Displacement control device for seismic events

Patent metadata

Field	Value
Publication number	US-11852291-B2
Application number	US-202217678434-A
Country	US
Kind code	B2
Filing date	Feb 23, 2022
Priority date	Feb 23, 2022
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

A support platform is configured to support at least a portion of the weight of an associated semiconductor manufacturing tool, such as a furnace, when the associated semiconductor manufacturing tool is disposed on the support platform. The support platform comprises a base, a support plate disposed on the base and configured to move respective to the base, a brake plate arranged in fixed position respective to the base, and a damper secured to one of the support plate or the brake plate and frictionally engaging a track of the other of the support plate or the brake plate. The track includes a central track portion and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion. The inclined track portions are each inclined with respect to the central track portion.

First claim

What is claimed is:

1. A support platform configured to support at least a portion of the weight of an associated semiconductor manufacturing tool when the associated semiconductor manufacturing tool is disposed on the support platform, the support platform comprising:
a base;
a support plate disposed on the base and configured to move respective to the base;
a brake plate located on a side of the support plate and arranged in fixed position respective to the base; and
a damper secured to one of the support plate or the brake plate and frictionally engaging a track of the other of the support plate or the brake plate;
wherein:
the track includes a central track portion and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion, and
the inclined track portions are each inclined with respect to the central track portion.

2. The support platform of claim 1 wherein an inclination of each inclined track portion is effective to increase frictional force between the damper and the track with increasing distance of the damper away from the central track portion.

3. The support platform of claim 1 wherein the central track portion is a planar surface and each of the inclined track portions is a planar surface.

4. The support platform of claim 3 wherein each of the inclined track portions is inclined at an angle of 5 degrees or less with respect to the central track portion.

5. The support platform of claim 3 wherein the damper has a surface including:
a central surface portion, and
an inclined surface portion extending away from the central surface portion,
wherein the inclined surface portion is inclined with respect to the central surface portion.

6. The support platform of claim 5 wherein the inclined surface portion is inclined at an angle of 5 degrees or less with respect to the central surface portion.

7. The support platform of claim 1 wherein the damper is secured to the support plate and frictionally engages the track of the brake plate.

8. The support platform of claim 1 further comprising:
a second support plate disposed on the support plate and configured to move respective to the support plate orthogonally to the movement of the support plate;
a second brake plate arranged in fixed position respective to the support plate; and
a second damper secured to one of the second support plate or the second brake plate and frictionally engaging a second track of the other of the second support plate or the second brake plate;
wherein:
the second track includes a central second track portion and inclined second track portions extending away from the central second track portion on respective first and opposite second sides of the central second track portion, and
the inclined second track portions are each inclined with respect to the central second track portion.

9. A semiconductor manufacturing tool installation comprising:
the support platform of claim 1 ; and
a semiconductor manufacturing tool disposed on the support platform.

10. The semiconductor manufacturing tool installation of claim 9 wherein the semiconductor manufacturing tool comprises a furnace.

11. A displacement control assembly comprising:
a brake plate;
a horizontal support plate movable respective to the brake plate in a displacement direction, wherein the brake plate is located on a side of the horizontal support plate; and
a damper secured to one of the horizontal support plate or the brake plate and frictionally engaging a track of the other of the horizontal support plate or the brake plate;
wherein the track includes a central track portion and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion, the inclined track portions each being inclined with respect to the central track portion to increase frictional force between the damper and the track with increasing distance of the damper away from the central track portion.

12. The support platform of claim 11 wherein the central track portion is a planar surface and each of the inclined track portions is a planar surface.

13. The support platform of claim 12 wherein each of the inclined track portions is inclined at an angle of 5 degrees or less with respect to the central track portion.

14. The support platform of claim 12 wherein the damper has a surface including:
a central surface portion, and
an inclined surface portion extending away from the central surface portion,
wherein the inclined surface portion is inclined with respect to the central surface portion.

15. The support platform of claim 14 wherein the inclined surface portion is inclined at an angle of 5 degrees or less with respect to the central surface portion.

16. A semiconductor manufacturing tool installation comprising:
a semiconductor manufacturing tool; and
a support platform supporting the semiconductor manufacturing tool, the support platform including displacement control assemblies for controlling displacement of the semiconductor manufacturing tool in respective X- and Y-directions, wherein each displacement control assembly includes:
a brake plate;
a support plate bearing at least a portion of the weight of the semiconductor manufacturing tool and movable respective to the brake plate, wherein the brake plate is located on a side of the support plate; and
a damper secured to one of the support plate or the brake plate and frictionally engaging a track of the other of the support plate or the brake plate;
wherein the track includes a central track portion and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion, the inclined track portions each being inclined with respect to the central track portion.

17. The semiconductor manufacturing tool installation of claim 16 wherein the inclined track portions are each inclined with respect to the central track portion to increase frictional force between the damper and the track with increasing distance of the damper away from the central track portion.

18. The semiconductor manufacturing tool installation of claim 16 wherein the central track portion is a planar surface and each of the inclined track portions is a planar surface.

19. The semiconductor manufacturing tool installation of claim 18 wherein the damper has a surface including:
a central surface portion, and
an inclined surface portion extending away from the central surface portion,
wherein the inclined surface portion is inclined with respect to the central surface portion.

20. The semiconductor manufacturing tool installation of claim 16 wherein the semiconductor manufacturing tool is a furnace.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chiang Chuan-Chieh
• Hsu Chun-Jung

Classifications

• H10P72/0434 Primary

  mainly by convection · CPC title

• F16M9/00 Primary

  Special layout of foundations with respect to machinery to be supported (foundations for machinery E02D27/44) · CPC title

• H01L21/67109

  Electricity · mapped topic

• F27B17/0025

  specially adapted for treating semiconductor wafers · CPC title