Stretchable 3D-printed circuit boards

Patent metadata

Field	Value
Publication number	US-11856708-B2
Application number	US-202217699446-A
Country	US
Kind code	B2
Filing date	Mar 21, 2022
Priority date	Mar 22, 2021
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

Disclosed herein are devices comprising stretchable 3D circuits and methods for fabricating the circuits. The fabrication process includes providing in the elastomeric polymer as a substrate and providing conductive interconnects within the substrate encased in an insulating polymer, such as polyimide, to provide a stiffness gradient between the conductive interconnects and the flexible elastomeric substrate. The circuit may be fabricated as a multilayer construction using three-dimensional pillars as vias and as external interconnects to the circuit.

First claim

The invention claimed is:

1. A method of fabricating a stretchable circuit comprising:
encasing one or more conductive interconnects of the circuit in an insulating polymer to form an interconnect layer; and
encasing the interconnect layer in an elastomeric material;
wherein the circuit comprises multiple interconnect layers connected by pillars composed of a conductive material forming vias between the interconnect layers and through the intervening elastomeric material.

2. The method of claim 1 wherein the insulating polymer and the conductive interconnects are deposited via an aerosol-jet printing process.

3. The method of claim 2 wherein the conductive interconnects are deposited in nano-particle form via an aerosol-jet printing process and are thereafter sintered to form a solid mass.

4. The method of claim 1 wherein the elastomeric material is deposited via a spin coating process.

5. The method of claim 4 wherein the elastomeric material is annealed after depositing.

6. The method of claim 1 wherein the elastomeric material is PDMS.

7. The method of claim 1 wherein the insulating polymer is polyimide.

8. The method of claim 1 wherein creating an interconnect layer encased in elastomeric material comprises:
providing a substrate coated with a sacrificial layer; and
fabricating the plurality of layers of the circuit on the sacrificial layer, wherein fabrication of each layer of the circuit comprises:
depositing a first layer of the elastomeric material on the sacrificial layer;
depositing a first layer of an insulating polymer on the first layer of elastomeric material;
depositing one or more conductive interconnects on the first layer of the insulating polymer;
depositing a second layer of the insulating polymer over the conductive interconnects; and
depositing a second layer of the elastomeric material over the second layer of the insulating polymer;
wherein the second layer of elastomeric material acts as the first layer of elastomeric material for a next highest interconnect layer in the stack.

9. The method of claim 8 further comprising:
depositing one or more pillars of conductive material in contact with the conductive interconnects in the interconnect layer, the one or more pillars extending through the second layer of elastomeric material; and
trimming the second layer of elastomeric material to expose a top portion of the one or more pillars.

10. The method of claim 9 wherein one or more portions of the conductive interconnects form a pad on which the one or more pillars are deposited.

11. The method of claim 10 further comprising:
depositing one or more conductive interconnects on an upper layer connected to the exposed top portion of the one or more pillars.

12. The method of claim 8 where the conductive interconnects are deposited in a meandering pattern.

13. The method of claim 9 wherein the one or more pillars are hollow.

14. The method of claim 13 wherein the one or more hollow pillars are in the shape of a cylinder or a frustum.

15. The method of claim 9 wherein the one or more hollow pillars are back filled with polyimide.

16. The method of claim 9 wherein the one or more pillars are in the shape of a fluted cylinder.

17. The method of claim 9 wherein the one or more pillars are generally cone-shaped.

18. The method of claim 9 further comprising:
removing the sacrificial layer to release the stretchable circuit from the substrate.

19. The method of claim 18 wherein the sacrificial layer is composed of polyacrylic acid and further wherein the removing step comprises:
exposing the sacrificial layer to a saltwater solution.

20. The method of claim 8 wherein the elastomeric material is deposited by a spin coating process.

21. The method of claim 8 wherein the elastomeric material is PDMS.

22. The method of claim 8 wherein the insulating polymer is polyimide.

23. The method of claim 8 wherein each layer of the insulating polymer is deposited by an aerosol-jet printing process.

24. The method of claim 8 wherein the conductive interconnects are deposited in nano-particle form via an aerosol-jet printing process, the method further comprising:
sintering the conductive interconnects.

25. The method of claim 24 wherein the sintering process comprises:
exposing the circuit to an intermediate temperature in an ambient environment with oxygen for a predetermined period of time;
placing the circuit in a vacuum; and
raising the temperature to a sintering temperature appropriate for the material of which the conductive interconnects are composed.

26. The method of claim 25 wherein the intermediate temperature is approximately 150° C. and the predetermined period of time is approximately 15 minutes.

27. The method of claim 25 wherein the conductive interconnects are composed of silver and further wherein the sintering temperature is in the range of 200° C. to 300° C.

28. The method of claim 8 further comprising:
exposing the circuit to an intermediate drying step after the second layer of the insulating polymer has been deposited.

29. The method of claim 28 wherein the intermediate drying step occurs at approximately 150° C. for approximately 15 minutes.

30. The method of claim 8 wherein the conductive interconnects and the pillars are composed of a material selected from a group comprising: silver, gold, platinum, copper, nickel and conductive polymers.

31. The method of claim 8 further comprising:
forming one or more pads connected to at least one of the conductive interconnects; and
connecting a component of the circuit to one or more of the pads.

32. The method of claim 31 wherein the one or more pads are hollow, further comprising:
filling the hollow of the pads with a solder compound; and
melting the solder to connect a component of the circuit to one or more of the pads.

33. The method of claim 32 further comprising:
covering components of the circuit with a layer of the elastomeric material.

34. The method of claim 33 wherein the elastomeric material is infused with a polymer having a stiffness greater than the elastomeric material in areas where the elastomeric material covers the components of the circuit.

35. The method of claim 32 further comprising:
covering the components of the circuit with the insulating polymer; and
covering the insulating polymer with a layer of the elastomeric material.

36. The method of claim 35 wherein the elastomeric material is infused with polymer having a stiffness greater than the elastomeric material in areas where the elastomeric material covers the components of the circuit.

37. The method of claim 1 wherein creating an interconnect layer encased in elastomeric material comprises:
providing a substrate coated with a sacrificial layer;
depositing one or more conductive pillars on the sacrificial layer;
depositing a first layer of the elastomeric material over the sacrificial layer and the conductive pillars; and
fabricating one or more additional interconnect layers of the circuit, wherein fabrication of each additional interconnect layer of the circuit comprises:
trimming a top portion of the elastomeric material from the interconne

Assignees

• Univ Carnegie Mellon

Inventors

• Fedder Gary K
• Panat Rahul
• Brenneman Jacob
• Tansel Derya Z

Classifications

• H05K3/0064 Primary

  onto a polymeric substrate · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K3/40

  Forming printed elements for providing electric connections to or between printed circuits · CPC title

• H05K1/0283 Primary

  Stretchable printed circuits · CPC title

• H05K3/4682

  Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil · CPC title