Multi-layer matching structures for high frequency signal transmission

Patent metadata

Field	Value
Publication number	US-11863224-B2
Application number	US-202117223888-A
Country	US
Kind code	B2
Filing date	Apr 6, 2021
Priority date	Oct 2, 2020
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.

First claim

What is claimed is:

1. An electronic device comprising:
a dielectric substrate having stacked dielectric layers;
a contact pad on a surface of the dielectric substrate;
a radio-frequency component mounted to the contact pad;
a radio-frequency transmission line path having a signal trace embedded in the dielectric substrate, wherein the radio-frequency transmission line path and the radio-frequency component are configured to convey radio-frequency signals; and
impedance matching structures that are embedded in the dielectric substrate and that couple the signal trace to the contact pad, wherein the impedance matching structures comprise a set of conductive vias with different aspect ratios.

2. The electronic device of claim 1 , the impedance matching structures comprising a set of via pads, the set of conductive vias being coupled in series between the signal trace and the contact pad, each via pad in the set of via pads having a lateral area, and wherein the lateral area varies across the set of via pads.

3. The electronic device of claim 1 , the impedance matching structures comprising a set of via pads, and the set of conductive vias being coupled in series between the signal trace and the contact pad.

4. The electronic device of claim 3 , wherein each via pad in the set of via pads has a lateral area and the lateral area varies across the set of via pads.

5. The electronic device of claim 1 , further comprising:
a dielectric resonator antenna having a dielectric resonating element mounted to the surface of the dielectric substrate, wherein the radio-frequency component comprises a feed probe for the dielectric resonator antenna.

6. The electronic device of claim 1 , wherein the radio-frequency component comprises a board-to-board connector.

7. The electronic device of claim 1 , wherein the radio-frequency component comprises an interposer.

8. The electronic device of claim 1 , wherein the impedance matching structures comprise:
a first via pad having a first lateral area; and
a second via pad having a second lateral area that is different from the first lateral area.

9. The electronic device of claim 8 , further comprising:
ground traces embedded in the dielectric substrate, wherein the ground traces have an opening that overlaps the radio-frequency component.

10. The electronic device of claim 9 , wherein the impedance matching structures comprise:
an additional signal trace that couples the first via pad to the signal trace, wherein the additional signal trace is wider than the signal trace.

11. An electronic device comprising:
a dielectric substrate having stacked dielectric layers;
a contact pad on a surface of the dielectric substrate;
a radio-frequency component mounted to the contact pad;
a radio-frequency transmission line path having a signal trace embedded in the dielectric substrate, wherein the radio-frequency transmission line path and the radio-frequency component are configured to convey radio-frequency signals; and
impedance matching structures that are embedded in the dielectric substrate and that couple the signal trace to the contact pad, wherein the impedance matching structures comprise a set of conductive vias, a first via pad having a first lateral area, and a second via pad having a second lateral area that is different from the first lateral area.

12. The electronic device of claim 11 , wherein the impedance matching structures comprise:
a third via pad;
a first conductive via that couples the first via pad to the second via pad, the first conductive via having a first width; and
a second conductive via that couples the second via pad to the third via pad, the second conductive via having a second width that is different from the first width.

13. An electronic device comprising:
a dielectric substrate having a first, second, and third layers, the second layer being interposed between the first and third layers;
a first via pad on the first layer;
a first conductive via coupled to the first via pad and having a first aspect ratio;
a second via pad on the second layer;
a second conductive via coupled to the second via pad and having a second aspect ratio that is different from the first aspect ratio;
a contact pad on the third layer;
a radio-frequency component surface-mounted to the contact pad; and
a radio-frequency transmission line path having a signal conductor in the dielectric substrate that is coupled to the radio-frequency component through the first via pad, the first conductive via, the second via pad, and the second conductive via, the radio-frequency transmission line path and the radio-frequency component being configured to convey radio-frequency signals at a frequency greater than 10 GHz.

14. The electronic device of claim 13 , wherein the first via pad has a first lateral area and the second via pad has a second lateral area that is different from the first lateral area.

15. The electronic device of claim 13 , further comprising:
a fourth layer in the dielectric substrate, the first layer being interposed between the fourth and second layers;
a third via pad on the fourth layer; and
a third conductive via coupled to the third via pad.

16. The electronic device of claim 15 , wherein the third conductive via has a third aspect ratio that is different from the first and second aspect ratios.

17. An electronic device comprising:
a dielectric substrate having a first, second, and third layers, the second layer being interposed between the first and third layers;
a first via pad on the first layer and having a first lateral area;
a first conductive via coupled to the first via pad;
a second via pad on the second layer and having a second lateral area that is different from the first lateral area;
a second conductive via coupled to the second via pad;
a contact pad on the third layer;
a radio-frequency component surface-mounted to the contact pad; and
a radio-frequency transmission line path having a signal conductor in the dielectric substrate that is coupled to the radio-frequency component through the first via pad, the first conductive via, the second via pad, and the second conductive via, the radio-frequency transmission line path and the radio-frequency component being configured to convey radio-frequency signals at a frequency greater than 10 GHz.

18. The electronic device of claim 17 , further comprising:
a fourth layer in the dielectric substrate, the first layer being interposed between the fourth and second layers;
a third via pad on the fourth layer and having a third lateral area that is different from the first and second lateral areas; and
a third conductive via coupled to the third via pad.

19. The electronic device of claim 17 , further comprising:
a dielectric resonator antenna having a dielectric resonating element mounted to the third layer, wherein the radio-frequency component comprises a feed probe for the dielectric resonator antenna.

Assignees

• Apple Inc

Inventors

• Avser Bilgehan
• Rajagopalan Harish
• Edwards Jennifer M
• Paulotto Simone
• Yong Siwen

Classifications

• H04B1/40 Primary

  Circuits · CPC title

• H01Q5/335

  at the feed, e.g. for impedance matching · CPC title

• H01Q9/0485

  Dielectric resonator antennas · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title

• H01Q1/243

  with built-in antennas · CPC title