Component carrier with an embedded thermally conductive block and manufacturing method

Patent metadata

Field	Value
Publication number	US-11864306-B2
Application number	US-202117302061-A
Country	US
Kind code	B2
Filing date	Apr 22, 2021
Priority date	Apr 27, 2020
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

A component carrier includes i) a first layer stack having a first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, iii) a second layer stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. Hereby, the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described.

First claim

The invention claimed is:

1. A component carrier, comprising:
a first layer stack comprising a plurality of first electrically conductive layer structures and a plurality of first electrically insulating layer structures wherein the first layer stack is a first pre-manufactured stack;
a component embedded in the first layer stack;
a second layer stack comprising a plurality of second electrically conductive layer structure and a plurality of second electrically insulating layer structures, wherein the second layer stack is a second pre-manufactured stack; and
a thermally conductive block embedded in the second layer stack;
wherein the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK;
wherein the first layer stack and the second layer stack are laminated together;
wherein the first layer stack and the second layer stack are connected by an electrically insulating layer;
wherein the electrically insulating layer comprises an opening at an interface between the component and the thermally conductive block;
wherein at least a part of a thermally conductive coupling medium is arranged within the opening to thermally connect the component and the thermally conductive block;
wherein the electrically insulating layer is arranged between one of the first electrically conductive layer structures of the first layer stack and one of the second electrically conductive layer structures of the second layer stack,
wherein the electrically insulating layer comprises a plurality of openings between the first electrically conductive layer structures and the second electrically conductive layer structures, and
wherein in at least a part of the openings thermally conductive material is arranged in order to thermally connect the first electrically conductive layer structure and the second electrically conductive layer structure.

2. The component carrier according to claim 1 ,
wherein the thermal path is oriented at least partially along the Z-axis of the component carrier.

3. The component carrier according to claim 1 ,
wherein the thermal path is continuously electrically conductive.

4. The component carrier according to claim 1 , wherein the thermally conductive coupling medium comprises at least one of the following features:
wherein the thermally conductive coupling medium comprises a thermally conductive paste;
wherein the thermally conductive coupling medium comprises a copper layer and/or conductive micro vias.

5. The component carrier according to claim 1 ,
wherein the embedded electronic component is a power chip or a high frequency chip.

6. The component carrier according to claim 1 ,
wherein the thermally conductive block is a metal block, in particular a copper block.

7. The component carrier according to claim 1 ,
wherein a lateral extension of the thermally conductive block is equal to or larger than a lateral extension of the embedded component.

8. The component carrier according to claim 1 ,
wherein the thermal path has a minimum width of at least the width of the embedded component.

9. The component carrier according to claim 1 ,
wherein the component is embedded such that a main surface of the component is flush with an outer main surface of the first layer stack.

10. The component carrier according to claim 1 ,
wherein the thermally conductive block is embedded such that a main surface of the thermally conductive block is flush with an outer main surface of the second layer stack.

11. The component carrier according to claim 1 , further comprising at least one of the following features:
wherein an electric signal of the embedded component is conducted exclusively to a further exterior surface of the component carrier, wherein the further exterior surface opposes the exterior surface;
wherein the first layer stack and the second layer stack have different integration densities and/or are made of different materials.

12. The component carrier according to claim 1 , comprising at least one of the following features:
wherein the at least one embedded component is selected from a group consisting of an electronic component, an electrically non-conductive and/or electrically conductive inlay, a heat transfer unit, a light guiding element, an optical element, a bridge, an energy harvesting unit, an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, an integrated circuit, a signal processing component, a power management component, an optoelectronic interface element, a voltage converter, a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier, and a logic chip;
wherein at least one of the electrically conductive layer structures of the component carrier comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten;
wherein the electrically insulating layer structure comprises at least one of the group consisting of reinforced or non-reinforced resin, epoxy resin or bismaleimide-triazine resin, FR-4, FR-5, cyanate ester resin, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based build-up film, polytetrafluoroethylene, a ceramic, and a metal oxide;
wherein the component carrier is shaped as a plate;
wherein the component carrier is configured as one of the group consisting of a printed circuit board, a substrate, and an interposer;
wherein the component carrier is configured as a laminate-type component carrier.

13. The component carrier according to claim 1 ,
wherein the thermal path from the embedded component via the thermally conductive block up to the exterior surface of the component carrier has a minimum thermal conductivity of at least 40 W/mK.

14. A method of manufacturing a component carrier, comprising:
embedding a component in a first layer stack comprising a plurality of first electrically conductive layer structures and at least one first electrically insulating layer structure, wherein the first layer stack is a first pre-manufactured stack;
embedding a thermally conductive block in a second layer stack comprising a plurality of second electrically conductive layer structures and at least one second electrically insulating layer structure, wherein the second layer stack is a second pre-manufactured stack;
laminating the first layer stack and the second layer stack together;
connecting the first layer stack and the second layer stack by an electrically insulating layer, wherein the electrically insulating layer comprises an opening at an interface between the component and the thermally conductive block;
connecting the first layer stack with the second layer stack so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a thermal conductivity of at least 7 W/mK;
arranging at least a part of a thermally conductive coupling medium within the opening to thermally connect the component and the thermally conductive block;
wherein the electrically insulating layer is arranged between one of the first electrically conductive layer structures of the first layer stack and one of the second electrically

Assignees

• At & S Austria Tech & Systemtechnik Ag
• At&Saustria Tech & Systemtechnik Ag

Inventors

• Schlaffer Erich
• Sattler Sebastian

Classifications

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H05K3/4611

  by laminating two or more circuit boards (H05K3/4652 takes precedence) · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H05K2203/061

  of previously made multilayered subassemblies · CPC title