Semiconductor chamber component cleaning systems

Patent metadata

Field	Value
Publication number	US-11848218-B2
Application number	US-202017077711-A
Country	US
Kind code	B2
Filing date	Oct 22, 2020
Priority date	Oct 22, 2020
Publication date	Dec 19, 2023
Grant date	Dec 19, 2023

Abstract

Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

First claim

The invention claimed is:

1. A semiconductor chamber component cleaning system comprising:
a receptacle comprising:
a bottom lid comprising an annulus, wherein the annulus is characterized by an inner annular wall and an outer annular wall, and wherein a plurality of recessed annular ledges are defined between the inner annular wall and the outer annular wall, each recessed annular ledge of the plurality of recessed annular ledges formed at a different radial position along the bottom lid, and
a top lid removably coupled with the bottom lid about an exterior region of the top lid; and

a tank defining a volume to receive the receptacle.

2. The semiconductor chamber component cleaning system of claim 1 , wherein the receptacle further comprises:
a plurality of flexible seals, each seal of the plurality of flexible seals positioned along an associated recessed annular ledge of the plurality of recessed annular ledges; and
a hermetic seal disposed between the bottom lid and the top lid.

3. The semiconductor chamber component cleaning system of claim 1 , wherein the top lid further defines a plurality of apertures within an interior region of the top lid, the plurality of apertures including a central aperture defined through the top lid, wherein the receptacle further comprises:
one or more studs extending through one or more apertures of the plurality of apertures defined within the top lid, the one or more apertures of the plurality of apertures separate from the central aperture defined through the top lid.

4. The semiconductor chamber component cleaning system of claim 1 , wherein the bottom lid comprises a plurality of holders extending from the bottom lid, the semiconductor chamber component cleaning system further comprising:
a mounting beam extending across the tank, wherein the mounting beam comprises a plurality of arms coupling the plurality of holders with the mounting beam.

5. The semiconductor chamber component cleaning system of claim 1 , wherein the tank comprises a cleaning tank defining a plurality of sections, wherein the cleaning tank includes one or more walls fluidly separating the plurality of sections, the plurality of sections comprising:
a cleaning section configured to receive the receptacle,
a delivery section, and
an overflow section.

6. The semiconductor chamber component cleaning system of claim 5 , further comprising:
a fluid delivery system comprising:
a fluid delivery pump, and
a filtration tank; and

a fluid testing system comprising:
a sampling tank, and
a liquid particle counter.

7. The semiconductor chamber component cleaning system of claim 6 , further comprising:
pump piping coupling the fluid delivery pump with each of the cleaning section, the delivery section, and the overflow section of the cleaning tank.

8. The semiconductor chamber component cleaning system of claim 6 , further comprising:
filtration receiving piping coupling the filtration tank with each of the cleaning section and the overflow section of the cleaning tank; and
filtration delivery piping coupling the filtration tank with each of the cleaning section and the delivery section of the cleaning tank.

9. The semiconductor chamber component cleaning system of claim 6 , further comprising:
a set of valves operable to configure the fluid delivery system in a push delivery fluid setup and a pull delivery fluid setup.

10. The semiconductor chamber component cleaning system of claim 6 , wherein a receiving line of the sampling tank is fluidly coupled with the cleaning section of the cleaning tank both fluidly upstream and fluidly downstream from a position of the receptacle when incorporated within the cleaning tank.

11. The semiconductor chamber component cleaning system of claim 10 , wherein a delivery line of the sampling tank is fluidly coupled with the overflow section of the cleaning tank.

Assignees

• Applied Materials Inc

Inventors

• Guyomard Katty
• Ramalingam Chidambara A
• Jafari Shawyon
• Joshi Palash
• Khan Moin Ahmed
• Shanmugam Kirubanandan Naina
• Salkod Subhaschandra Shreepad
• Ghosh Avishek
• Groechel David W
• Wu Li
• Buechel-Rimmel Dorothea

Classifications

• H10P72/0416 Primary

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title