Systems and methods for cobalt metalization

Patent metadata

Field	Value
Publication number	US-11854876-B2
Application number	US-202017110709-A
Country	US
Kind code	B2
Filing date	Dec 3, 2020
Priority date	Dec 20, 2019
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

Systems and methods are described for depositing a TiN liner layer and a cobalt seed layer on a semiconductor wafer in a cobalt metallization process. In some embodiments the wafer is cooled after deposition of the TiN liner layer and/or the cobalt seed layer. In some embodiments the TiN liner layer and cobalt seed layer are deposited in process modules that are part of a semiconductor processing apparatus that also includes one or more modules for cooling the substrate. In some embodiments the cobalt seed layer may comprise a mixture of TiN and cobalt, a nanolaminate of TiN and cobalt layers or a graded TiN/Co layer.

First claim

What is claimed is:

1. A method of cobalt metallization comprising:
depositing a TiN liner layer on a three-dimensional feature on a wafer by atomic layer deposition at a first deposition temperature in a first deposition process module;
cooling the wafer to a temperature below the first deposition temperature;
moving the wafer to a second deposition process module;
depositing a cobalt seed layer directly over and contacting the TiN liner layer by atomic layer deposition at a second deposition temperature in the second deposition process module; and
depositing cobalt over the cobalt seed layer by plating.

2. The method of claim 1 , wherein cooling the wafer to a temperature below the first deposition temperature comprises moving the wafer to a cooling module.

3. The method of claim 1 , wherein cooling the wafer to a temperature below the first deposition temperature comprises placing the wafer on a cooling stage.

4. The method of claim 1 , additionally comprising cooling the wafer to a temperature below the second deposition temperature after depositing the cobalt seed layer and prior to depositing cobalt over the cobalt seed layer by plating.

5. The method of claim 4 , wherein cooling the wafer to a temperature below the second deposition temperature comprises moving the wafer to a cooling module.

6. The method of claim 1 , wherein the first deposition process module and the second deposition process module are the same.

7. The method of claim 1 , wherein the cobalt seed layer comprises a mixture of cobalt and TiN.

8. The method of claim 7 , wherein the cobalt seed layer additionally comprises a cobalt layer over the mixture of cobalt and TiN.

9. The method of claim 1 , wherein the cobalt seed layer comprises a nanolaminate of TiN and cobalt layers.

10. The method of claim 9 , wherein the cobalt seed layer additionally comprises a cobalt layer over the nanolaminate.

11. The method of claim 1 , wherein the cobalt seed layer comprises a graded layer of TiN and cobalt.

12. The method of claim 11 , wherein the graded layer comprises an increasing concentration of cobalt from an interface with the underlying TiN liner layer to the upper surface of the graded layer.

13. The method of claim 1 , additionally comprising exposing the substrate to TiCl 4 after depositing the TiN liner layer and prior to depositing the cobalt seed layer.

Assignees

• Asm Ip Holding Bv

Inventors

• Zhu chiyu
• Iwashita Shinya
• Maes Jan Willem
• Kim Jiyeon

Classifications

• H10W20/4437

  the principal metal being a transition metal · CPC title

• H10P72/0454

  surrounding a central transfer chamber · CPC title

• H10W20/0526

  by thermal treatment thereof · CPC title

• H10W20/4403

  based on metals, e.g. alloys, metal silicides (H10W20/4484 takes precedence) · CPC title

• H10W20/043

  for electroplating · CPC title