Magnetic component and power module

US11848128B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11848128-B2
Application numberUS-202017023394-A
CountryUS
Kind codeB2
Filing dateSep 17, 2020
Priority dateOct 12, 2019
Publication dateDec 19, 2023
Grant dateDec 19, 2023

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides a magnetic component and a power module, relating to the technical field of power electronics; the magnetic component provided by the present disclosure includes: a first heat sink, a magnetic core extending in a transverse direction and a winding structure wound on the magnetic core, the winding structure includes at least a first coil and a second coil arranged adjacently along the transverse direction, a gap is provided between the first coil and the second coil, at least part of the first heat sink is arranged in the gap, the first heat sink is in thermal contact with the first coil, the second coil and the magnetic core.

First claim

Opening claim text (preview).

What is claimed is: 1. A magnetic component, comprising a first heat sink, a magnetic core extending in a transverse direction and a winding structure wound on the magnetic core; wherein the winding structure at least comprises a first coil and a second coil arranged adjacently along the transverse direction, a gap is provided between the first coil and the second coil, at least part of the first heat sink is arranged in the gap, the first heat sink is in thermal contact with the first coil, the second coil and the magnetic core; wherein the first heat sink is in direct contact with the first coil, the second coil and the magnetic core, or the first heat sink is in indirect contact with the first coil, the second coil and the magnetic core through a first thermally conductive adhesive; wherein the first heat sink comprises a heat conducting portion extending in a vertical direction from a top of the magnetic core towards a bottom of the magnetic core, and the heat conducting portion covers at least part of the magnetic core; and the magnetic component further comprising two second heat sinks that are U-shaped or L-shaped, one of the second heat sinks is inserted between the magnetic core and the first coil along the transverse direction, and the other second heat sink is inserted between the magnetic core and the second coil along the transverse direction. 2. The magnetic component according to claim 1 , wherein the first heat sink further comprises an extending portion that is connected with the heat conducting portion, the extending portion extends along the transverse direction, and the extending portion is in thermal contact with at least part of an outer surface of at least one of the first coil and the second coil. 3. The magnetic component according to claim 1 , wherein the first heat sink comprises a metal material with a thermal conductivity greater than or equal to 100 W/m·K; or the first heat sink comprises a non-metal material with a thermal conductivity greater than or equal to 20 W/m·K. 4. The magnetic component according to claim 1 , wherein the magnetic core comprises two U-shaped magnetic core structures, and the two U-shaped magnetic core structures are configured to form a closed magnetic path. 5. The magnetic component according to claim 1 , wherein the second heat sink is in thermal contact with a surface of the magnetic core through a second thermally conductive adhesive; wherein the second heat sink comprises a metal material with a thermal conductivity greater than or equal to 100 W/m·K; or the second heat sink comprises a non-metal material with a thermal conductivity greater than or equal to 20 W/m·K. 6. The magnetic component according to claim 1 , wherein the magnetic component further comprises a bobbin sleeved on an outer circumference of the magnetic core, and the winding structure is wound on the bobbin; wherein the bobbin is an integrated structure, and the first coil and the second coil are wound on the bobbin, and the bobbin has a hollow structure at a position corresponding to the gap; or, the bobbin comprises a first bobbin structure and a second bobbin structure that are separated from each other, the first winding is wound on the first bobbin structure, the second winding is wound on the second bobbin structure, the first bobbin structure and the second bobbin structure are separated by a distance, and opposed surfaces of the first bobbin structure and the second bobbin structure have hollow structures; wherein the hollow structure is the opening of the bobbin in which the first heat sink is inserted, the hollow structure is connected with the gap.

Assignees

Inventors

Classifications

  • H01F27/22Primary

    Cooling by heat conduction through solid or powdered fillings · CPC title

  • Circuits or methods for driving the primary coil, e.g. supplying electric power to the coil · CPC title

  • Magnetic cores · CPC title

  • Coil bobbins (formers for coils in general H01F5/02) · CPC title

  • Cooling (cooling transformers and inductances in general H01F27/08) · CPC title

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Frequently asked questions

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What does patent US11848128B2 cover?
The present disclosure provides a magnetic component and a power module, relating to the technical field of power electronics; the magnetic component provided by the present disclosure includes: a first heat sink, a magnetic core extending in a transverse direction and a winding structure wound on the magnetic core, the winding structure includes at least a first coil and a second coil arranged…
Who is the assignee on this patent?
Delta Electronics Shanghai Co
What technology area does this patent fall under?
Primary CPC classification H01F27/22. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).