Method and wet chemical compositions for diffusion barrier formation

Patent metadata

Field	Value
Publication number	US-11846018-B2
Application number	US-202217665871-A
Country	US
Kind code	B2
Filing date	Feb 7, 2022
Priority date	Feb 8, 2021
Publication date	Dec 19, 2023
Grant date	Dec 19, 2023

Abstract

A method of forming a diffusion barrier layer on a dielectric or semiconductor substrate by a wet process. The method includes the steps of treating the dielectric or semiconductor substrate with an aqueous pretreatment solution comprising one or more adsorption promoting ingredients capable of preparing the substrate for deposition of the diffusion barrier layer thereon; and contacting the treated dielectric or semiconductor substrate with a deposition solution comprising manganese compounds and an inorganic pH buffer (optionally, with one or more doping metals) to the diffusion barrier layer thereon, wherein the diffusion barrier layer comprises manganese oxide. Also included is a two-part kit for treating a dielectric or semiconductor substrate to form a diffusion barrier layer thereon.

First claim

What is claimed is:

1. A two-part kit for treating a dielectric or semiconductor substrate to form a diffusion barrier layer thereon, the kit comprising:
a. an aqueous pretreatment solution comprising one or more adsorption promoting ingredients capable of preparing the substrate for manganese oxide deposition thereon; and
b. a manganese deposition solution, the manganese deposition solution comprising a manganese compound and an inorganic pH buffer.

2. The kit according to claim 1 , wherein the adsorption promoting ingredients comprise one or more nitrogen, silicon, and/or carbon-based cationic polymers or oligomers.

3. The kit according to claim 1 , wherein the aqueous pretreatment solution comprises one or more additional ingredients, wherein the one or more additional ingredients are selected from the group consisting of alkalinity agents, adsorption enhancers, adhesion promoters, dispersants, emulsifier, coupling agents, surfactants, sources of copper, sources of chloride, and combinations of the foregoing.

4. The kit according to claim 1 , wherein the manganese deposition solution comprises a doping metal along with manganese to enhance the adhesion, continuity and uniformity of the manganese oxide film, wherein co-deposited doping metal comprises one or more metals selected from the group consisting of zinc, cobalt, nickel, chromium, molybdenum, tungsten, rhenium, palladium, rhodium, platinum, iridium, osmium, ruthenium, titanium, zirconium, tantalum, magnesium, and combinations of one or more of the foregoing.

5. The kit according to claim 3 , wherein the one or more additional ingredients in the aqueous pretreatment solution comprises an alkalinity agent, wherein the alkalinity agent is selected from the group consisting of alkanolamines, alkali metal hydroxides, alkali metal carbonates, alkali metal borates, alkali metal oxides, ethanolamines, carbonates, and combinations of one or more of the foregoing.

6. The kit according to claim 3 , wherein the one or more additional ingredients in the aqueous pretreatment solution comprises an adsorption enhancer, wherein the adsorption enhancer comprises an alkanolamine selected from the group consisting of triethanolamine, diethanolamine, monoethanolamine, 3-amino-1-propanol, amino-2-propanol, and combinations of one or more of the foregoing.

7. The kit according to claim 3 , wherein the one or more additional ingredients in the aqueous pretreatment solution comprises a surfactant, wherein the surfactant comprises a polyoxyalkylene alkylether.

8. The kit according to claim 3 , wherein the one or more additional ingredients in the aqueous pretreatment solution comprises a source of copper, wherein the source of copper comprises copper sulfate pentahydrate.

9. The kit according to claim 3 , wherein the one or more additional ingredients in the aqueous pretreatment solution comprises a source of chloride, wherein the source of chloride is selected from the group consisting of sodium chloride, potassium chloride, ammonium chloride, magnesium chloride, cupric chloride, and combinations of one or more of the foregoing.

Assignees

• Macdermid Enthone Inc

Inventors

• Hurtubise Richard W
• Yakobson Eric
• Sun Shaopeng
• Wilkins Taylor L
• Najjar Elie H
• Shao Wenbo

Classifications

• H10W20/0552

  by diffusing metallic dopants to react with dielectrics · CPC title

• H10W20/425

  Barrier, adhesion or liner layers · CPC title

• H10W20/076

  in via holes or trenches · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P14/6342 Primary

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title