  Fan-out layouts · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title