Wave solder pallets for optimal solder flow and methods of manufacturing

Patent metadata

Field	Value
Publication number	US-11850684-B2
Application number	US-202016787177-A
Country	US
Kind code	B2
Filing date	Feb 11, 2020
Priority date	Nov 8, 2016
Publication date	Dec 26, 2023
Grant date	Dec 26, 2023

Abstract

A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

First claim

What is claimed is:

1. A method of manufacturing a printed circuit board assembly, the method comprising:
providing a circuit board;
determining a solder flow for the circuit board;
supporting the circuit board on a pallet, the pallet including an inner body comprising at least one opening for receiving solder flow and geometries to achieve the determined solder flow,
the geometries of the inner body including one or more of tunnels in fluid communication with a lower surface of the pallet and the at least one opening, a plurality of channels defined through the lower surface of the pallet and in fluid communication with the at least one opening, at least one ramp seated within a recess defined within the inner body, wherein the at least one ramp is in fluid communication with the at least one opening;
positioning a plurality of components on the circuit board, the plurality of components including a plurality of lead pins extending through the circuit board and protruding from an underside of the circuit board and at least partially through the at least one opening defined within the pallet; and
passing the pallet through a wave solder machine such that molten solder contacts the pallet and the geometries of the pallet control the molten solder to flow according to the determined solder flow to establish connections between the plurality of lead pins.

2. The method according to claim 1 , wherein the solder flow is determined at least in part based upon microfluidics of solder flow.

3. The method according to claim 1 , wherein the solder flow is determined based upon speed, acceleration, volume, and direction of solder flow.

4. The method according to claim 1 , wherein the channel interconnects at least two openings defined through the pallet.

5. The method according to claim 1 , wherein the geometries of the pallet include at least one ramp configured to be an adjustable component or a replaceable component feeding into one or more of the at least one openings.

Assignees

• Flex Ltd

Inventors

• Mehkri Zohair
• Mohammed Anwar
• Tan Jesus
• Geiger David
• Kurwa Murad

Classifications

• B23K3/08 Primary

  Auxiliary devices therefor · CPC title

• B23K1/085

  Wave soldering · CPC title

• B23K3/0653

  with wave generating means, e.g. nozzles, jets, fountains · CPC title

• B23K3/087

  Soldering or brazing jigs, fixtures or clamping means · CPC title

• B29C64/106

  using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material · CPC title